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1. 发明申请

WO2004093177B1 POLISHING PAD AND METHOD FOR PRODUCING SAME 审中-公开
标题翻译：抛光垫及其制造方法
公开(公告)号：WO2004093177B1
公开(公告)日：2005-03-31
申请号：PCT/JP2004005078
申请日：2004-04-08
申请人： NIHON MICROCOATING CO LTD , OHNO HISATOMO , IZUMI TOSHIHIRO , SAITO MITSURU , NAGAMINE TAKUYA , MILLER CLAUGHTON , KODAKA ICHIRO
发明人： OHNO HISATOMO , IZUMI TOSHIHIRO , SAITO MITSURU , NAGAMINE TAKUYA , MILLER CLAUGHTON , KODAKA ICHIRO
IPC分类号： B24B37/20 , B24B37/24 , B24B37/26 , H01L21/304 , B24B37/00
CPC分类号： B24B37/205
摘要： A polishing pad is disclosed which enables to stably polish the surface of an object smooth and flat by applying the polishing technique for determining when polishing is completed. A method for producing such a polishing pad is also disclosed. A polishing pad (10) is composed of a light-transmitting pad having a polishing surface (11a) on the front side. By forming a recess (12) on the back side (11b) of the light-transmitting pad (11), the light transmittance can be locally changed. The light-transmitting pad (11) has a light transmittance of not less than 10%, preferably of not less than 30%, to at least a light having a wavelength within the region of 350-900 nm. The light-transmitting pad (11) has a light transmittance of not less than 10% preferably over the light wavelength region of 370-900 nm, more preferably over the light wavelength region of 390-900 nm. The light-transmitting pad (11) has a light transmittance of not less than 30% preferably over the light wavelength region of 400-900 nm, more preferably over the light wavelength region of 450-900 nm.
摘要翻译：公开了一种抛光垫，其通过应用用于确定抛光完成时的抛光技术，能够使物体的表面光滑平坦地被抛光。还公开了一种用于制造这种抛光垫的方法。抛光垫（10）由在前侧具有研磨面（11a）的透光垫构成。通过在透光垫（11）的背面（11b）上形成凹部（12），可以局部地改变透光率。透光垫（11）对波长在350-900nm范围内的至少一种光具有不小于10％，优选不小于30％的透光率。透光垫（11）的透光率优选在370-900nm的光波长区域以上，更优选在390-900nm的光波长区域以上的10％以上的透光率。透光垫（11）的透光率优选在400-900nm的光波长区域以上，更优选在450〜900nm的光波长区域以上30％以上的透光率。

2. 发明申请

WO2005087416A1 CUTTING TOOL FOR SIMULTANEOUS FACING AND GROOVING OF CMP PAD 审中-公开
标题翻译：切割工具同时进行和铺设CMP垫
公开(公告)号：WO2005087416A1
公开(公告)日：2005-09-22
申请号：PCT/US2005/007019
申请日：2005-03-03
申请人： MIPOX INTERNATIONAL CORPORATION , KODAKA, Ichiro , NAGAMINE, Takuya , KOBAYASHI, Toshihiro
发明人： KODAKA, Ichiro , NAGAMINE, Takuya , KOBAYASHI, Toshihiro
IPC分类号： B23B27/06
CPC分类号： B23B27/06 , Y10T407/23 , Y10T409/502624 , Y10T409/50328
摘要： A cutting tool for simultaneously carrying out a facing operation and a grooving operation on a target surface has a facing part and a grooving part that protrudes from and may be integrally formed with the facing part. The facing part has a facing surface for carrying out the facing operation and the grooving part has a grooving surface and is for cutting a groove of a specified depth and width on the target surface simultaneously as the cutting tool is moved in a specified forward direction parallel to the target surface. The dimensions of the facing and grooving parts, the roughness of their surfaces, the angles of their cutting edges and the sloping angles of the facing and grooving surfaces with respect to the forward direction are each required to be within a specified range. Where the grooving part protrudes from the facing part, the corners at which the facing surface joins the side surfaces of the grooving part are formed such that each corner has a beveled surface portion.
摘要翻译：用于在目标表面上同时进行面对操作和切槽操作的切削工具具有面对部分和从相对部分突出并与之形成一体的切槽部分。面对部分具有用于进行面对操作的面对表面，并且切槽部分具有开槽表面，并且当切割工具沿着指定的正向平行移动时同时切割目标表面上指定深度和宽度的凹槽到目标表面。面向和切槽部分的尺寸，其表面的粗糙度，其切削刃的角度以及相对于向前方向的面对和切槽表面的倾斜角度均需要在特定范围内。在切槽部从面对部突出的情况下，形成面对面与切槽部的侧面接合的角部，使得各角部具有斜面部。

3. 发明申请

WO2005070059A3 LAYERED SUPPORT AND METHOD FOR LAMINATING CMP PADS 审中-公开
公开(公告)号：WO2005070059A3
公开(公告)日：2005-08-04
申请号：PCT/US2005/000385
申请日：2005-01-07
申请人： MIPOX INTERNATIONAL CORPORATION , KODAKA, Ichiro , SISCHILE, Charles , TIMBANG, Alvin , CASTILLO, Margarita , MILLER, Claughton
发明人： KODAKA, Ichiro , SISCHILE, Charles , TIMBANG, Alvin , CASTILLO, Margarita , MILLER, Claughton
IPC分类号： B29C65/00
摘要： A device and method for laminating CMP pads includes supporting the CMP pad (201) with a board (301) having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess (302) to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board (303) is provided on the opposite side of the CMP pad for lamination.

4. 发明申请

WO2005070059A2 LAYERED SUPPORT AND METHOD FOR LAMINATING CMP PADS 审中-公开
标题翻译：层叠支撑和层压CMP垫的方法
公开(公告)号：WO2005070059A2
公开(公告)日：2005-08-04
申请号：PCT/US2005000385
申请日：2005-01-07
申请人： MIPOX INTERNAT CORP , KODAKA ICHIRO , SISCHILE CHARLES , TIMBANG ALVIN , CASTILLO MARGARITA , MILLER CLAUGHTON
发明人： KODAKA ICHIRO , SISCHILE CHARLES , TIMBANG ALVIN , CASTILLO MARGARITA , MILLER CLAUGHTON
IPC分类号： B24B37/04 , B32B37/12
CPC分类号： B24B37/22 , B24D18/00 , B32B37/0007 , B32B37/12 , B32B37/26
摘要： A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.
摘要翻译：用于层压CMP垫的装置和方法包括用具有类似于CMP垫的材料组成的板来支撑CMP垫。通过在层压期间支撑CMP焊盘，不太可能损坏CMP焊盘并且具有更好的层压附着力。特别地，CMP垫材料与第一板接触，该第一板可以具有凹部以接受CMP垫。垫具有等于或大于垫材料的尺寸。在替代实施例中，在CMP垫的相对侧上设置有用于层压的板。

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