专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2009104840A3 HYBRID ELECTRIC DEVICE USING PIEZO-ELECTRIC POLYMER SUBSTRATE AND ITS FABRICATION METHOD 审中-公开
标题翻译：使用PIEZO-ELECTRIC聚合物基板的混合电气设备及其制造方法
公开(公告)号：WO2009104840A3
公开(公告)日：2010-04-15
申请号：PCT/KR2008003692
申请日：2008-06-26
申请人： KOREA INST SCI & TECH , CHOI WON KOOK , IE SANG YUB , PARK DONG HEE , KIM JI HWAN , LEE DONG SOO , PARK IN SEOK , SON DONG IK
发明人： CHOI WON KOOK , IE SANG YUB , PARK DONG HEE , KIM JI HWAN , LEE DONG SOO , PARK IN SEOK , SON DONG IK
IPC分类号： H01L33/00 , G06F3/041 , H01L41/083 , H01L41/193 , H01L41/45 , H01L51/40
CPC分类号： H05K3/027 , B06B1/0688 , B82Y30/00 , G06F3/016 , G06F3/0414 , H01L27/20 , H01L27/3225 , H01L41/0478 , H01L41/29 , H01L51/0042 , H01L51/426 , H01L51/52 , H01L2251/5338 , H04R1/04 , H04R17/005 , H04R31/00 , H04R2499/15 , H05K1/028 , H05K2201/015 , H05K2201/0326 , H05K2201/0329
摘要： The present invention relates to an integrated, composite hybrid electric device in which various devices are formed as a single unit on one flexible substrate, and a fabrication method thereof. More particularly, the present invention a hybrid electric device in which a display device, a vibration-generating (or vibration-sensing) device, and a non-volatile memory device are formed on a single flexible piezoelectric polymer substrate (1 ) into a single unit by using a flexible piezoelectric polymer substrate whose both surfaces are thinly deposited with a patterned transparent oxidation electrode (2a, 2b) and a fabrication method thereof.
摘要翻译：本发明涉及一种集成的复合混合电气装置及其制造方法，其中各种装置在一个柔性基板上形成为单个单元。更具体地，本发明是一种混合电气装置，其中在单个柔性压电聚合物基板（1）上形成显示装置，振动产生（或振动感测）装置和非易失性存储装置，形成单个通过使用其两个表面被薄图形化的透明氧化电极（2a，2b）的柔性压电聚合物基板及其制造方法来实现。

