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1. 发明申请

US20100325885A1 CIRCUIT MEMBER, MANUFACTURING METHOD FOR CIRCUIT MEMBERS, SEMICONDUCTOR DEVICE, AND SURFACE LAMINATION STRUCTURE FOR CIRCUIT MEMBER 有权
标题翻译：电路构件，电路构件的制造方法，半导体器件和电路构件的表面层叠结构
公开(公告)号：US20100325885A1
公开(公告)日：2010-12-30
申请号：US12878137
申请日：2010-09-09
申请人： Yo Shimazaki , Hiroyuki Saito , Masachika Masuda , Kenji Matsumura , Masaru Fukuchi , Takao Ikezawa
发明人： Yo Shimazaki , Hiroyuki Saito , Masachika Masuda , Kenji Matsumura , Masaru Fukuchi , Takao Ikezawa
IPC分类号： H05K3/10
CPC分类号： H01L23/3107 , H01L21/561 , H01L21/565 , H01L21/568 , H01L23/3142 , H01L23/49548 , H01L23/49582 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/05647 , H01L2224/32057 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/73265 , H01L2224/83385 , H01L2224/85385 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85464 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , Y10T29/49121 , Y10T29/49124 , Y10T29/4913 , Y10T29/49155 , H01L2224/85 , H01L2224/83 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.
摘要翻译：电路构件包括通过将轧制的铜板或轧制的铜合金板图案化以安装在其上的用于半导体芯片的芯片焊盘部分形成的框架基板和用于与半导体芯片的电连接的引线部分，具有在芯片焊盘部分和引线部分的上侧和侧壁侧形成粗糙表面的粗糙表面以及形成在芯片焊盘部分和引线部分的下侧以及芯片焊盘部分和引线部分的平滑表面被埋入密封树脂，其具有暴露的引线部分的下侧。

2. 发明授权

US08739401B2 Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member 有权
公开(公告)号：US08739401B2
公开(公告)日：2014-06-03
申请号：US12878137
申请日：2010-09-09
申请人： Yo Shimazaki , Hiroyuki Saito , Masachika Masuda , Kenji Matsumura , Masaru Fukuchi , Takao Ikezawa
发明人： Yo Shimazaki , Hiroyuki Saito , Masachika Masuda , Kenji Matsumura , Masaru Fukuchi , Takao Ikezawa
IPC分类号： H05K3/10
CPC分类号： H01L23/3107 , H01L21/561 , H01L21/565 , H01L21/568 , H01L23/3142 , H01L23/49548 , H01L23/49582 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/05647 , H01L2224/32057 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/73265 , H01L2224/83385 , H01L2224/85385 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85464 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/18301 , Y10T29/49121 , Y10T29/49124 , Y10T29/4913 , Y10T29/49155 , H01L2224/85 , H01L2224/83 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.

3. 发明授权

US08420446B2 Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member 有权
标题翻译：电路部件，电路部件的制造方法以及包括电路部件的半导体装置
公开(公告)号：US08420446B2
公开(公告)日：2013-04-16
申请号：US13012268
申请日：2011-01-24
申请人： Yo Shimazaki , Hiroyuki Saito , Masachika Masuda , Kenji Matsumura , Masaru Fukuchi , Takao Ikezawa
发明人： Yo Shimazaki , Hiroyuki Saito , Masachika Masuda , Kenji Matsumura , Masaru Fukuchi , Takao Ikezawa
IPC分类号： H01L21/58
CPC分类号： H01L23/49548 , C25D5/12 , H01L23/3142 , H01L23/49582 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/32057 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48664 , H01L2224/73265 , H01L2224/83385 , H01L2224/85385 , H01L2224/85464 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/181 , H01L2924/18301 , H01L2224/78 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.
摘要翻译：电路构件包括具有管芯焊盘的引线框架材料，与半导体芯片电连接的引线部分和被配置为支撑管芯焊盘和引线部分的外部框架。引线框架材料包括树脂密封区域。在引线框架材料的树脂密封区域的表面上形成平均粗糙度Ra为0.3μm以上的粗糙面。除了树脂密封区域之外的引线框架材料的表面是平坦光滑的表面。依次层叠Ni镀层和Pd镀层而形成的双层镀层，或者依次层叠Ni镀层，Pd镀层和Au镀层而形成的三层镀层在引线框架材料的整个表面上。

