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1. 发明专利

JP2010149029A Method for forming plant material into solution material, and method for utilizing the same 审中-公开
标题翻译：将植物材料制成溶液材料的方法，以及使用该方法的方法
公开(公告)号：JP2010149029A
公开(公告)日：2010-07-08
申请号：JP2008328725
申请日：2008-12-24
申请人： Kazuyuki Iwasaki , Npo Shigen Junkan System Kaihatsu Center , Npo法人資源循環システム開発センター , 和之岩崎
发明人： IWASAKI KAZUYUKI
IPC分类号： B09B3/00 , C09K17/32 , C09K101/00
CPC分类号： Y02W30/78
摘要： PROBLEM TO BE SOLVED: To solve the problems that a soil-ecological system in the agriculture and chemical fertilizer-dependent cultivated land may be possibly deteriorated by the affection of acid rain/snow, a cultivated soil hardpan is then formed, and may be a cause of health damage such as life customary and allergic diseases as residual nitrogen oxides such that chemical substances are deposited in the hardpan and excessive nitrogen is absorbed in the decomposed soil, contaminated underwater, and agricultural products while the unbalance of biomass production/consumption probably become factors that trigger food, fuel, and environmental destruction and the increased biomass production has been significantly important.
SOLUTION: Enzyme cluster and mineral cluster contained in park-greenery, roadside trees, roads, railways, and river slopes with the freshness of plant residues such as forest thinning kept and contained, and after water addition crushing is performed, they are reduced in the soil together with water-soluble lignin, thereby activating soil microorganisms and promoting soil remediation and cultivated soil granulation. The plant residues are formed into the solution material and the carbon cycle turnover is increased, thereby enabling the system to aim at the increased biomass production.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：解决农用化肥依赖型耕地的土壤生态系统可能因酸雨/雪的影响而恶化的问题，形成耕种土块，可能是健康损害的原因，例如生活习惯和过敏性疾病作为残留的氮氧化物，使得化学物质沉积在硬盘中，过量的氮被吸收在分解的土壤中，水下污染和农产品，而生物质生产/ 消费可能成为引发食物，燃料和环境破坏的因素，生物质产量的增加已经非常重要。解决方案：公园绿化，路边树木，道路，铁路，河道等植物群落和矿物簇，保持和保存森林变薄等植物残留的新鲜度，进行加水破碎后，在土壤中与水溶性木质素一起减少，从而激活土壤微生物，促进土壤修复和栽培土壤造粒。植物残留物形成溶液材料，碳循环周转量增加，从而使系统能够瞄准增加的生物量生产。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2009209222A Manufacturing method and usage of enzyme nutritive solution, and organic resource circulation method 审中-公开
标题翻译：制造方法和酶的营养解决方案的使用和有机资源循环方法
公开(公告)号：JP2009209222A
公开(公告)日：2009-09-17
申请号：JP2008051582
申请日：2008-03-03
申请人： Hirai Naoichi , Kazuyuki Iwasaki , Iichiro Yamakawa , 伊一郎山川 , 和之岩崎 , 平井直一
发明人： IWASAKI KAZUYUKI , YAMAKAWA IICHIRO
IPC分类号： C09K17/32 , A01G7/00 , B09B3/00 , B09C1/10 , C05F9/00 , C09K101/00
CPC分类号： Y02A40/214
