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    • 4. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20130088912A1
    • 2013-04-11
    • US13535583
    • 2012-06-28
    • Jong-pil SONDong-min KIM
    • Jong-pil SONDong-min KIM
    • G11C7/06G11C11/24G11C7/00
    • G11C7/08G11C11/4091G11C11/4094G11C11/4099
    • A semiconductor memory device includes a first bit line to which a first memory cell is connected, and a second bit line to which a second memory cell is connected, the second bit line being complementary to the first bit line, a sense amplifier that includes a first transistor and a second transistor connected in series between the first bit line and the second bit line, the sense amplifier including a first node between the first transistor and the second transistor, a gate of the first transistor being connected to the second bit line, and a gate of the second transistor being connected to the first bit line, and a voltage providing unit that provides a first voltage to the first node during presensing, and provides a second voltage, different from the first voltage, to the first node during main sensing.
    • 半导体存储器件包括第一存储器单元连接到的第一位线和连接第二存储器单元的第二位线,第二位线与第一位线互补,读出放大器包括: 第一晶体管和第二晶体管串联连接在第一位线和第二位线之间,读出放大器包括第一晶体管和第二晶体管之间的第一节点,第一晶体管的栅极连接到第二位线, 并且所述第二晶体管的栅极连接到所述第一位线,以及电压提供单元,其在预定期间向所述第一节点提供第一电压,并且在所述第一节点期间在所述第一节点期间向所述第一节点提供与所述第一电压不同的第二电压 感应。
    • 7. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US06459642B1
    • 2002-10-01
    • US09703820
    • 2000-11-01
    • Beak Hyung ChoDu Eung KimJong Pil Son
    • Beak Hyung ChoDu Eung KimJong Pil Son
    • G11C700
    • G11C29/83G11C5/14G11C29/832
    • The invention discloses a semiconductor memory device in which faulty cells causing standby current failure will be replaced with redundancy cells. The semiconductor memory device includes: a plurality of word lines, a plurality of bit lines, a plurality of cells connected between the word lines and bit lines for storing data and a memory cell array of a plurality of cell blocks having a plurality of cell power lines for providing supply voltage to the cells; a plurality of row decoder circuits for decoding external row addresses and generating selection signals for predetermined word lines included in the cell blocks; and a plurality of cell power repairing circuits for selectively blocking between cell power lines providing supply voltage to faulty cells and power source at an occurrence of faulty cells causing standby current failure. At this time, the cell power lines of the cell blocks are arranged in an identical direction to word lines; the row decoder circuits are respectively arranged between two neighboring cell blocks; and the cell power repairing circuits are respectively arranged between the cell blocks of the memory cell array, thereby reducing the size of a chip.
    • 本发明公开了一种半导体存储器件,其中引起备用电流故障的故障单元将被替换为冗余单元。 半导体存储器件包括:多个字线,多个位线,连接在字线和用于存储数据的位线之间的多个单元,以及具有多个单元电力的多个单元块的存储单元阵列 为电池提供电源电压的线路; 多个行解码器电路,用于解码外部行地址并产生用于包括在单元块中的预定字线的选择信号; 以及多个单元电力修复电路,用于在出现故障单元并导致待机电流故障时,选择性地阻塞在故障单元和电源之间提供电源电压的单元电源线之间。 此时,单元块的单元电力线被排列成与字线相同的方向; 行解码器电路分别布置在两个相邻的单元块之间; 并且电池功率修复电路分别布置在存储单元阵列的单元块之间,从而减小芯片的尺寸。