2. 发明申请

WO2005008724A2 WAFER-LEVEL CHIP SCALE PACKAGE AND METHOD FOR FABRICATING AND USING THE SAME 审中-公开
标题翻译： WAFER-LEVEL芯片尺寸包装及其制造和使用方法
公开(公告)号：WO2005008724A2
公开(公告)日：2005-01-27
申请号：PCT/US2004021940
申请日：2004-07-08
申请人： FAIRCHILD SEMICONDUCTOR , JOSHI RAJEEV , WU CHUNG-LI , LEE SANG-DO , CHOI YOON-HWA , PARK MIN-HYO , KIM JI-HWAN
发明人： JOSHI RAJEEV , WU CHUNG-LI , LEE SANG-DO , CHOI YOON-HWA , PARK MIN-HYO , KIM JI-HWAN
IPC分类号： H01L21/60 , H01L21/68 , H01L23/31 , H01L23/485 , H01L23/525 , H01L
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/3114 , H01L23/3171 , H01L23/525 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/83 , H01L24/97 , H01L2224/0231 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29399 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/838 , H01L2224/97 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/351 , H01L2224/81 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/01023 , H01L2924/01028 , H01L2924/3512
摘要： First, second, and third packaged semiconductor devices (a wafer-level chip scale package) are described. The first packaged semiconductor device contains no UBM between a chip pad and an RDL pattern. The first device contains only a single non-polymeric insulation layer between the RDL pattern and the solder bump, where the insulation layer does not need high temperature curing processes and so does not induce thermal stresses into the device. Manufacturing costs for the first device are diminished by eliminating the UBM between the chip pad and the RDL pattern. The second packaged semiconductor device (a second wafer-level chip scale package) contains an adhesive film containing conductive particles sandwiched between a chip with Cu-based stud bumps and a substrate containing a bond pad. Some conductive particles are sandwiched between the stud bump and bond pad to create a conductive path. The second device is manufactured without the steps of dispensing solder and reflowing the solder and can optionally eliminate the use of a redistribution trace. Using such a configuration increases the reliability of the second wafer-level chip scale package. The third packaged semiconductor device (a third wafer-level chip scale package) contains a conductive adhesive material as an electrical interconnect route between the semiconductor die and a patterned conductive substrate. The patterned conductive substrate acts not only as a substrate, but also as a redistribution layer that converts the dense pad layout of the die to a larger array configuration of the solder balls in the circuit board. Using the invention allows the formation of a lower priced chip scale package that overcomes the restriction of the die size used in die-sized chip packages and the input-output pattern that can be required by the printed circuit board. Thus, the invention can provide a familiar pitch (i.e., interface) to the printed circuit board for any small die.
摘要翻译：第一，第二和第三封装半导体器件（晶片级芯片级封装）被描述。第一封装半导体器件在芯片焊盘和RDL图案之间不包含UBM。第一器件在RDL图案和焊料凸块之间仅包含单个非聚合物绝缘层，其中绝缘层不需要高温固化工艺，因此不会将热应力引入器件。通过消除芯片焊盘和RDL图案之间的UBM，可以减少第一个器件的制造成本。第二封装半导体器件（第二晶片级芯片级封装）包含夹有包含Cu基柱凸块的芯片和含有焊盘的衬底的导电颗粒的粘合膜。一些导电颗粒被夹在柱形凸块和接合垫之间以产生导电路径。制造第二装置不需要分配焊料和回流焊料的步骤，并且可以可选地消除再分布迹线的使用。使用这种配置增加了第二晶片级芯片级封装的可靠性。第三封装半导体器件（第三晶片级芯片级封装）包含作为半导体管芯和图案化导电衬底之间的电互连路径的导电粘合剂材料。图案化导电衬底不仅用作衬底，而且还用作将芯片的致密衬垫布局转换成电路板中的焊球的更大阵列配置的再分配层。使用本发明允许形成较低价格的芯片级封装，其克服了芯片尺寸芯片封装中使用的裸片尺寸的限制以及印刷电路板可能需要的输入 - 输出图案。因此，本发明可以为任何小型芯片提供与印刷电路板的熟悉的间距（即接口）。