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing an enzyme nutritive solution useful for an activated liquid of a soil fungus, a composting promotor, and a liquid for a bioreactor etc., or a liquid feed, as well as a usage of the enzyme nutritive solution. SOLUTION: This method includes a water maceration-grinding step of macerating a household waste biomass containing nutriment, minerals and an enzyme group, and grinding it mechanically, a compounding-pooling step of pooling an organic nutritive enzyme solution (an enzyme nutritive solution) obtained by mixing an optimum amount of an enriched enzyme (a stock solution) with the water macerated-ground organic nutritive solution, and an equilibrium ageing step of mass transition of organically decomposing or synthesizing in the enzyme nutritive solution at the water maceration-grinding step and the compounding-pooling step using the enzyme inside and outside cells contained in the stock solution and the biomass. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于制造用于土壤真菌活性液体，堆肥促进剂和用于生物反应器等的液体或液体进料的酶营养溶液的方法，以及使用酶营养液。解决方案：该方法包括浸渍含有营养物，矿物质和酶基团的家庭废弃生物质并机械研磨的水浸法研磨步骤，将有机营养酶溶液（酶营养物）溶液）通过将最佳量的富集酶（储备溶液）与水浸渍有机营养溶液混合获得，以及在水浸渍处理的酶营养溶液中有机分解或合成的质量转换的平衡老化步骤，研磨步骤和使用包含在原液和生物质中的细胞内外的酶的混合步骤。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2005155424A Exhaust emission control device and method for regenerating the same 审中-公开
标题翻译：废气排放控制装置及其再生方法
公开(公告)号：JP2005155424A
公开(公告)日：2005-06-16
申请号：JP2003394549
申请日：2003-11-25
申请人： Kazunori Iwasaki , Kazuyuki Iwasaki , Shiina Sachiko , 岩崎和則 , 岩崎和幸 , 椎奈幸子
发明人： IWASAKI KAZUNORI , IWASAKI KAZUYUKI
IPC分类号： F01N3/02 , B01D46/42
摘要： PROBLEM TO BE SOLVED: To provide an exhaust emission control device and a method for regenerating the same capable of removing particulate matter collected by DPF and regenerating the DPF at low speed of a diesel engine. SOLUTION: This device comprises a branch flow passage 12b formed over a main flow passage 12a connecting an inlet side and an outlet side of the DPF 21 and a two-way selector valve 23 provided at a branch part of the branch flow passage 12b and the main flow passage 12a of the inlet side of the DPF 21. The two way selector valve 23 forms a flow passage communicating between the main flow passage 12a on the inlet side of the DPF 21 and the branch flow passage 12b. When pressure in the inlet side of the DPF 21 rises, the two-way selector valve 23 switches to the branch flow passage 12b to inversely clean the DPF 21 by negative pressure generated through the flow passage. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种废气排放控制装置及其再生方法，其能够除去由DPF收集的颗粒物质并在柴油发动机的低速下再生DPF。解决方案：该装置包括在连接DPF 21的入口侧和出口侧的主流路12a上形成的分支流路12b和设置在分支流路的分支部的双向切换阀23 12b和DPF21的入口侧的主流路12a。双向切换阀23形成在DPF 21的入口侧的主流路12a与分支流路12b之间连通的流路。当DPF21的入口侧的压力上升时，双向切换阀23切换到分支流路12b，通过流路产生的负压对DPF21进行反向清洗。版权所有（C）2005，JPO＆NCIPI

