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1. 发明专利

JP2012144969A Bed consolidation method using foot protection work for constructing fishway and impervious plate 有权
标题翻译：使用鱼苗保护工作的BED综合方法，用于构建鱼类和不正确的板
公开(公告)号：JP2012144969A
公开(公告)日：2012-08-02
申请号：JP2011140740
申请日：2011-06-24
申请人： Kazuo Kudo , 和男工藤
发明人： KUDO KAZUO
IPC分类号： E02B8/08
摘要： PROBLEM TO BE SOLVED: To provide a bed consolidation method using a foot protection work for constructing bed consolidation works and a fishway in a fall section by river improvement when a river bed is lowered, for example, due to a river disaster caused by a flood and the like, and an impervious plate.SOLUTION: In a bed consolidation method using a foot protection work for constructing a fishway and an impervious plate, bed consolidation works are constructed by the foot protection work and the impervious plate; the fishway is formed of a notched part 6 of the impervious plate; an impervious sheet 3 is laid on the bottom of a river; and a passage 4 and a pool 5 as the fishways are provided by disposing bagged stone works 1 of the foot protection work.
摘要翻译：要解决的问题：例如，由于河流灾害引起的河床下降时，提供一种使用脚部保护工作来构建床整合工程和河段改造的秋季部分的河道整治方法通过洪水等，以及不透水板。
解决方案：采用脚踏保护工作构建鱼道和不透水板的床固结方法，通过脚部保护作业和不透水板构建床固结工程; 鱼道由不透水板的切口部分6形成; 一条不渗透的片材3放置在河流的底部; 并且通过设置足部保护作业的袋装石料1来提供作为鱼道的通道4和池5。版权所有（C）2012，JPO＆INPIT

2. 发明申请

US20090152697A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090152697A1
公开(公告)日：2009-06-18
申请号：US12334318
申请日：2008-12-12
申请人： Hideaki Tamimoto , Takumi Soba , Toru Ueguri , Kazuo Kudo
发明人： Hideaki Tamimoto , Takumi Soba , Toru Ueguri , Kazuo Kudo
IPC分类号： H01L23/495 , H01L21/02
CPC分类号： H01L23/49562 , H01L23/49524 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/77 , H01L24/84 , H01L24/85 , H01L24/95 , H01L2224/04042 , H01L2224/05554 , H01L2224/05639 , H01L2224/0603 , H01L2224/29339 , H01L2224/32245 , H01L2224/37124 , H01L2224/37147 , H01L2224/4007 , H01L2224/40091 , H01L2224/40245 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48639 , H01L2224/48739 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/78313 , H01L2224/83801 , H01L2224/8385 , H01L2224/84205 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/92 , H01L2224/92247 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2924/01015 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/00015
摘要： The bonding time of a metallic ribbon is shortened in the semiconductor device which connects a lead frame with the bonding pad of a semiconductor chip with a metallic ribbon. The bottom of the wedge tool is divided into two by the V-groove at the first branch and the second branch. In order to do bonding of the Al ribbon to the source pad of the silicon chip, and the source post of the lead frame, first, the first branch and second branch of the wedge tool are contacted by pressure to Al ribbon on the source pad, and supersonic vibration is applied to it. Subsequently, the first branch is contacted by pressure to Al ribbon on the source post, and supersonic vibration is applied to it. Here, since the width of the first branch is narrower than the width of the source post, Al ribbon is not joined at the end surface of the width direction of the source post.
摘要翻译：在将引线框与半导体芯片的焊盘与金属带连接的半导体器件中，金属带的接合时间缩短。楔形工具的底部由第一分支和第二分支处的V形槽分成两部分。为了使铝带与硅芯片的源极焊盘和引线框架的源极接合，首先，楔形工具的第一分支和第二分支通过压力与源极上的Al带接触，并施加超音速振动。随后，第一分支通过压力与源柱上的Al带接触，并且对其施加超音速振动。这里，由于第一分支的宽度比源极的宽度窄，所以在色谱柱的宽度方向的端面处没有接合Al带。