4. 发明申请

US20110117704A1 CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE INCLUDING THE CIRCUIT MEMBER 有权
标题翻译：电路部件，电路部件的制造方法以及包括电路部件的半导体装置
公开(公告)号：US20110117704A1
公开(公告)日：2011-05-19
申请号：US13012268
申请日：2011-01-24
申请人： Yo Shimazaki , Hiroyuki Saito , Masachika Masuda , Kenji Matsumura , Masaru Fukuchi , Takao Ikezawa
发明人： Yo Shimazaki , Hiroyuki Saito , Masachika Masuda , Kenji Matsumura , Masaru Fukuchi , Takao Ikezawa
IPC分类号： H01L21/58
CPC分类号： H01L23/49548 , C25D5/12 , H01L23/3142 , H01L23/49582 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/32057 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48664 , H01L2224/73265 , H01L2224/83385 , H01L2224/85385 , H01L2224/85464 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/181 , H01L2924/18301 , H01L2224/78 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces 10A to 10C and 11A to 11C, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.
摘要翻译：电路构件包括具有管芯焊盘的引线框架材料，与半导体芯片电连接的引线部分和被配置为支撑管芯焊盘和引线部分的外部框架。引线框架材料包括树脂密封区域。在引线框架材料的树脂密封区域的表面上形成平均粗糙度Ra为0.3μm以上的粗化面10A〜10C和11A〜11C。除了树脂密封区域之外的引线框架材料的表面是平坦光滑的表面。依次层叠Ni镀层和Pd镀层而形成的双层镀层，或者依次层叠Ni镀层，Pd镀层和Au镀层而形成的三层镀层在引线框架材料的整个表面上。

5. 发明授权

US07548172B2 Communication system for vehicle, vehicle, and communication device for vehicle 失效
标题翻译：车辆用车辆通信装置通信系统
公开(公告)号：US07548172B2
公开(公告)日：2009-06-16
申请号：US10515335
申请日：2003-06-03
申请人： Akira Shinada , Kenji Matsumura
发明人： Akira Shinada , Kenji Matsumura
IPC分类号： G08G1/16 , G02B26/00
CPC分类号： G08G1/164 , B60Q1/50 , G08G1/092 , G08G1/096783 , G08G1/161
摘要： The present invention is directed to vehicle communication equipment capable of transferring information using light without adding new light emitting means, and further, between a stationary apparatus and a vehicle or between vehicles. A light emitted from a signal lamp (11) of a stationarily installed traffic signal (10) or a head lamp (35) or a tail lamp (36) of a vehicle (20) is superimposed with a signal by a modulator (13), the modulated light is received by a light receiving unit (21) of the vehicle (20) side, and the received modulated light is demodulated by a decoder (22) to be displayed on a display panel (24).
摘要翻译：本发明涉及能够在不添加新的发光装置的情况下进行信息传送的车辆通信装置，并且还涉及在固定装置与车辆之间或车辆之间。从固定安装的交通信号灯（10）或车辆（20）的前灯（35）或尾灯（36）的信号灯（11）发出的光与调制器（13）的信号叠加，调制光被车辆（20）侧的光接收单元（21）接收，并且接收到的调制光由解码器（22）解调以显示在显示面板（24）上。

6. 发明申请

US20070141032A1 Insecticidal oil-based formulations comprising an insecticidal filamentous fungus 审中-公开
标题翻译：包含杀虫丝状真菌的杀虫油基制剂
公开(公告)号：US20070141032A1
公开(公告)日：2007-06-21
申请号：US11362803
申请日：2006-02-28
申请人： Kenji Matsumura , Yoshiki Takashima , Shinya Kimura
发明人： Kenji Matsumura , Yoshiki Takashima , Shinya Kimura
IPC分类号： A01N63/04
CPC分类号： A01N63/04 , A01N25/04
摘要： The present invention provides an insecticidal oil-based formulation, which comprises a petroleum hydrocarbon oil, a nonionic surfactant suitable for emulsifying the petroleum hydrocarbon oil, a desiccating agent and an insecticidal filamentous fungus; and a method for controlling insect pests, which comprises applying said formulation to an insect pests, a habitat of the insect pest or a plant vulnerable to the insect pest; and the like.
摘要翻译：本发明提供一种杀虫油性制剂，其包含石油烃油，适用于乳化石油烃油的非离子表面活性剂，干燥剂和杀虫丝状真菌; 以及一种防治害虫的方法，其中包括将所述制剂应用于害虫，昆虫害虫栖息地或易受虫害害虫害虫害的植物; 等等。

