专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07663252B2 Electric power semiconductor device 有权
标题翻译：电力半导体装置
公开(公告)号：US07663252B2
公开(公告)日：2010-02-16
申请号：US11873030
申请日：2007-10-16
申请人： Junji Yamada , Seiji Saiki
发明人： Junji Yamada , Seiji Saiki
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/49 , H01L24/45 , H01L24/48 , H01L25/072 , H01L2224/451 , H01L2224/48091 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/014 , H01L2924/14 , H01L2924/19107 , H01L2924/30107 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： An electric power semiconductor device including first and second circuit patterns formed on main surfaces of first and second insulating substrates, respectively, first and second semiconductor chips mounted on the first and second circuit patterns, respectively, a multilayer electrode plate assembly disposed between the first and second insulating substrates, having first, second and third electrode terminals provided with a distance from each other, a first connecting conductor made by wire bonding for connecting the first and second semiconductor chips to the first and second electrode terminals, and a second connecting conductor having an extending portion extended from a part of the third electrode terminal to be connected to the second circuit pattern, and the connection between the extending portion of the third electrode terminal and the second circuit pattern is implemented by a solder.
摘要翻译：一种功率半导体器件，包括分别形成在第一绝缘基板和第二绝缘基板的主表面上的第一和第二电路图案，分别安装在第一和第二电路图案上的第一和第二半导体芯片，分别设置在第一和第二绝缘基板之间的多层电极板组件，第二绝缘基板，具有彼此间隔开的距离的第一，第二和第三电极端子，通过引线接合制成的第一连接导体，用于将第一和第二半导体芯片连接到第一和第二电极端子;以及第二连接导体，从所述第三电极端子的一部分延伸以连接到所述第二电路图案的延伸部分，并且通过焊料实现所述第三电极端子的延伸部分与所述第二电路图案之间的连接。

2. 发明授权

US07291928B2 Electric power semiconductor device 有权
标题翻译：电力半导体装置
公开(公告)号：US07291928B2
公开(公告)日：2007-11-06
申请号：US10648347
申请日：2003-08-27
申请人： Junji Yamada , Seiji Saiki
发明人： Junji Yamada , Seiji Saiki
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/49 , H01L24/45 , H01L24/48 , H01L25/072 , H01L2224/451 , H01L2224/48091 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/014 , H01L2924/14 , H01L2924/19107 , H01L2924/30107 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： Semiconductor chips are connected to electrode terminals (6a, 6b) by wire bonding, and connecting conductors connect extending portions (60b, 60c) extending from a part of the electrode terminals (6b, 6c) to the circuit patterns (3a, 3b) by soldering, and thus the wire bonding points of the electrode terminals are reduced to thereby reduce an electric resistance and suppress heat generation and voltage drop.
摘要翻译：半导体芯片通过引线接合连接到电极端子（6a，6b），连接导体连接从电极端子（6b，6c）的一部分延伸到电路图案的延伸部分（60b，60c）（3a，3b），因此电极端子的引线接合点减小，从而降低电阻并抑制发热和电压降。

3. 外观设计

USD476959S1 Semiconductor device 失效
公开(公告)号：USD476959S1
公开(公告)日：2003-07-08
申请号：US29164710
申请日：2002-07-31
申请人： Junji Yamada , Seiji Saiki
设计人： Junji Yamada , Seiji Saiki

4. 发明申请

US20080164621A1 ELECTRIC POWER SEMICONDUCTOR DEVICE 有权
标题翻译：电力半导体器件
公开(公告)号：US20080164621A1
公开(公告)日：2008-07-10
申请号：US11873030
申请日：2007-10-16
申请人： Junji Yamada , Seiji Saiki
发明人： Junji Yamada , Seiji Saiki
IPC分类号： H01L23/528
CPC分类号： H01L24/49 , H01L24/45 , H01L24/48 , H01L25/072 , H01L2224/451 , H01L2224/48091 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/014 , H01L2924/14 , H01L2924/19107 , H01L2924/30107 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： An electric power semiconductor device including first and second circuit patterns formed on main surfaces of first and second insulating substrates, respectively, first and second semiconductor chips mounted on the first and second circuit patterns, respectively, a multilayer electrode plate assembly disposed between the first and second insulating substrates, having first, second and third electrode terminals provided with a distance from each other, a first connecting conductor made by wire bonding for connecting the first and second semiconductor chips to the first and second electrode terminals, and a second connecting conductor having an extending portion extended from a part of the third electrode terminal to be connected to the second circuit pattern, and the connection between the extending portion of the third electrode terminal and the second circuit pattern is implemented by a solder.
摘要翻译：一种功率半导体器件，包括分别形成在第一绝缘基板和第二绝缘基板的主表面上的第一和第二电路图案，分别安装在第一和第二电路图案上的第一和第二半导体芯片，分别设置在第一和第二绝缘基板之间的多层电极板组件，第二绝缘基板，具有彼此间隔开的距离的第一，第二和第三电极端子，通过引线接合制成的第一连接导体，用于将第一和第二半导体芯片连接到第一和第二电极端子;以及第二连接导体，从所述第三电极端子的一部分延伸以连接到所述第二电路图案的延伸部分，并且通过焊料实现所述第三电极端子的延伸部分与所述第二电路图案之间的连接。