4. 发明申请

US20100124794A1 METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND MOLD ASSEMBLY FOR THE SAME 有权
标题翻译：用于制造半导体装置和模具组装的方法
公开(公告)号：US20100124794A1
公开(公告)日：2010-05-20
申请号：US12619773
申请日：2009-11-17
申请人： Kazuyuki Iwasaki , Ryuichi Goto , Shogo Sakuma
发明人： Kazuyuki Iwasaki , Ryuichi Goto , Shogo Sakuma
IPC分类号： H01L33/44 , H01L21/78 , B29C45/14
CPC分类号： H01L31/02327 , B29C45/02 , B29C45/14639 , H01L24/97 , H01L33/52 , H01L2224/48091 , H01L2924/12043 , H01L2924/00014 , H01L2924/00
摘要： A method for manufacturing a semiconductor apparatus which does not hamper the miniaturization of products and can simplify the manufacturing process without the optical performance deteriorating is described. Furthermore, a mold assembly for use in molding a semiconductor apparatus can be provided. A substrate can be set within a lower mold, wherein a plurality of optical semiconductor elements are mounted on the substrate at predetermined intervals. Primary transfer molding using the lower mold and a primary upper mold can be carried out to form a plurality of frame bodies so as to surround the respective optical semiconductor elements. While the substrate is set on the lower mold, secondary transfer molding using the lower mold and the secondary upper mold can be carried out to form the light-transmitting portions so as to cover the optical semiconductor elements and the frame bodies on the substrate. Then, a multi-piece product of semiconductor apparatuses can be removed from the molds and cut by a dicer to separate the individual semiconductor apparatuses.
摘要翻译：描述了一种制造半导体装置的方法，该半导体装置不妨碍产品的小型化并且可以在不使光学性能恶化的情况下简化制造工艺。此外，可以提供用于模制半导体装置的模具组件。基板可以设置在下模具内，其中多个光学半导体元件以预定间隔安装在基板上。可以进行使用下模和主上模的一次传递成型，以形成多个框体，以包围各个光半导体元件。当基板设置在下模上时，可以执行使用下模和次上模的二次传递模塑，以形成光透射部分，以覆盖基板上的光半导体元件和框体。然后，半导体装置的多件式产品可以从模具中取出并用切割机切割以分离各个半导体装置。

5. 发明授权

US07998763B2 Method for manufacturing semiconductor apparatus and mold assembly for the same 有权
标题翻译：制造半导体装置的方法和用于其的模具组装
公开(公告)号：US07998763B2
公开(公告)日：2011-08-16
申请号：US12619773
申请日：2009-11-17
申请人： Kazuyuki Iwasaki , Ryuichi Goto , Shogo Sakuma
发明人： Kazuyuki Iwasaki , Ryuichi Goto , Shogo Sakuma
IPC分类号： H01L21/00
CPC分类号： H01L31/02327 , B29C45/02 , B29C45/14639 , H01L24/97 , H01L33/52 , H01L2224/48091 , H01L2924/12043 , H01L2924/00014 , H01L2924/00
摘要： A method for manufacturing a semiconductor apparatus which does not hamper the miniaturization of products and can simplify the manufacturing process without the optical performance deteriorating is described. Furthermore, a mold assembly for use in molding a semiconductor apparatus can be provided. A substrate can be set within a lower mold, wherein a plurality of optical semiconductor elements are mounted on the substrate at predetermined intervals. Primary transfer molding using the lower mold and a primary upper mold can be carried out to form a plurality of frame bodies so as to surround the respective optical semiconductor elements. While the substrate is set on the lower mold, secondary transfer molding using the lower mold and the secondary upper mold can be carried out to form the light-transmitting portions so as to cover the optical semiconductor elements and the frame bodies on the substrate. Then, a multi-piece product of semiconductor apparatuses can be removed from the molds and cut by a dicer to separate the individual semiconductor apparatuses.
摘要翻译：描述了一种制造半导体装置的方法，该半导体装置不妨碍产品的小型化并且可以在不使光学性能恶化的情况下简化制造工艺。此外，可以提供用于模制半导体装置的模具组件。基板可以设置在下模具内，其中多个光学半导体元件以预定间隔安装在基板上。可以进行使用下模和主上模的一次传递成型，以形成多个框体，以包围各个光半导体元件。当基板设置在下模上时，可以执行使用下模和次上模的二次传递模塑，以形成光透射部分，以覆盖基板上的光半导体元件和框体。然后，半导体装置的多件式产品可以从模具中取出并用切割机切割以分离各个半导体装置。

