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    • 5. 发明授权
    • Method of manufacturing semiconductor device including removal of deposits from process chamber and supply portion
    • 制造半导体器件的方法,包括从处理室和供应部分去除沉积物
    • US08679989B2
    • 2014-03-25
    • US12224879
    • 2007-03-27
    • Sadao NakashimaTakahiro MaedaKiyohiko MaedaKenji KamedaYushin Takasawa
    • Sadao NakashimaTakahiro MaedaKiyohiko MaedaKenji KamedaYushin Takasawa
    • H01L21/31
    • C23C16/4405B08B7/00
    • A method of manufacturing a semiconductor device has: carrying a substrate into a process chamber; depositing a thin film on the substrate by supplying inside the process chamber a first film deposition gas including at least one element among plural elements forming a thin film to be deposited and capable of accumulating a film solely and a second film deposition gas including at least another element among the plural elements and incapable of accumulating a film solely; carrying the substrate on which is deposited the thin film out from inside the process chamber; and removing a first sediment adhering to an interior of the process chamber and a second sediment adhering to an interior of the supply portion and having a chemical composition different from a chemical composition of the first sediment by supplying cleaning gases inside the process chamber and inside a supply portion that supplies the first film deposition gas while changing at least one of a supply flow rate, a concentration, and a type between a cleaning gas to be supplied inside the process chamber and a cleaning gas to be supplied inside the supply portion.
    • 制造半导体器件的方法具有:将衬底运送到处理室中; 通过在所述处理室内部供给包括形成要沉积的薄膜的多个元素中的至少一个元素并且能够单独地积聚膜的第一膜沉积气体和包括至少另一个的第二膜沉积气体而在所述基板上沉积薄膜 元素,不能单独积聚; 携带其上沉积有薄膜的基板从处理室内部; 以及除去附着在处理室内部的第一沉淀物和附着在供应部分内部的第二沉淀物,并且具有与第一沉积物的化学成分不同的化学组成,其中通过在处理室内部和内部提供清洁气体 供给部,其供给第一成膜气体,同时改变供给流量,浓度和待处理室内供给的清洗气体与要供给到供给部内部的清洗气体之间的种类中的至少一种。
    • 6. 发明申请
    • Method of Manufacturing Semiconductor Device and Substrate Processing Apparatus
    • 制造半导体器件和衬底处理设备的方法
    • US20090305517A1
    • 2009-12-10
    • US12224879
    • 2007-03-27
    • Sadao NakashimaTakahiro MaedaKiyohiko MaedaKenji KamedaYushin Takasawa
    • Sadao NakashimaTakahiro MaedaKiyohiko MaedaKenji KamedaYushin Takasawa
    • H01L21/469C23C16/46
    • C23C16/4405B08B7/00
    • A method of manufacturing a semiconductor device has: carrying a substrate into a process chamber; depositing a thin film on the substrate by supplying inside the process chamber a first film deposition gas including at least one element among plural elements forming a thin film to be deposited and capable of accumulating a film solely and a second film deposition gas including at least another element among the plural elements and incapable of accumulating a film solely; carrying the substrate on which is deposited the thin film out from inside the process chamber; and removing a first sediment adhering to an interior of the process chamber and a second sediment adhering to an interior of the supply portion and having a chemical composition different from a chemical composition of the first sediment by supplying cleaning gases inside the process chamber and inside a supply portion that supplies the first film deposition gas while changing at least one of a supply flow rate, a concentration, and a type between a cleaning gas to be supplied inside the process chamber and a cleaning gas to be supplied inside the supply portion.
    • 制造半导体器件的方法具有:将衬底运送到处理室中; 通过在所述处理室内部供给包括形成要沉积的薄膜的多个元素中的至少一个元素并且能够单独地积聚膜的第一膜沉积气体和包括至少另一个的第二膜沉积气体而在所述基板上沉积薄膜 元素,不能单独积聚; 携带其上沉积有薄膜的基板从处理室内部; 以及除去附着在处理室内部的第一沉淀物和附着在供应部分内部的第二沉淀物,并且具有与第一沉积物的化学成分不同的化学组成,其中通过在处理室内部和内部提供清洁气体 供给部,其供给第一成膜气体,同时改变供给流量,浓度和待处理室内供给的清洗气体与要供给到供给部内部的清洗气体之间的种类中的至少一种。