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1. 发明申请

US20120049341A1 Semiconductor Package Structures Having Liquid Cooler Integrated with First Level Chip Package Modules 有权
标题翻译：具有与一级芯片封装模块集成的液体冷却器的半导体封装结构
公开(公告)号：US20120049341A1
公开(公告)日：2012-03-01
申请号：US13290824
申请日：2011-11-07
申请人： Raschid Jose Bezama , Evan George Colgan , Michael Gaynes , John Harold Magerlein , Kenneth C. Marston , Xiaojin Wei
发明人： Raschid Jose Bezama , Evan George Colgan , Michael Gaynes , John Harold Magerlein , Kenneth C. Marston , Xiaojin Wei
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L23/3675 , H01L23/49833 , H01L23/4985 , H01L2023/4043 , H01L2023/4087 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/10253 , H01L2924/15311 , H01L2924/19105 , H01L2924/00
摘要： Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.
摘要翻译：提供半导体封装结构，其被设计成具有与第一级芯片模块整体封装的液体冷却器。特别地，用于将第一级芯片封装结构中的液体冷却器装置整体封装的装置包括其中液体冷却器装置直接热耦合到安装在柔性芯片载体衬底上的集成电路芯片倒装芯片的背面的结构。液体冷却器装置通过金属加强结构机械耦合到封装基板，金属加强结构结合到柔性封装基板上，以向柔性封装基板提供机械刚性。

2. 发明授权

US07917328B2 Tracking thermal mini-cycle stress 失效
标题翻译：跟踪热微循环应力
公开(公告)号：US07917328B2
公开(公告)日：2011-03-29
申请号：US12194606
申请日：2008-08-20
申请人： Jon A. Casey , Michael S. Floyd , Soraya Ghiasi , Kenneth C. Marston , Jennifer V. Muncy , Malcom S. Ware , Roger D. Weekly
发明人： Jon A. Casey , Michael S. Floyd , Soraya Ghiasi , Kenneth C. Marston , Jennifer V. Muncy , Malcom S. Ware , Roger D. Weekly
IPC分类号： G06F19/00
CPC分类号： G06F11/3058
摘要： Monitoring temperature excursions an assembly experiences over a life of the assembly is provided. A determination is made as to whether the assembly has been in service beyond a predetermined end of life objective. Responsive to the assembly failing to be in service beyond the predetermined end of life objective, a new temperature value associated with the assembly is read. A modifier value for a figure of merit (FOM) value is computed and added to a cumulative figure of merit value. The cumulative figure of merit value is compared to a cumulative stress figure of merit budget. Responsive to the cumulative figure of merit value exceeding the cumulative stress figure of merit budget, an identified stress management solution is implemented.
摘要翻译：提供了组装过程中组装体验的温度偏移。确定组件是否已经超出预定寿命目标的使用。响应于组装不能超过预定寿命目标的服务，读取与组件相关联的新的温度值。计算品质因数（FOM）值的修饰符值，并将其添加到累积品质因数值。将累积的绩效值与累积压力的绩效预算进行比较。响应累积绩效值超过累积压力的绩效预算数量，实施了一个确定的压力管理解决方案。

3. 发明申请

US20100181665A1 System and Method of Achieving Mechanical and Thermal Stability in a Multi-Chip Package 有权
标题翻译：在多芯片封装中实现机械和热稳定性的系统和方法
公开(公告)号：US20100181665A1
公开(公告)日：2010-07-22
申请号：US12357716
申请日：2009-01-22
申请人： Jon A. CASEY , John S. CORBIN, JR. , David DANOVITCH , Isabelle DEPATIE , Virendra R. JADHAV , Roger A. LIPTAK , Kenneth C. MARSTON , Jennifer V. MUNCY , Sylvain OUIMET , Eric SALVAS
发明人： Jon A. CASEY , John S. CORBIN, JR. , David DANOVITCH , Isabelle DEPATIE , Virendra R. JADHAV , Roger A. LIPTAK , Kenneth C. MARSTON , Jennifer V. MUNCY , Sylvain OUIMET , Eric SALVAS
IPC分类号： H01L23/34 , H01L21/00 , H01L23/12 , H01L23/10
CPC分类号： H01L23/04 , H01L23/3675 , H01L23/42 , H01L23/433 , H01L24/28 , H01L24/31 , H01L25/0652 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/83192 , H01L2224/92225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01074 , H01L2924/01088 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/16152 , H01L2924/16251 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.
摘要翻译：一种用于在多芯片封装中实现机械和热稳定性的系统和方法系统。该系统采用盖子和多个热界面材料。该方法包括在多芯片封装上利用盖子，并在多芯片封装上利用多个热界面材料。