3. 发明申请

WO2009104840A2 HYBRID ELECTRIC DEVICE USING PIEZO-ELECTRIC POLYMER SUBSTRATE AND ITS FABRICATION METHOD 审中-公开
标题翻译：使用PIEZO-ELECTRIC聚合物基板的混合电气设备及其制造方法
公开(公告)号：WO2009104840A2
公开(公告)日：2009-08-27
申请号：PCT/KR2008/003692
申请日：2008-06-26
申请人： KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY , CHOI, Won Kook , IE, Sang Yub , PARK, Dong Hee , KIM, Ji Hwan , LEE, Dong Soo , PARK, In Seok , SON, Dong Ik
发明人： CHOI, Won Kook , IE, Sang Yub , PARK, Dong Hee , KIM, Ji Hwan , LEE, Dong Soo , PARK, In Seok , SON, Dong Ik
IPC分类号： H01L33/00 , H01L41/04 , H01L41/09 , H01L41/113 , H01L51/00
CPC分类号： H05K3/027 , B06B1/0688 , B82Y30/00 , G06F3/016 , G06F3/0414 , H01L27/20 , H01L27/3225 , H01L41/0478 , H01L41/29 , H01L51/0042 , H01L51/426 , H01L51/52 , H01L2251/5338 , H04R1/04 , H04R17/005 , H04R31/00 , H04R2499/15 , H05K1/028 , H05K2201/015 , H05K2201/0326 , H05K2201/0329
摘要： The present invention relates to an integrated, composite hybrid electric device in which various devices are formed as a single unit on one flexible substrate, and a fabrication method thereof. More particularly, the present invention a hybrid electric device in which a display device, a vibration-generating (or vibration-sensing) device, and a non-volatile memory device are formed on a single flexible piezoelectric polymer substrate into a single unit by using a flexible piezoelectric polymer substrate whose both surfaces are thinly deposited with a patterned transparent oxidation electrode, and a fabrication method thereof.
摘要翻译：本发明涉及一种集成的复合混合电气装置及其制造方法，其中各种装置在一个柔性基板上形成为单个单元。更具体地说，本发明是一种混合电动装置，其中通过使用在单个柔性压电聚合物基板上将显示装置，振动产生（或振动感测）装置和非易失性存储装置形成为单个装置一种柔性压电聚合物基材及其制造方法，它们的两个表面均薄片地沉积有图案化的透明氧化电极。

4. 发明申请

WO2006075833A1 SUPERCONDUCTING POWER CABLE CAPABLE OF QUENCH DETECTION AND QUENCH DETECTION SYSTEM USING THE SAME 审中-公开
标题翻译：使用该方法检测氘检测和猝灭检测系统的超级电力电缆
公开(公告)号：WO2006075833A1
公开(公告)日：2006-07-20
申请号：PCT/KR2005/002085
申请日：2005-06-30
申请人： LS Cable Ltd. , JANG, Hyun-Man , KIM, Do-Woon , KIM, Ji-Hwan
发明人： JANG, Hyun-Man , KIM, Do-Woon , KIM, Ji-Hwan
IPC分类号： H01B12/02
CPC分类号： H01B12/02 , H01B7/32 , H02H1/0007 , H02H7/001 , Y02E40/641 , Y02E40/68
摘要： Disclosed is a superconducting power cable capable of quench detection, and a quench detection system using the superconducting power cable. The superconducting power cable capable of quench detection includes a former; a superconducting conductor layer composed of a superconducting wire and surrounding the former; a conductor layer quench detection coil interposed between the former and the superconducting conductor layer and surrounding the former; an insulating layer surrounding the superconducting conductor layer; and a shielding layer surrounding the insulating layer. This superconducting power cable may detect quench generated during its operation in real time.
摘要翻译：公开了能够进行淬火检测的超导电力电缆，以及使用超导电力电缆的淬火检测系统。能够进行淬火检测的超导电力电缆包括前者; 由超导线构成的超导导体层，围绕前者; 插入在前者和超导导体层之间并围绕前者的导体层骤冷检测线圈; 围绕所述超导导体层的绝缘层; 以及围绕绝缘层的屏蔽层。这种超导电力电缆可以在其操作期间实时检测到淬火。

