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    • 1. 发明授权
    • Method for manufacturing combined acoustic backing and interconnect module for ultrasonic array
    • 用于超声波阵列的组合声学背衬和互连模块的制造方法
    • US06541896B1
    • 2003-04-01
    • US08998559
    • 1997-12-29
    • Joseph Edward Piel, Jr.Robert Stephen LewandowskiBrady Andrew Jones
    • Joseph Edward Piel, Jr.Robert Stephen LewandowskiBrady Andrew Jones
    • H01L4108
    • G10K11/002B06B1/0622H01R9/032H01R12/594H01R12/62
    • A combined acoustic backing and interconnect module for connecting an array of ultrasonic transducer elements to a multiplicity of conductors of a cable utilizes the backing layer volume to extend a high density of interconnections perpendicular to the transducer array surface. The module is made by injecting flowable backfill material into a mold made up of a plurality of spacer plates having aligned channels, with interleaved flexible circuit boards. The backfill material is cured to form a backing layer which supports the flexible circuit boards in mutually parallel relationship. Excess flexible circuit material on one side of the backing layer is cut flush with the front face of the backing layer, leaving exposed ends of the conductive traces on the flexible circuit boards. The module is then laminated to a piezoelectric ceramic layer, and diced. The flexible circuit board conductive traces are aligned with, and electrically connected to, signal electrodes of the transducer elements. The other ends of the conductive traces on a fanout portion of the flexible circuit board are connected to the cable.
    • 用于将超声波换能器阵列阵列连接到电缆的多个导体的组合的声学背衬和互连模块利用背衬层体积来延伸垂直于换能器阵列表面的高密度互连。 该模块通过将可流动的回填材料注入由具有对准的通道的多个间隔板组成的模具和交错的柔性电路板来制成。 回填材料被固化以形成背衬层,其以相互平行的关系支撑柔性电路板。 在背衬层的一侧上的过量柔性电路材料与背衬层的前表面齐平地切割,将导电迹线的暴露端留在柔性电路板上。 然后将该模块层压到压电陶瓷层上,并切割。 柔性电路板导电迹线与换能器元件的信号电极对准并电连接。 柔性电路板的扇出部分上的导电迹线的另一端连接到电缆。