5. 发明授权

US06984883B2 Semiconductor power module 有权
标题翻译：半导体电源模块
公开(公告)号：US06984883B2
公开(公告)日：2006-01-10
申请号：US10671592
申请日：2003-09-29
申请人： Junji Yamada , Seiji Saiki
发明人： Junji Yamada , Seiji Saiki
IPC分类号： H01L23/48
CPC分类号： H05K1/111 , H01L23/488 , H01L23/492 , H01L2924/0002 , H05K1/0271 , H05K1/0306 , H05K3/3405 , H05K3/3421 , H05K3/38 , H05K3/4092 , H05K2201/0355 , H05K2201/09109 , H05K2201/1034 , Y02P70/611 , H01L2924/00
摘要： An insulating substrate (17) includes a surface conductive layer (25) fixedly laminated on a surface of the plate-like semiconductor body (21) via a surface side fixing member (24, 26). The surface side fixing member (24, 26) includes a first fixing portion (26) for fixing one part (25a) of the surface conductive layer (25) located underneath the joint portion (15) of the electrode terminal (14), and a second fixing portion (24) for fixing the other part (25b) of the surface conductive layer (25) which is not located underneath the joint portion (15), and a fixing strength exhibited by the first fixing portion (26) is smaller than that exhibited by the second fixing portion (24).
摘要翻译：绝缘基板（17）包括经由表面侧固定部件（24,26）固定层压在板状半导体主体（21）的表面上的表面导电层（25）。表面侧固定构件（24,26）包括用于固定位于电极端子（14）的接合部分（15）下方的表面导电层（25）的一部分（25a）的第一固定部分（26）以及用于固定不在接合部（15）的下方的表面导电层（25）的另一部分（25b）的第二固定部分（24）和由第一固定部分（26）表现的固定强度，小于由第二固定部（24）所表现的结果。

6. 发明授权

US07969025B2 Electric power semiconductor device 有权
标题翻译：电力半导体装置
公开(公告)号：US07969025B2
公开(公告)日：2011-06-28
申请号：US12647162
申请日：2009-12-24
申请人： Junji Yamada , Seiji Saiki
发明人： Junji Yamada , Seiji Saiki
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/49 , H01L24/45 , H01L24/48 , H01L25/072 , H01L2224/451 , H01L2224/48091 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/014 , H01L2924/14 , H01L2924/19107 , H01L2924/30107 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： An electric power semiconductor device including first and second circuit patterns formed on main surfaces of first and second insulating substrates, respectively, first and second semiconductor chips mounted on the first and second circuit patterns, respectively, a multilayer electrode plate assembly disposed between the first and second insulating substrates, having first, second and third electrode terminals provided with a distance from each other, a first connecting conductor made by wire bonding for connecting the first and second semiconductor chips to the first and second electrode terminals, and a second connecting conductor having an extending portion extended from a part of the third electrode terminal to be connected to the second circuit pattern, and the connection between the extending portion of the third electrode terminal and the second circuit pattern is implemented by a solder.
摘要翻译：一种功率半导体器件，包括分别形成在第一绝缘基板和第二绝缘基板的主表面上的第一和第二电路图案，分别安装在第一和第二电路图案上的第一和第二半导体芯片，分别设置在第一和第二绝缘基板之间的多层电极板组件，第二绝缘基板，具有彼此间隔开的距离的第一，第二和第三电极端子，通过引线接合制成的第一连接导体，用于将第一和第二半导体芯片连接到第一和第二电极端子;以及第二连接导体，从所述第三电极端子的一部分延伸以连接到所述第二电路图案的延伸部分，并且通过焊料实现所述第三电极端子的延伸部分与所述第二电路图案之间的连接。