3. 发明申请

US20110073921A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20110073921A1
公开(公告)日：2011-03-31
申请号：US12962546
申请日：2010-12-07
申请人： Hideaki TAMIMOTO , Takumi SOBA , Toru UEGURI , Kazuo KUDO
发明人： Hideaki TAMIMOTO , Takumi SOBA , Toru UEGURI , Kazuo KUDO
IPC分类号： H01L29/78 , H01L23/48
CPC分类号： H01L23/49562 , H01L23/49524 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/77 , H01L24/84 , H01L24/85 , H01L24/95 , H01L2224/04042 , H01L2224/05554 , H01L2224/05639 , H01L2224/0603 , H01L2224/29339 , H01L2224/32245 , H01L2224/37124 , H01L2224/37147 , H01L2224/4007 , H01L2224/40091 , H01L2224/40245 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48639 , H01L2224/48739 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/78313 , H01L2224/83801 , H01L2224/8385 , H01L2224/84205 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/92 , H01L2224/92247 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2924/01015 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/00015 , H01L2924/206
摘要： The bonding time of a metallic ribbon is shortened in the semiconductor device which connects a lead frame with the bonding pad of a semiconductor chip with a metallic ribbon. The bottom of the wedge tool is divided into two by the V-groove at the first branch and the second branch. In order to do bonding of the Al ribbon to the source pad of the silicon chip, and the source post of the lead frame, first, the first branch and second branch of the wedge tool are contacted by pressure to Al ribbon on the source pad, and supersonic vibration is applied to it. Subsequently, the first branch is contacted by pressure to Al ribbon on the source post, and supersonic vibration is applied to it. Here, since the width of the first branch is narrower than the width of the source post, Al ribbon is not joined at the end surface of the width direction of the source post.
摘要翻译：在将引线框与半导体芯片的焊盘与金属带连接的半导体器件中，金属带的接合时间缩短。楔形工具的底部由第一分支和第二分支处的V形槽分成两部分。为了使铝带与硅芯片的源极焊盘和引线框架的源极接合，首先，楔形工具的第一支路和第二支路通过压力与源极上的Al带接触，并施加超音速振动。随后，第一分支通过压力与源柱上的Al带接触，并且对其施加超音速振动。这里，由于第一分支的宽度比源极的宽度窄，所以在色谱柱的宽度方向的端面处没有接合Al带。

4. 发明授权

US4047868A Multilayer parison extrusion molding machine for blow molding 失效
标题翻译：多层型坯吹塑成型机
公开(公告)号：US4047868A
公开(公告)日：1977-09-13
申请号：US775735
申请日：1977-03-09
申请人： Kazuo Kudo , Takashi Mizutani
发明人： Kazuo Kudo , Takashi Mizutani
IPC分类号： B29C47/06 , B29C47/22 , B29C47/28 , B29D23/04
CPC分类号： B29C47/0023 , B29C47/065 , B29C47/22 , B29C47/265 , B29C47/28 , B29C47/0026 , B29C47/26
摘要： A multilayer parison extrusion molding machine for blow molding which is characterized in that a main extruder and one or more sub-extruders are radially attached to special diehead and said die head comprises a core holder having a core pin at the lower end; a cylindrical mandrel enclosing said core holder; a plurality of sleeves surrounding said mandrel; housings surrounding said sleeves respectively; one or more pressure rings controlling the space in molten resin passages; pressure ring adjusting screws; an extrusion die; and a die adjusting screw.
摘要翻译：一种用于吹塑的多层型坯挤出成型机，其特征在于，主挤出机和一个或多个次挤出机径向地附接到特殊的模头，所述模头包括在下端具有芯销的芯保持器; 围绕所述芯保持器的圆柱形心轴; 围绕所述心轴的多个套筒; 分别围绕所述套筒的壳体; 控制熔融树脂通道中的空间的一个或多个压力环; 压环调节螺丝; 挤出模具; 和模具调节螺钉。

