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    • 1. 发明申请
    • ELECTRONIC COMPONENT COVER AND ARRANGEMENT
    • 电子元件盖和布置
    • US20120224349A1
    • 2012-09-06
    • US13221761
    • 2011-08-30
    • Kevin ClancyKen FraynRobert Hertlein
    • Kevin ClancyKen FraynRobert Hertlein
    • H05K9/00H05K7/00
    • H05K5/0286G06K7/0021G06K7/0034G06K7/0082
    • An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
    • 电子部件盖包括具有适于基本上覆盖第一电子部件的至少一侧的第一区域的板。 板适于容纳其上的第二电子部件,例如SIM卡或SIM卡读卡器。 板可以包括用于容纳第二电子部件的第二区域。 电子部件盖可以包括适于在第一电子部件和第二电子部件之间提供电连通的一个或多个引线。 一个或多个引线与板电隔离。 盖可以进一步包括适于在其上容纳第二电子部件的非导电安装座。 非导电支架将一个或多个引线固定到板上,同时将一个或多个引线与板电隔离。
    • 2. 发明申请
    • Electronic Component Cover and Arrangement
    • 电子元件封面和布置
    • US20080318446A1
    • 2008-12-25
    • US11768166
    • 2007-06-25
    • Kevin ClancyKen KraynRobert Hertlein
    • Kevin ClancyKen KraynRobert Hertlein
    • H01R12/00H01R13/44
    • H05K5/0286G06K7/0021G06K7/0034G06K7/0082
    • An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
    • 电子部件盖包括具有适于基本上覆盖第一电子部件的至少一侧的第一区域的板。 板适于容纳其上的第二电子部件,例如SIM卡或SIM卡读卡器。 板可以包括用于容纳第二电子部件的第二区域。 电子部件盖可以包括适于在第一电子部件和第二电子部件之间提供电连通的一个或多个引线。 一个或多个引线与板电隔离。 盖可以进一步包括适于在其上容纳第二电子部件的非导电安装座。 非导电支架将一个或多个引线固定到板上,同时将一个或多个引线与板电隔离。
    • 7. 发明授权
    • Electronic component cover and arrangement
    • 电子元件盖和布置
    • US08009441B2
    • 2011-08-30
    • US12643987
    • 2009-12-21
    • Kevin ClancyKen FraynRobert Hertlein
    • Kevin ClancyKen FraynRobert Hertlein
    • H05K9/00
    • H05K5/0286G06K7/0021G06K7/0034G06K7/0082
    • An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
    • 电子部件盖包括具有适于基本上覆盖第一电子部件的至少一侧的第一区域的板。 板适于容纳其上的第二电子部件,例如SIM卡或SIM卡读卡器。 板可以包括用于容纳第二电子部件的第二区域。 电子部件盖可以包括适于在第一电子部件和第二电子部件之间提供电连通的一个或多个引线。 一个或多个引线与板电隔离。 盖可以进一步包括适于在其上容纳第二电子部件的非导电安装座。 非导电支架将一个或多个引线固定到板上,同时将一个或多个引线与板电隔离。
    • 8. 发明申请
    • ELECTRONIC COMPONENT COVER AND ARRANGEMENT
    • 电子元件盖和布置
    • US20100097774A1
    • 2010-04-22
    • US12643987
    • 2009-12-21
    • Kevin ClancyKen FraynRobert Hertlein
    • Kevin ClancyKen FraynRobert Hertlein
    • H05K7/00H05K9/00
    • H05K5/0286G06K7/0021G06K7/0034G06K7/0082
    • An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
    • 电子部件盖包括具有适于基本上覆盖第一电子部件的至少一侧的第一区域的板。 板适于容纳其上的第二电子部件,例如SIM卡或SIM卡读卡器。 板可以包括用于容纳第二电子部件的第二区域。 电子部件盖可以包括适于在第一电子部件和第二电子部件之间提供电连通的一个或多个引线。 一个或多个引线与板电隔离。 盖可以进一步包括适于在其上容纳第二电子部件的非导电安装座。 非导电支架将一个或多个引线固定到板上,同时将一个或多个引线与板电隔离。
    • 9. 发明授权
    • Electronic component cover and arrangement
    • 电子元件盖和布置
    • US07636245B2
    • 2009-12-22
    • US11768166
    • 2007-06-25
    • Kevin ClancyKen FraynRobert Hertlein
    • Kevin ClancyKen FraynRobert Hertlein
    • H05K9/00
    • H05K5/0286G06K7/0021G06K7/0034G06K7/0082
    • An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
    • 电子部件盖包括具有适于基本上覆盖第一电子部件的至少一侧的第一区域的板。 板适于容纳其上的第二电子部件,例如SIM卡或SIM卡读卡器。 板可以包括用于容纳第二电子部件的第二区域。 电子部件盖可以包括适于在第一电子部件和第二电子部件之间提供电连通的一个或多个引线。 一个或多个引线与板电隔离。 盖可以进一步包括适于在其上容纳第二电子部件的非导电安装座。 非导电支架将一个或多个引线固定到板上,同时将一个或多个引线与板电隔离。