6. 发明授权

US5699235A Electronic control board assembly including embedded lead frames for electrically connecting the circuit boards of the assembly 失效
标题翻译：电子控制板组件，包括用于电连接组件的电路板的嵌入式引线框架
公开(公告)号：US5699235A
公开(公告)日：1997-12-16
申请号：US507729
申请日：1995-07-26
申请人： Osamu Tsurumiya , Hitoshi Suda , Kazuyuki Iwasaki , Naofumi Inomata
发明人： Osamu Tsurumiya , Hitoshi Suda , Kazuyuki Iwasaki , Naofumi Inomata
IPC分类号： H05K1/18 , H05K1/02 , H05K1/14 , H05K3/20 , H05K3/22 , H05K3/34 , H05K3/36 , H05K5/00 , H05K7/14 , H01R9/09 , H01R23/68
CPC分类号： H05K1/0265 , H05K1/141 , H05K5/0047 , H05K7/1432 , H05K1/144 , H05K2201/0352 , H05K2201/09118 , H05K2201/09754 , H05K2201/09972 , H05K3/202 , H05K3/222 , H05K3/3447 , H05K3/366 , H05K3/368
摘要： An electronic control board assembly has a large-current control unit and a small-current control unit connected to the large-current control unit. The large-current control unit has an insert-molded board with lead frames embedded therein. The insert-molded board has a first component mounting surface and a first component soldering surface facing away therefrom. A first group of components are mounted on the first component mounting surface and have leads extending through the insert-molded board and soldered to the lead frames. The small-current control unit has a printed wiring board which has a second component mounting surface and a second component soldering surface facing away therefrom. A second group of components are mounted on the second component mounting surface and have leads extending through the printed wiring board and soldered to interconnections patterned on the second component soldering surface. The lead frames have ends extending through the printed wiring board and soldered to the interconnections. The first component soldering surface and the second component soldering surface face outwardly.
摘要翻译：电子控制板组件具有连接到大电流控制单元的大电流控制单元和小电流控制单元。大电流控制单元具有插入成型板，其中引入框架嵌入其中。插入成型板具有第一部件安装表面和与其背离的第一部件焊接表面。第一组部件安装在第一部件安装表面上，并且具有延伸穿过嵌入成型板并且焊接到引线框架的引线。小电流控制单元具有印刷电路板，其具有第二部件安装表面和与其背离的第二部件焊接表面。第二组部件安装在第二部件安装表面上，并具有延伸穿过印刷线路板的引线，并焊接到在第二部件焊接表面上图案化的互连。引线框架的端部延伸穿过印刷电路板并焊接到互连。第一部件焊接表面和第二部件焊接表面朝外。

7. 发明申请

US20060108594A1 LED device and method for manufacturing the same 审中-公开
标题翻译： LED装置及其制造方法
公开(公告)号：US20060108594A1
公开(公告)日：2006-05-25
申请号：US11269669
申请日：2005-11-09
申请人： Kazuyuki Iwasaki , Fusao Suzuki
发明人： Kazuyuki Iwasaki , Fusao Suzuki
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L25/0753 , H01L33/483 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An LED device can include LED chips mounted with high density and encapsulated with a resin. The device may not be substantially affected by fluctuations in thermal stress generated in the encapsulating resin and can have reduced fluctuations in characteristics such as output power and a color tone and can have a high level of reliability which can be maintained over a long period of time. The LED device can be manufactured by a method that includes mounting LED chips with high density on a metal stem having conductive-material-made leads that extend from the metal stem, welding a lens holder having a lens temporarily fixed thereto by a silicone resin to the stem so as to enclose the LED chips, and encapsulating the LED chips and bonding wires by injecting a silicone resin serving as an encapsulating resin having translucency and flexibility into a space defined by the stem, the holder, and the lens.
摘要翻译： LED装置可以包括高密度安装的LED芯片并用树脂封装。该装置可能不受密封树脂中产生的热应力的波动的显着影响，并且可以降低诸如输出功率和色调的特性的波动，并且可以具有高水平的可靠性，这可以在长时间内保持。 LED装置可以通过以下方法制造：包括在具有从金属杆延伸的导电材料制成的引线的金属杆上安装高密度的LED芯片，将具有通过硅树脂临时固定的透镜的透镜保持器焊接到所述杆，以封闭所述LED芯片，并且通过将用作具有半透明性和柔性的封装树脂的硅树脂注入由所述杆，所述保持器和所述透镜限定的空间中来封装所述LED芯片和接合线。

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