7. 发明授权

US06884607B2 Process for producing optically active 4-halo-3-hydroxybutanoate 失效
标题翻译：光学活性4-卤代-3-羟基丁酸酯的制备方法
公开(公告)号：US06884607B2
公开(公告)日：2005-04-26
申请号：US10004115
申请日：2001-12-06
申请人： Hiroyuki Asako , Kenji Matsumura , Masatoshi Shimizu , Nobuya Itoh , Ryuhei Wakita
发明人： Hiroyuki Asako , Kenji Matsumura , Masatoshi Shimizu , Nobuya Itoh , Ryuhei Wakita
IPC分类号： C12N1/21 , C12N9/04 , C12N15/53 , C12P7/42 , C12P7/62 , C12P13/00 , C12N9/02 , C12N15/52 , C07N21/04
CPC分类号： C12N9/0006 , C12P7/42 , C12P7/62 , C12P13/002
摘要： There are provided a polynucleotide sequence coding for an amino acid sequence capable of preferentially producing (S)-4-bromo-3-hydroxy-butanoate by asymmetrically reducing 4-bromo-3-oxobutanoate, A DNA construct having a promoter in operative linkage with the polynucleotide sequence, a recombinant vector containing the polynucleotide sequence, a transformant, a recombinant vector and the like.
摘要翻译：提供了编码能够通过不对称还原4-溴-3-氧代丁酸酯优先产生（S）-4-溴-3-羟基丁酸酯的氨基酸序列的多核苷酸序列，具有与多核苷酸序列，含有多核苷酸序列的重组载体，转化体，重组载体等。

8. 发明授权

US08274877B2 Optical pickup with light receiving element and holding member and method of manufacturing the same 有权
标题翻译：具有光接收元件和保持构件的光学拾取器及其制造方法
公开(公告)号：US08274877B2
公开(公告)日：2012-09-25
申请号：US12548674
申请日：2009-08-27
申请人： Masatoshi Yajima , Kenji Matsumura , Hideki Hayashi , Yoshiyuki Hashimoto
发明人： Masatoshi Yajima , Kenji Matsumura , Hideki Hayashi , Yoshiyuki Hashimoto
IPC分类号： G11B7/00
CPC分类号： G11B7/22 , G11B7/121
摘要： An optical pickup (10) includes a light emitting element (11), a holding member (14), a light receiving element (18), and a base (13). The holding member (14) is fixed to the base (13) by a combined bonding portion (17). The combined bonding portion (17) is sandwiched between the holding member (14) and the base (13) so as to fix the holding member (14) to the base (13). The combined bonding portion (17) includes a first bonding portion (15) composed of a first adhesive and a second bonding portion (16) composed of a second adhesive having a higher curing shrinkage rate than the first adhesive. The first bonding portion (15) and the second bonding portion (16) are each sandwiched between the holding member (14) and the base (13), and the second bonding portion (16) is provided to cover at least a part of an outer peripheral surface of the first bonding portion (15). A difference between the curing shrinkage rate of the first adhesive and that of the second adhesive is 3.0% or less.
摘要翻译：光学拾取器（10）包括发光元件（11），保持构件（14），光接收元件（18）和基座（13）。保持构件（14）通过组合结合部（17）固定在基座（13）上。组合结合部分17夹在保持构件14和基座13之间，以将保持构件14固定在基座13上。组合接合部分（17）包括由第一粘合剂构成的第一接合部分（15）和由具有比第一粘合剂更高的固化收缩率的第二粘合剂构成的第二接合部分（16）。第一接合部分（15）和第二接合部分（16）分别夹在保持部件（14）和基部（13）之间，并且第二接合部分（16）被设置成覆盖至少一部分第一接合部（15）的外周面。第一粘合剂的固化收缩率与第二粘合剂的固化收缩率之差为3.0％以下。