4. 发明申请

US20090283902A1 Semiconductor Package Structures Having Liquid Coolers Integrated with First Level Chip Package Modules 有权
标题翻译：具有与一级芯片封装模块集成的液体冷却器的半导体封装结构
公开(公告)号：US20090283902A1
公开(公告)日：2009-11-19
申请号：US12120029
申请日：2008-05-13
申请人： Raschid Jose Bezama , Evan George Colgan , Michael Gaynes , John Harold Magerlein , Kenneth C. Marston , Xiaojin Wei
发明人： Raschid Jose Bezama , Evan George Colgan , Michael Gaynes , John Harold Magerlein , Kenneth C. Marston , Xiaojin Wei
IPC分类号： H01L23/473
CPC分类号： H01L23/473 , H01L23/3675 , H01L23/49833 , H01L23/4985 , H01L2023/4043 , H01L2023/4087 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/10253 , H01L2924/15311 , H01L2924/19105 , H01L2924/00
摘要： Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.
摘要翻译：提供半导体封装结构，其被设计成具有与第一级芯片模块整体封装的液体冷却器。特别地，用于将第一级芯片封装结构中的液体冷却器装置整体封装的装置包括其中液体冷却器装置直接热耦合到安装在柔性芯片载体衬底上的集成电路芯片倒装芯片的背面的结构。液体冷却器装置通过金属加强结构机械耦合到封装基板，金属加强结构结合到柔性封装基板上，以向柔性封装基板提供机械刚性。

5. 发明授权

US07928562B2 Segmentation of a die stack for 3D packaging thermal management 有权
标题翻译：用于3D封装热管理的管芯堆叠的分段
公开(公告)号：US07928562B2
公开(公告)日：2011-04-19
申请号：US12177194
申请日：2008-07-22
申请人： Amilcar R. Arvelo , Evan G. Colgan , John H. Magerlein , Kenneth C. Marston , Kathryn C. Rivera , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jeffrey A. Zitz
发明人： Amilcar R. Arvelo , Evan G. Colgan , John H. Magerlein , Kenneth C. Marston , Kathryn C. Rivera , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jeffrey A. Zitz
IPC分类号： H01L23/36
CPC分类号： H01L23/3675 , H01L21/563 , H01L23/10 , H01L23/42 , H01L25/0652 , H01L25/18 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/00012 , H01L2224/0401 , H01L2924/00
摘要： An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.
摘要翻译：提供了一种用于减少在计算环境中使用的三维（3D）裸片堆栈的热惩罚的装置，并且包括安装在计算环境内的基板，执行计算环境的操作的第一部件，其耦合到所述基板在堆叠方向上，一组第二部件，用于执行所述计算环境的操作，每个部件耦合到所述第一部件并相对于彼此分割以形成空出的区域;布置在所述热界面材料（TIM）在第一和第二部件的暴露的表面上，以及包括突起的盖，其连接到基板以覆盖第一和第二部件，使得突起延伸到空出的区域中，并且使得盖和突起的表面热连通第一和第二组件通过TIM。