7. 发明申请

US20060048966A1 Shield cable, wiring component, and information apparatus 有权
标题翻译：屏蔽电缆，接线部件和信息设备
公开(公告)号：US20060048966A1
公开(公告)日：2006-03-09
申请号：US10522577
申请日：2003-04-30
申请人： Hirokazu Takahashi , Seiji Saiki , Kiyonori Yokoi
发明人： Hirokazu Takahashi , Seiji Saiki , Kiyonori Yokoi
IPC分类号： H01B7/18
CPC分类号： H01B11/002 , H01B11/1025
摘要： A shield cable, in which a winding looseness of a shield layer due to twisting can be decreased and a short-circuit between a shield layer and signal conductor as well as a disconnection of the signal conductor is prevented, and a wiring component and information apparatus having the shield cable are provided. A twisted conductor is covered with an insulator to form an insulated wire with an outer diameter of 0.3 mm or less. This insulated wire is covered with a shield conductor and a sheath so as to form a shield cable. The shield conductor consists of a plurality of shield layers. The first shield layer at an inner most part is formed by winding conductors spirally with a scroll pitch of 7 to 13 mm. One shield cable may contain two insulated wires.
摘要翻译：可以防止由于扭转引起的屏蔽层的卷绕松动，屏蔽层与信号导体之间的短路以及信号导体的断开的屏蔽电缆，并且布线部件和信息装置提供屏蔽电缆。绞合的导体被绝缘体覆盖以形成外径为0.3mm或更小的绝缘电线。该绝缘线被屏蔽导体和护套覆盖以形成屏蔽电缆。屏蔽导体由多个屏蔽层组成。内部最大部分的第一屏蔽层通过以7至13mm的滚动间距螺旋形缠绕导体形成。一根屏蔽电缆可能包含两根绝缘电线。

8. 发明申请

US20100096758A1 ELECTRIC POWER SEMICONDUCTOR DEVICE 有权
标题翻译：电力半导体器件
公开(公告)号：US20100096758A1
公开(公告)日：2010-04-22
申请号：US12647162
申请日：2009-12-24
申请人： Junji YAMADA , Seiji Saiki
发明人： Junji YAMADA , Seiji Saiki
IPC分类号： H01L23/52 , H01L23/522 , H01L23/538
CPC分类号： H01L24/49 , H01L24/45 , H01L24/48 , H01L25/072 , H01L2224/451 , H01L2224/48091 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/014 , H01L2924/14 , H01L2924/19107 , H01L2924/30107 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： An electric power semiconductor device including first and second circuit patterns formed on main surfaces of first and second insulating substrates, respectively, first and second semiconductor chips mounted on the first and second circuit patterns, respectively, a multilayer electrode plate assembly disposed between the first and second insulating substrates, having first, second and third electrode terminals provided with a distance from each other, a first connecting conductor made by wire bonding for connecting the first and second semiconductor chips to the first and second electrode terminals, and a second connecting conductor having an extending portion extended from a part of the third electrode terminal to be connected to the second circuit pattern, and the connection between the extending portion of the third electrode terminal and the second circuit pattern is implemented by a solder.
摘要翻译：一种功率半导体器件，包括分别形成在第一绝缘基板和第二绝缘基板的主表面上的第一和第二电路图案，分别安装在第一和第二电路图案上的第一和第二半导体芯片，分别设置在第一和第二绝缘基板之间的多层电极板组件，第二绝缘基板，具有彼此间隔开的距离的第一，第二和第三电极端子，通过引线接合制成的第一连接导体，用于将第一和第二半导体芯片连接到第一和第二电极端子;以及第二连接导体，从所述第三电极端子的一部分延伸以连接到所述第二电路图案的延伸部分，并且通过焊料实现所述第三电极端子的延伸部分与所述第二电路图案之间的连接。

9. 发明授权

US07323640B2 Shield cable, wiring component, and information apparatus 有权
标题翻译：屏蔽电缆，接线部件和信息设备
公开(公告)号：US07323640B2
公开(公告)日：2008-01-29
申请号：US10522577
申请日：2003-04-30
申请人： Hirokazu Takahashi , Seiji Saiki , Kiyonori Yokoi
发明人： Hirokazu Takahashi , Seiji Saiki , Kiyonori Yokoi
IPC分类号： H01B7/18 , H01B9/02
CPC分类号： H01B11/002 , H01B11/1025
摘要： A shield cable, in which a winding looseness of a shield layer due to twisting can be decreased and a short-circuit between a shield layer and signal conductor as well as a disconnection of the signal conductor is prevented, and a wiring component and information apparatus having the shield cable are provided. A twisted conductor is covered with an insulator to form an insulated wire with an outer diameter of 0.3 mm or less. This insulated wire is covered with a shield conductor and a sheath so as to form a shield cable. The shield conductor consists of a plurality of shield layers. The first shield layer at an inner most part is formed by winding conductors spirally with a scroll pitch of 7 to 13 mm. One shield cable may contain two insulated wires.
摘要翻译：可以防止由于扭转引起的屏蔽层的卷绕松动，屏蔽层与信号导体之间的短路以及信号导体的断开的屏蔽电缆，并且布线部件和信息装置提供屏蔽电缆。绞合的导体被绝缘体覆盖以形成外径为0.3mm或更小的绝缘电线。该绝缘线被屏蔽导体和护套覆盖以形成屏蔽电缆。屏蔽导体由多个屏蔽层组成。内部最大部分的第一屏蔽层通过以7至13mm的滚动间距螺旋形缠绕导体形成。一根屏蔽电缆可能包含两根绝缘电线。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式