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    • 8. 发明授权
    • Vacuum treatment system for application of thin, hard layers
    • 真空处理系统,应用薄,硬层
    • US06206975B1
    • 2001-03-27
    • US09302491
    • 1999-04-30
    • Alfred RickJosef HoffmannKlaus Michael
    • Alfred RickJosef HoffmannKlaus Michael
    • C23C1600
    • C23C14/56
    • Vacuum treatment system for application of thin layers onto substrates (36, 38, 40, 42) with a transfer chamber (5) and several treatment chambers (6, 8, 10, 12), said treatment chambers peripherally attached to the transfer chamber and being connected to said transfer chamber by means of a common opening (27, 29, 31, 33) for inlet and outlet of substrate (36, 38, 40, 42), and with a handling device (24) for transport of the substrate (36, 38, 40, 42) between the treatment chambers (6, 8, 10, 12), whereby the handling device (24) has at least one substrate holder (37, 39, 41, 43) with one pivot and/or rotating retaining part to hold the substrates (36, 38, 40, 42), by means of which the substrates (36, 38, 40, 42) can pivot and/or rotate in the treatment chambers (6, 8, 10, 12).
    • 用于将薄层施加到具有传送室(5)和多个处理室(6,8,10,12)的基板(36,38,40,42)上的真空处理系统,所述处理室周边附接到传送室, 通过用于衬底(36,38,40,42)的入口和出口的公共开口(27,29,31,33)连接到所述传送室,以及用于传送衬底的处理装置(24) (36,88,40,42),其中处理室(6,8,10,12)具有至少一个具有一个枢轴和/或一个枢轴的衬底保持器(37,39,41,43) 或旋转保持部分以保持基板(36,38,40,42),通过该基板,基板(36,38,40,42)可以在处理室(6,8,10和42)中枢转和/或旋转, 12)。