6. 发明授权

US07834442B2 Electronic package method and structure with cure-melt hierarchy 有权
标题翻译：电子封装方法和结构具有固化熔体层级
公开(公告)号：US07834442B2
公开(公告)日：2010-11-16
申请号：US11954943
申请日：2007-12-12
申请人： Bruce K Furman , Kenneth C Marston , Jiantao Zheng , Jeffrey A Zitz
发明人： Bruce K Furman , Kenneth C Marston , Jiantao Zheng , Jeffrey A Zitz
IPC分类号： H01L23/12
CPC分类号： H01L23/3737 , H01L23/04 , H01L23/10 , H01L23/3733 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01079 , H01L2924/16251 , H01L2924/3511
摘要： Disclosed herein are embodiments of electronic package incorporating a thermal interface material (e.g., a metal TIM) that is positioned between a lid and a chip on a substrate. The TIM has a predetermined (i.e., repeatable) minimum thickness and is further registered to the top surface of the chip (i.e., the TIM has an essentially symmetric shape and does not extend vertically along the sidewalls of the chip). Also, disclosed herein are embodiments of a method of forming such an electronic package that uses a hierarchical heating process that cures a lid sealant, thereby securing the lid to the substrate, and then reflows (i.e., melts and cools) the TIM, thereby adhering the TIM to both the chip and lid. This hierarchical heating process ensures that the TIM has the above-mentioned characteristics (i.e., a predetermined minimum thickness and registration to the top surface of the chip) and further provides robust process windows for high-yield, low-cost electronic package manufacturing.
摘要翻译：本文公开了包含位于盖和基板上的芯片之间的热界面材料（例如，金属TIM）的电子封装的实施例。 TIM具有预定的（即可重复的）最小厚度，并进一步与芯片的顶表面对准（即，TIM具有基本上对称的形状，并且不沿芯片的侧壁垂直延伸）。此外，本文公开了形成这样的电子封装的方法的实施例，其使用固化盖密封剂的分层加热工艺，从而将盖固定到基板上，然后使TIM的回流（即，熔化和冷却），从而粘附 TIM到芯片和盖子。这种分层加热工艺确保TIM具有上述特性（即，预定的最小厚度并且与芯片的顶表面对准），并且进一步提供用于高产量，低成本电子封装制造的稳健的工艺窗口。

7. 发明授权

US08772927B2 Semiconductor package structures having liquid cooler integrated with first level chip package modules 有权
标题翻译：具有与第一级芯片封装模块集成的液体冷却器的半导体封装结构
公开(公告)号：US08772927B2
公开(公告)日：2014-07-08
申请号：US13290824
申请日：2011-11-07
申请人： Raschid Jose Bezama , Evan George Colgan , Michael Gaynes , John Harold Magerlein , Kenneth C. Marston , Xiaojin Wei
发明人： Raschid Jose Bezama , Evan George Colgan , Michael Gaynes , John Harold Magerlein , Kenneth C. Marston , Xiaojin Wei
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L23/3675 , H01L23/49833 , H01L23/4985 , H01L2023/4043 , H01L2023/4087 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/10253 , H01L2924/15311 , H01L2924/19105 , H01L2924/00
摘要： Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.
摘要翻译：提供半导体封装结构，其被设计成具有与第一级芯片模块整体封装的液体冷却器。特别地，用于将第一级芯片封装结构中的液体冷却器装置整体封装的装置包括其中液体冷却器装置直接热耦合到安装在柔性芯片载体衬底上的集成电路芯片倒装芯片的背面的结构。液体冷却器装置通过金属加强结构机械耦合到封装基板，金属加强结构结合到柔性封装基板上，以向柔性封装基板提供机械刚性。

