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    • 2. 发明授权
    • Use of converging beams for transmitting electromagnetic energy to power devices for die testing
    • 使用会聚光束将电磁能传输到用于模具测试的功率器件
    • US06184696B2
    • 2001-02-06
    • US09046010
    • 1998-03-23
    • Stanley A. WhiteKenneth S. WalleyJames W. JohnstonP. Michael HendersonKelly H. HaleWarner B. Andrews, Jr.Jonathan I. Siann
    • Stanley A. WhiteKenneth S. WalleyJames W. JohnstonP. Michael HendersonKelly H. HaleWarner B. Andrews, Jr.Jonathan I. Siann
    • G01R31302
    • G01R31/303G01R31/3025G01R31/307G01R31/311G01R31/315
    • The described method and apparatus wirelessly test individual integrated circuit die on a wafer containing multiple die. The method incorporates activating a selected die on the wafer by wirelessly impacting the die with at least two beams of electromagnetic radiation so that the die receives radiation energy having at least a first energy level, thereby activating the die by causing a current to flow in the die. Each beam of electromagnetic energy individually has less than the first energy level required to activate the die. The beams of electromagnetic energy are directed so that they at least partially overlap on the selected die. In the region of overlap, the two beams together impact the die with an energy level at least equal to the first energy level required to activate the die. The method may additionally include detecting electromagnetic radiation emitted by the die in response to the electromagnetic energy received from the beams of electromagnetic energy. The apparatus includes an integrated circuit wafer and test apparatus. The integrated circuit wafer contains a plurality of individual die. Each die can be activated by directing electromagnetic energy having at least a first energy level onto that die. The test apparatus includes first and second sources of electromagnetic energy. Each source directs to a selected die on the wafer a beam of electromagnetic energy having an energy level less than the first energy level. The beams at least partially overlap on the selected die so that together they couple to the die energy of at least the first energy level.
    • 所描述的方法和装置在包含多个管芯的晶片上无线地测试单个集成电路管芯。 该方法包括通过用至少两束电磁辐射无线地冲击裸片来激活晶片上的选定管芯,使得管芯接收具有至少第一能级的辐射能,从而通过使电流在 死。 每束电磁能量单独地具有小于激活模具所需的第一能级。 电磁能束被引导使得它们在所选择的模具上至少部分重叠。 在重叠的区域中,两个光束一起以至少等于激活模具所需的第一能量水平的能量水平冲击模具。 该方法可以另外包括响应于从电磁能束接收的电磁能量来检测由管芯发射的电磁辐射。 该装置包括集成电路晶片和测试装置。 集成电路晶片包含多个独立的管芯。 可以通过将具有至少第一能级的电磁能引导到该管芯上来激活每个管芯。 测试装置包括第一和第二电磁源。 每个源向晶片上的选定的管芯提供具有小于第一能级的能级的电磁能束。 梁在所选择的模具上至少部分地重叠,使得它们一起耦合到至少第一能级的管芯能量。