5. 发明申请

WO2008072819A1 APPARATUS FOR TRANSFERRING OPTICAL DATA IN OPTICAL SWITCHING SYSTEM USING TIME SYNCHRONIZATION 审中-公开
标题翻译：用于在使用时间同步的光学切换系统中传输光学数据的装置
公开(公告)号：WO2008072819A1
公开(公告)日：2008-06-19
申请号：PCT/KR2007/000693
申请日：2007-02-08
申请人： RESEARCH AND INDUSTRIAL COOPERATION GROUP , RHEE, June Koo , KIM, Ji Hwan , CHOI, Jung Yul , KANG, Min Ho
发明人： RHEE, June Koo , KIM, Ji Hwan , CHOI, Jung Yul , KANG, Min Ho
IPC分类号： G02B6/35
CPC分类号： H04Q11/0066 , H04Q11/0005 , H04Q2011/0016 , H04Q2011/0035 , H04Q2011/0039 , H04Q2011/0045
摘要： Provided is an apparatus for transferring optical data in an optical switching system using time synchronization. The apparatus performs time synchronization on optical data to input the optical data at regular intervals through fiber delay lines for time synchronization respectively disposed on input ports. Therefore, the apparatus can efficiently reduce a data blocking rate in comparison with a conventional optical switching system using an asynchronous electric buffer without a synchronous process, and achieve the same performance as conventional asynchronous technology despite using fewer wavelength converters and buffers, thus reducing system cost. In addition, using dynamic time synchronization modules, the apparatus performs time synchronization for minute time variation due to an environment such as temperature.
摘要翻译：提供了一种使用时间同步在光交换系统中传送光数据的装置。该装置对光数据执行时间同步，以规则间隔通过光纤延迟线输入光学数据，用于分别设置在输入端口上的时间同步。因此，与使用不具有同步处理的异步电动缓冲器的常规光开关系统相比，该装置可以有效地降低数据阻塞率，并且尽管使用较少的波长转换器和缓冲器，但是实现与传统异步技术相同的性能，从而降低系统成本。此外，使用动态时间同步模块，由于诸如温度的环境，该装置执行时间同步以进行微小的时间变化。

6. 发明申请

WO2005008724A3 WAFER-LEVEL CHIP SCALE PACKAGE AND METHOD FOR FABRICATING AND USING THE SAME 审中-公开
公开(公告)号：WO2005008724A3
公开(公告)日：2005-01-27
申请号：PCT/US2004/021940
申请日：2004-07-08
申请人： FAIRCHILD SEMICONDUCTOR CORPORATION , JOSHI, Rajeev , WU, Chung-Li , LEE, Sang-Do , CHOI, Yoon-Hwa , PARK, Min-Hyo , KIM, Ji-Hwan
发明人： JOSHI, Rajeev , WU, Chung-Li , LEE, Sang-Do , CHOI, Yoon-Hwa , PARK, Min-Hyo , KIM, Ji-Hwan
IPC分类号： H01L21/60 , H01L23/31 , H01L23/485 , H01L23/525
摘要： First, second, and third packaged semiconductor devices (a wafer-level chip scale package) are described. The first packaged semiconductor device contains no UBM between a chip pad and an RDL pattern. The first device contains only a single non-polymeric insulation layer between the RDL pattern and the solder bump, where the insulation layer does not need high temperature curing processes and so does not induce thermal stresses into the device. Manufacturing costs for the first device are diminished by eliminating the UBM between the chip pad and the RDL pattern. The second packaged semiconductor device (a second wafer-level chip scale package) contains an adhesive film containing conductive particles sandwiched between a chip with Cu-based stud bumps and a substrate containing a bond pad. Some conductive particles are sandwiched between the stud bump and bond pad to create a conductive path. The second device is manufactured without the steps of dispensing solder and reflowing the solder and can optionally eliminate the use of a redistribution trace. Using such a configuration increases the reliability of the second wafer-level chip scale package. The third packaged semiconductor device (a third wafer-level chip scale package) contains a conductive adhesive material as an electrical interconnect route between the semiconductor die and a patterned conductive substrate. The patterned conductive substrate acts not only as a substrate, but also as a redistribution layer that converts the dense pad layout of the die to a larger array configuration of the solder balls in the circuit board. Using the invention allows the formation of a lower priced chip scale package that overcomes the restriction of the die size used in die-sized chip packages and the input-output pattern that can be required by the printed circuit board. Thus, the invention can provide a familiar pitch (i.e., interface) to the printed circuit board for any small die.

