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    • 5. 发明授权
    • Plasma CVD process
    • 等离子体CVD工艺
    • US06333079B1
    • 2001-12-25
    • US09874251
    • 2001-06-06
    • Satoshi TakakiKoji Teranishi
    • Satoshi TakakiKoji Teranishi
    • H05H124
    • H01J37/32174C23C16/509H01J37/32082
    • In a plasma CVD system comprises a reactor the inside of which can be evacuated, a substrate holding means provided in the reactor, a material gas feed means for feeding into the reactor a material gas for plasma CVD, a high-frequency power supply means for supplying to a plasma-producing high-frequency electrode a high-frequency power having an oscillation frequency in the range of from 30 MHz to 600 MHz, generated by a high-frequency power source, and an exhaust means for exhausting a gas remaining in the reactor after the reaction; the high-frequency power generated in the high-frequency power source being supplied to the plasma-producing high-frequency electrode to cause a plasma to take place across a substrate held by the substrate holding means and the plasma-producing high-frequency electrode to form a deposited film on the substrate; the phase of reflected power is adjusted on the plasma-producing high-frequency electrode at its part on the opposite side of the feeding point. High-quality deposited films having a very uniform film thickness and a homogeneous film quality can be formed at a high rate and stably on large-area substrates having any shapes, to obtain semiconductor devices in a good efficiency.
    • 在等离子体CVD系统中,包括其内部可被抽真空的反应器,设置在反应器中的基板保持装置,用于向反应器供应用于等离子体CVD的原料气体的材料气体供给装置,用于 向等离子体产生高频电极供给具有由高频电源产生的振荡频率在30MHz至600MHz范围内的高频功率;以及排气装置,用于排出残留在所述高频电源中的气体 反应后反应; 在高频电源中产生的高频电力被供给到等离子体产生高频电极,以使等离子体在由基板保持装置和等离子体产生高频电极保持的基板上发生, 在基板上形成沉积膜;在等离子体产生高频电极的馈电点相对侧的部分调整反射功率的相位。 可以在具有任何形状的大面积基板上以高速率和稳定地形成具有非常均匀的膜厚度和均匀膜质量的高质量沉积膜,从而以高效率获得半导体器件。
    • 9. 发明授权
    • Reactive sputtering method
    • 反应溅射法
    • US07575661B2
    • 2009-08-18
    • US10898956
    • 2004-07-27
    • Yasuyuki SuzukiKoji Teranishi
    • Yasuyuki SuzukiKoji Teranishi
    • C23C14/35
    • H01J37/3485C23C14/0057C23C14/0068C23C14/0694C23C14/35F02D41/1456H01J37/3405Y02T50/67
    • In a reactive sputtering apparatus, an inert-gas supplying hole is provided in a movable target unit whose one end is open and whose conductance is controlled, and a reactive gas containing at least fluorine or oxygen can be supplied to a space between the target and a substrate. The apparatus is constructed so as to emit the reactive gas toward the substrate. A reactive-gas emitting location is in the space between the target and the substrate such that a concentration of the reactive gas on the substrate surface can be maintained at a higher level. When the target is moved, a reactive-gas emitting port is moved or the reactive-gas emitting location is changed. The concentration of the reactive gas on the substrate surface can be effectively kept constant, and a high-quality optical thin film can be formed.
    • 在反应性溅射装置中,惰性气体供给孔设置在其一端敞开并且其电导被控制的可动目标单元中,并且至少含有氟或氧的反应性气体可以供应到靶和 底物。 该装置被构造成朝向基板发射反应性气体。 反应气体发射位置在靶和衬底之间的空间中,使得衬底表面上的反应气体的浓度可以保持在更高的水平。 当目标移动时,移动反应气体发射端口或改变反应气体发射位置。 可以有效地保持基板表面上的反应气体的浓度恒定,并且可以形成高质量的光学薄膜。
    • 10. 发明申请
    • REACTIVE SPUTTERING METHOD
    • 反应溅射法
    • US20090200159A1
    • 2009-08-13
    • US12415259
    • 2009-03-31
    • Yasuyuki SuzukiKoji Teranishi
    • Yasuyuki SuzukiKoji Teranishi
    • C23C14/34
    • H01J37/3485C23C14/0057C23C14/0068C23C14/0694C23C14/35F02D41/1456H01J37/3405Y02T50/67
    • In a reactive sputtering apparatus, an inert-gas supplying hole is provided in a movable target unit whose one end is open and whose conductance is controlled, and a reactive gas containing at least fluorine or oxygen can be supplied to a space between the target and a substrate. The apparatus is constructed so as to emit the reactive gas toward the substrate. A reactive-gas emitting location is in the space between the target and the substrate such that a concentration of the reactive gas on the substrate surface can be maintained at a higher level. When the target is moved, a reactive-gas emitting port is moved or the reactive-gas emitting location is changed. The concentration of the reactive gas on the substrate surface can be effectively kept constant, and a high-quality optical thin film can be formed.
    • 在反应性溅射装置中,惰性气体供给孔设置在其一端敞开并且其电导被控制的可动目标单元中,并且至少含有氟或氧的反应性气体可以供应到靶和 底物。 该装置被构造成朝向基板发射反应性气体。 反应气体发射位置在靶和衬底之间的空间中,使得衬底表面上的反应气体的浓度可以保持在更高的水平。 当目标移动时,移动反应气体发射端口或改变反应气体发射位置。 可以有效地保持基板表面上的反应气体的浓度恒定,并且可以形成高质量的光学薄膜。