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    • 3. 发明申请
    • Apparatus and method for measuring activity of plating solution
    • 电镀液活性测定装置及方法
    • US20110241709A1
    • 2011-10-06
    • US12805215
    • 2010-07-19
    • Young Ku LyuTae Ho KimJung Wook SeoHyo Seung Nam
    • Young Ku LyuTae Ho KimJung Wook SeoHyo Seung Nam
    • G01N27/06G01R27/08
    • G01N27/10
    • Disclosed herein are an apparatus and a method for measuring activity of a plating solution. The apparatus for measuring activity of a plating solution may include: a plating bath containing the plating solution for plating a plating object; a first electrode which is impregnated in the plating solution and has a plated body to measure current that flows in the plating solution and on the surface of the body in accordance with applied signal voltage; a second electrode which is impregnated in the plating solution to induce current from the first electrode or discharge current to the first electrode; a third electrode which controls the signal voltage applied to the first electrode to be constantly maintained; an impedance measurement unit which calculates an impedance value from the current measured in the first electrode; and a processing unit which displays a change of the calculated impedance value depending on a time.
    • 本文公开了一种用于测量电镀液的活性的装置和方法。 用于测量电镀液活性的装置可以包括:含有电镀对象电镀​​液的镀液; 第一电极,其被浸渍在电镀液中,并且具有电镀体,以根据施加的信号电压来测量在电镀溶液中流动的电流和身体的表面; 浸渍在所述电镀溶液中以从所述第一电极感应电流或者将所述第一电极放电至所述第一电极的第二电极; 控制施加到第一电极的信号电压被持续保持的第三电极; 阻抗测量单元,其从在第一电极中测量的电流计算阻抗值; 以及处理单元,其根据时间显示所计算的阻抗值的变化。