9. 发明申请

US20100061211A1 OPTICAL PICKUP AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：光学拾取器及其制造方法
公开(公告)号：US20100061211A1
公开(公告)日：2010-03-11
申请号：US12548674
申请日：2009-08-27
申请人： Masatoshi YAJIMA , Kenji MATSUMURA , Hideki HAYASHI , Yoshiyuki HASHIMOTO
发明人： Masatoshi YAJIMA , Kenji MATSUMURA , Hideki HAYASHI , Yoshiyuki HASHIMOTO
IPC分类号： G11B7/00 , H01L21/50
CPC分类号： G11B7/22 , G11B7/121
摘要： An optical pickup (10) includes a light emitting element (11), a holding member (14), a light receiving element (18), and a base (13). The holding member (14) is fixed to the base (13) by a combined bonding portion (17). The combined bonding portion (17) is sandwiched between the holding member (14) and the base (13) so as to fix the holding member (14) to the base (13). The combined bonding portion (17) includes a first bonding portion (15) composed of a first adhesive and a second bonding portion (16) composed of a second adhesive having a higher curing shrinkage rate than the first adhesive. The first bonding portion (15) and the second bonding portion (16) are each sandwiched between the holding member (14) and the base (13), and the second bonding portion (16) is provided to cover at least a part of an outer peripheral surface of the first bonding portion (15). A difference between the curing shrinkage rate of the first adhesive and that of the second adhesive is 3.0% or less.
摘要翻译：光学拾取器（10）包括发光元件（11），保持构件（14），光接收元件（18）和基座（13）。保持构件（14）通过组合结合部（17）固定在基座（13）上。组合结合部分17夹在保持构件14和基座13之间，以将保持构件14固定在基座13上。组合接合部分（17）包括由第一粘合剂构成的第一接合部分（15）和由具有比第一粘合剂更高的固化收缩率的第二粘合剂构成的第二接合部分（16）。第一接合部分（15）和第二接合部分（16）分别夹在保持部件（14）和基部（13）之间，并且第二接合部分（16）被设置成覆盖至少一部分第一接合部（15）的外周面。第一粘合剂的固化收缩率与第二粘合剂的固化收缩率之差为3.0％以下。

10. 发明申请

US20090146280A1 CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE INCLUDING THE CIRCUIT MEMBER 审中-公开
标题翻译：电路部件，电路部件的制造方法以及包括电路部件的半导体装置
公开(公告)号：US20090146280A1
公开(公告)日：2009-06-11
申请号：US12095014
申请日：2006-11-28
申请人： Yo Shimazaki , Hiroyuki Saito , Masachika Masuda , Kenji Matsumura , Masaru Fukuchi , Takao Ikezawa
发明人： Yo Shimazaki , Hiroyuki Saito , Masachika Masuda , Kenji Matsumura , Masaru Fukuchi , Takao Ikezawa
IPC分类号： H01L23/495 , C23F1/00
CPC分类号： H01L23/49548 , C25D5/12 , H01L23/3142 , H01L23/49582 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/32057 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48664 , H01L2224/73265 , H01L2224/83385 , H01L2224/85385 , H01L2224/85464 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/181 , H01L2924/18301 , H01L2224/78 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： A circuit member 20 includes a lead frame material 1 having a die pad 3, a lead part 6 to be electrically connected with a semiconductor chip 30, and an outer frame 2 configured to support the die pad and the lead part. The lead frame material includes a resin sealing region 9. Roughened faces 10A to 10C and 11A to 11C, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer 12A formed by laminating a Ni plated layer 13 and a Pd plated layer 14 in this order or a three-layer plated layer 12B formed by laminating the Ni plated layer 13, the Pd plated layer 14 and an Au plated layer 15 in this order is formed on the whole surface of the lead frame material.
摘要翻译：电路构件20包括具有管芯焊盘3的引线框架材料1，与半导体芯片30电连接的引线部分6和被配置为支撑管芯焊盘和引线部分的外框架2。引线框架材料包括树脂密封区域9.在引线框架材料的树脂密封区域的表面上形成平均粗糙度Ra为0.3μm或更大的粗化面10A至10C和11A至11C。除了树脂密封区域之外的引线框架材料的表面是平坦光滑的表面。依次层叠Ni镀层13和Pd镀层14而形成的双层镀层12A，或通过层压Ni镀层13，Pd镀层14和镀Au的三层镀层12B 层15以此顺序形成在引线框架材料的整个表面上。

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