5. 发明授权

US07863107B2 Semiconductor device and manufacturing method of the same 失效
标题翻译：半导体器件及其制造方法相同
公开(公告)号：US07863107B2
公开(公告)日：2011-01-04
申请号：US12334318
申请日：2008-12-12
申请人： Hideaki Tamimoto , Takumi Soba , Toru Ueguri , Kazuo Kudo
发明人： Hideaki Tamimoto , Takumi Soba , Toru Ueguri , Kazuo Kudo
IPC分类号： H01L21/00
CPC分类号： H01L23/49562 , H01L23/49524 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/77 , H01L24/84 , H01L24/85 , H01L24/95 , H01L2224/04042 , H01L2224/05554 , H01L2224/05639 , H01L2224/0603 , H01L2224/29339 , H01L2224/32245 , H01L2224/37124 , H01L2224/37147 , H01L2224/4007 , H01L2224/40091 , H01L2224/40245 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48639 , H01L2224/48739 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/78313 , H01L2224/83801 , H01L2224/8385 , H01L2224/84205 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/92 , H01L2224/92247 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2924/01015 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/00015
摘要： The bonding time of a metallic ribbon is shortened in the semiconductor device which connects a lead frame with the bonding pad of a semiconductor chip with a metallic ribbon. The bottom of the wedge tool is divided into two by the V-groove at the first branch and the second branch. In order to do bonding of the Al ribbon to the source pad of the silicon chip, and the source post of the lead frame, first, the first branch and second branch of the wedge tool are contacted by pressure to Al ribbon on the source pad, and supersonic vibration is applied to it. Subsequently, the first branch is contacted by pressure to Al ribbon on the source post, and supersonic vibration is applied to it. Here, since the width of the first branch is narrower than the width of the source post, Al ribbon is not joined at the end surface of the width direction of the source post.
摘要翻译：在将引线框与半导体芯片的焊盘与金属带连接的半导体器件中，金属带的接合时间缩短。楔形工具的底部由第一分支和第二分支处的V形槽分成两部分。为了使铝带与硅芯片的源极焊盘和引线框架的源极接合，首先，楔形工具的第一支路和第二支路通过压力与源极上的Al带接触，并施加超音速振动。随后，第一分支通过压力与源柱上的Al带接触，并且对其施加超音速振动。这里，由于第一分支的宽度比源极的宽度窄，所以在色谱柱的宽度方向的端面处没有接合Al带。

6. 发明授权

US4174783A Hollow bottle and production method therefor 失效
标题翻译：中空瓶及其生产方法
公开(公告)号：US4174783A
公开(公告)日：1979-11-20
申请号：US909007
申请日：1978-05-24
申请人： Takashi Abe , Kazuo Kudo , Keiji Kazato
发明人： Takashi Abe , Kazuo Kudo , Keiji Kazato
IPC分类号： B65D1/00 , B29B11/10 , B29C49/00 , B29C49/04 , B29C49/22 , B29C49/42 , B29C49/48 , B29C49/78 , B29C65/00 , B65D1/02 , B65D23/00
CPC分类号： B65D1/0215 , B29C49/04 , B29C49/22 , B29C49/4817 , B29B2911/14646 , B29B2911/14713
摘要： A hollow bottle and the production method therefor. The hollow bottle of the invention is of multi-layer structure and has excellent chemical resistance and large fused adhesion strength in the pinch-off portion of the bottom. The inner layer of the bottle is made of polyamide resin and the depth of the joint groove formed in the inside surface of the inner layer in the pinch-off portion is 20% in depth as compared with the length of the pich-off portion, which portion is in a cross-sectionally tapered-off projection formed on the bottom of the bottle.In the production method of the present invention, after the multi-layer parison is extruded from dies, the lowermost end of the parison is closed and an inert gas is then blown into the parison, or the bottom of the parison is closed with blowing the inert gas. After the bottom of the parison is closed, it is transferred into a blow mold and blow molding is carried out, thereby forming a hollow bottle of the present invention.
摘要翻译：一种中空瓶及其生产方法。本发明的中空瓶具有多层结构，在底部的夹断部分具有优异的耐化学性和较大的熔融粘合强度。瓶子的内层由聚酰胺树脂制成，并且在夹断部分的内层的内表面中形成的接合槽的深度与脱毛部分的长度相比为20％该部分处于形成在瓶底部的横截面渐缩的突出部分。在本发明的制造方法中，从模具挤出多层型坯后，将型坯的最下端封闭，然后将惰性气体吹入型坯，或者将型坯的底部吹入惰性气体。在将型坯的底部关闭之后，将其转移到吹塑模具中并进行吹塑成型，从而形成本发明的中空瓶。

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