7. 发明申请

WO2007126210A1 HINGE WITH THE MAGNET FORCE 审中-公开
标题翻译：带有磁力的铰链
公开(公告)号：WO2007126210A1
公开(公告)日：2007-11-08
申请号：PCT/KR2007/001425
申请日：2007-03-23
申请人： KIM, Ji-Hwan
发明人： KIM, Ji-Hwan
IPC分类号： E05D11/00
CPC分类号： E05D11/1014 , E05D3/02 , E05D5/04 , E05D11/06 , E05Y2201/218 , E05Y2201/46 , E05Y2600/54 , E05Y2900/132
摘要： This invention relates to a hinge with magnet which protects the door from sudden close by wind at a certain open angle of the hinge with the magnet force. The hinge in this invention is characterized by being comprised of; the 1st member of which one side is formed with an extended rotating hole and a curvature, in which a stopper with a magnet rod is formed, front side is formed with connecting holes; the 2nd hinge member formed with rotating holes on one side and multiple holes on the front; and the rotating shaft which rotates the 1 st and 2nd hinge members, by penetrating the rotating holes formed by the 1st and 2nd members and multiple bearings in the rotating holes, and jointed with a fixing member, and the 2nd hinge member is attached with the magnet rod and prevents the door from closing by keeping it open at a certain angle.
摘要翻译：本发明涉及一种具有磁体的铰链，该铰链具有保护门免受风以与磁力一定的开启角度的紧张关闭。本发明的铰链的特征在于：第一构件形成有延伸的旋转孔和曲率，其中形成有具有磁棒的止动件，前侧形成有连接孔; 第二铰链部件在一侧形成有旋转孔，在前面形成有多个孔; 以及旋转轴，其通过贯穿由第一和第二构件形成的旋转孔和旋转孔中的多个轴承而旋转第一和第二铰链构件，并且与固定构件接合，并且第二铰链构件附接有磁棒，并通过保持打开一定的角度防止门关闭。

8. 发明公开

KR20100031957A Automatically foldable side mirror assembly 无效
标题翻译：自动折叠侧镜组件
公开(公告)号：KR20100031957A
公开(公告)日：2010-03-25
申请号：KR20080090857
申请日：2008-09-16
申请人： KIM JI HWAN , LIM HYUN SUNG
发明人： KIM JI HWAN , LIM HYUN SUNG
IPC分类号： B60R1/06 , B60R1/07
摘要： PURPOSE: An automatically foldable side mirror assembly is provided to enable a driver or passenger from getting off while looking at the rear by enabling a driver to look at the rear when a main side mirror is folded and a dead space when the main side mirror is unfolded. CONSTITUTION: An automatically foldable side mirror assembly includes a mirror(20) for a dead space. The mirror for the dead space is rotated between a first position and a second position using the rotation force of a drive motor of the automatically foldable side mirror. In the first position, the mirror for the dead space monitors the dead space when the side mirror is unfolded. In the second position, the mirror for the dead space monitors the rear of the vehicle when the side mirror is folded.
摘要翻译：目的：提供一个可自动折叠的侧视镜组件，以使驾驶员或乘客能够在观察后方时下车，当主侧视镜折叠时，使驾驶员能够看到后方，当主侧视镜为展开。构成：可自动折叠的侧反射镜组件包括用于死空间的反射镜（20）。使用自动折叠侧镜的驱动马达的旋转力，使死区的反射镜在第一位置和第二位置之间旋转。在第一个位置，死空间的镜子在侧视镜展开时监视死空间。在第二位置，当侧视镜折叠时，死空间的镜子监视车辆的后部。