8. 发明申请

US20100019377A1 SEGMENTATION OF A DIE STACK FOR 3D PACKAGING THERMAL MANAGEMENT 有权
标题翻译： 3D封装热管理模块的分段
公开(公告)号：US20100019377A1
公开(公告)日：2010-01-28
申请号：US12177194
申请日：2008-07-22
申请人： Amilcar R. Arvelo , Evan G. Colgan , John H. Magerlein , Kenneth C. Marston , Kathryn C. Rivera , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jeffrey A. Zitz
发明人： Amilcar R. Arvelo , Evan G. Colgan , John H. Magerlein , Kenneth C. Marston , Kathryn C. Rivera , Kamal K. Sikka , Jamil A. Wakil , Xiaojin Wei , Jeffrey A. Zitz
IPC分类号： H01L23/36
CPC分类号： H01L23/3675 , H01L21/563 , H01L23/10 , H01L23/42 , H01L25/0652 , H01L25/18 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/00012 , H01L2224/0401 , H01L2924/00
摘要： An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.
摘要翻译：提供了一种用于减少在计算环境中使用的三维（3D）裸片堆栈的热惩罚的装置，并且包括安装在计算环境内的基板，执行计算环境的操作的第一部件，其耦合到所述基板在堆叠方向上，一组第二部件，用于执行所述计算环境的操作，每个部件耦合到所述第一部件并相对于彼此分割以形成空出的区域;布置在所述热界面材料（TIM）在第一和第二部件的暴露的表面上，以及包括突起的盖，其连接到基板以覆盖第一和第二部件，使得突起延伸到空出的区域中，并且使得盖和突起的表面热连通第一和第二组件通过TIM。

9. 发明授权

US08421217B2 Achieving mechanical and thermal stability in a multi-chip package 有权
标题翻译：在多芯片封装中实现机械和热稳定性
公开(公告)号：US08421217B2
公开(公告)日：2013-04-16
申请号：US13419949
申请日：2012-03-14
申请人： Jon A. Casey , John S. Corbin, Jr. , David Danovitch , Isabelle Depatie , Virendra R. Jadhav , Roger A. Liptak , Kenneth C. Marston , Jennifer V. Muncy , Sylvain Ouimet , Eric Salvas
发明人： Jon A. Casey , John S. Corbin, Jr. , David Danovitch , Isabelle Depatie , Virendra R. Jadhav , Roger A. Liptak , Kenneth C. Marston , Jennifer V. Muncy , Sylvain Ouimet , Eric Salvas
IPC分类号： H01L23/12 , H01L23/34
CPC分类号： H01L23/04 , H01L23/3675 , H01L23/42 , H01L23/433 , H01L24/28 , H01L24/31 , H01L25/0652 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/83192 , H01L2224/92225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01074 , H01L2924/01088 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/16152 , H01L2924/16251 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.
摘要翻译：一种用于在多芯片封装中实现机械和热稳定性的系统和方法系统。该系统采用盖子和多个热界面材料。该方法包括在多芯片封装上利用盖子，并在多芯片封装上利用多个热界面材料。

10. 发明授权

US08363404B2 Implementing loading and heat removal for hub module assembly 失效
标题翻译：实现轮毂模块组装的加载和除热
公开(公告)号：US08363404B2
公开(公告)日：2013-01-29
申请号：US12967854
申请日：2010-12-14
申请人： John L. Colbert , Jason R. Eagle , Roger D. Hamilton , Kenneth C. Marston , Steven P. Ostrander
发明人： John L. Colbert , Jason R. Eagle , Roger D. Hamilton , Kenneth C. Marston , Steven P. Ostrander
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： G06F1/20 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.
摘要翻译：提供了一种用于实现轮毂模块组件的加载和除热的方法和装置。集线器模块组件包括集线器芯片和多个光学模块，其通过设置在驻留在轮毂陶瓷衬底上的顶表面冶金（TSM）LGA上的焊盘网阵列（LGA）组件连接。陶瓷基板通过底表面冶金（BSM）LGA组件连接到电路板。基座对准环包括用于接合电路板和定位BSM LGA组件的LGA插入器的多个对准特征。一对顶部对准环中的每一个包括用于接合和定位TSM LGA组件的相应LGA位置的相应LGA插入器的协作对准特征。 TSM LGA组件的两个LGA插入器对齐，保持并使光学模块与集线器芯片之间的电连接。

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