9. 发明授权

KR100938128B1 MACHIN TYPE DOOR CLOSER 无效
标题翻译： MACHIN型门锁
公开(公告)号：KR100938128B1
公开(公告)日：2010-01-22
申请号：KR20090079579
申请日：2009-08-27
申请人： KIM JI HWAN
发明人： KIM JI HWAN
IPC分类号： E05F1/08 , E05F15/10 , E05F15/18
CPC分类号： E05F1/08 , E05F15/60 , E05F15/608 , E05Y2201/10 , E05Y2201/47 , E05Y2201/624 , E05Y2201/632 , E05Y2201/686 , E05Y2400/65 , E05Y2600/626
摘要： PURPOSE: A mechanical door closure is provided to reduce the manufacturing cost or maintenance cost by simplifying the structure as the mechanical structure, to keep the opened condition of a door, and to prevent the leak of flame or fire smoke by rapidly closing a door in a fire. CONSTITUTION: A mechanical door closure comprises a housing(100), a power transmission device(200), a door closing device(300), a door deceleration device(400), an elastic adjustment device, and a cover. The housing comprises a first interlocking arm and a second interlocking arm(A2) and is installed in the upper part of a doorframe of a building. The power transmission device is installed in the housing and makes the door closely contacted to the doorframe in a fire. The door closing device keeps the opened condition of a door and forcedly closes the door in an emergency like a fire. The door deceleration device is connected to the power transmission device, and reduces the closed speed of the door while moving straight. The elastic adjustment device is installed in the housing to control the closed speed of the door. The cover covers the housing.
摘要翻译：目的：提供机械门盖，通过简化作为机械结构的结构，保持门的打开状态，并通过快速关闭门来防止火焰或火焰烟雾的泄漏，从而降低制造成本或维护成本一阵火构成：机械门关闭装置包括壳体（100），动力传递装置（200），关门装置（300），门减速装置（400），弹性调节装置和盖子。壳体包括第一互锁臂和第二互锁臂（A2），并且安装在建筑物的门框的上部。动力传动装置安装在壳体中，并使门与火焰中的门框紧密接触。门关闭装置保持门的打开状态，并在如同火灾的紧急情况下强制关闭门。门减速装置连接到动力传动装置，并且在直线移动的同时降低门的关闭速度。弹性调节装置安装在壳体中以控制门的关闭速度。盖子盖住外壳。

10. 发明授权

KR101207763B1 Door closer 无效
标题翻译：闭门器
公开(公告)号：KR101207763B1
公开(公告)日：2012-12-03
申请号：KR20120005049
申请日：2012-01-17
申请人： KIM JI HWAN
发明人： KIM JI HWAN
IPC分类号： E05F3/00 , E05C17/02
CPC分类号： E05F3/22 , E05C17/36 , E05F1/10 , E05F5/02
摘要： PURPOSE: A door closer is provided to reduce manufacturing and maintenance costs by simplifying the mechanical structure of the door closer and to maintain the opening state of a door at various angles. CONSTITUTION: A door closer comprises a doorframe mounting portion(100), a frame(200), a rotary link(300), a connection link(400), a coil spring(500), and an actuating arm(600). The doorframe mounting portion is fixed to a doorframe(F). The frame is rotatably connected to one side of the doorframe mounting portion. The rotary link is rotatably connected to the other side of the doorframe mounting portion and has a first rotary roller(310) moved along a guide hole(240) of the frame. The connection link is rotatably connected to the rotary link and has a second rotary roller moved along the convex, concave, and curved portions of the frame. The coil spring is connected to the rotary and connection links. The actuating arm is connected to the frame and a door.
摘要翻译：目的：提供一种闭门器，通过简化门关闭器的机械结构并将门的开启状态保持在各种角度来降低制造和维护成本。构成：门关闭器包括门框安装部分（100），框架（200），旋转连杆（300），连接连杆（400），螺旋弹簧（500）和致动臂（600）。门框安装部分固定在门框（F）上。框架可旋转地连接到门框安装部分的一侧。旋转连杆可旋转地连接到门框安装部分的另一侧，并且具有沿着框架的引导孔（240）移动的第一旋转辊（310）。连接连杆可旋转地连接到旋转连杆上，并且具有沿框架的凸，凹和弯曲部分移动的第二旋转辊。螺旋弹簧连接到旋转和连接链路。致动臂连接到框架和门。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式