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1. 发明申请

US20090000807A1 Connecting Structure and Adhesion Method of Pcb Using Anisotropic Conductive Film, and Method for Evaluating Connecting Condition Using the Same 有权
标题翻译：使用各向异性导电膜的Pcb的连接结构和粘附方法以及使用其的连接条件的评价方法
公开(公告)号：US20090000807A1
公开(公告)日：2009-01-01
申请号：US12161487
申请日：2007-01-22
申请人： Chul-Jong Han , Yoon-Jae Chung , Jong-Yoon Jang , Jeong-Beom Park , Yong-Seok Han , Sung-Uk Choi , Il-Rae Cho , Hyuk-Soo Moon , Kyung-Joon Lee
发明人： Chul-Jong Han , Yoon-Jae Chung , Jong-Yoon Jang , Jeong-Beom Park , Yong-Seok Han , Sung-Uk Choi , Il-Rae Cho , Hyuk-Soo Moon , Kyung-Joon Lee
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K3/361 , H05K3/323 , H05K2201/091 , H05K2203/0278 , Y10T29/41 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144
摘要： A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.
摘要翻译：根据本发明的使用各向异性导电膜的PCB的连接结构，其具有通过使用包括绝缘粘合剂作为基底的各向异性导电膜和分散在绝缘粘合剂中的导电颗粒通过热压缩而彼此连接的构件，其中至少任何一个构件具有柔性，并且由于通过热压缩形成的凹痕，具有柔性的构件的表面粗糙度值（Ra）为0.1至5.0μm。

2. 发明授权

US07438834B2 Anisotropic conductive adhesive having PTC characteristics 有权
标题翻译：具有PTC特性的各向异性导电粘合剂
公开(公告)号：US07438834B2
公开(公告)日：2008-10-21
申请号：US11110312
申请日：2005-04-20
申请人： Jong Yoon Jang , Yoon Jae Chung , Woo Young Ahn , Young Mi Jeon , Yong Seok Han
发明人： Jong Yoon Jang , Yoon Jae Chung , Woo Young Ahn , Young Mi Jeon , Yong Seok Han
IPC分类号： H01B1/22
CPC分类号： H05K3/323 , H01B1/22 , H05K2201/0141
摘要： The present invention relates to an anisotropic conductive adhesive comprising an anisotropic conductive adhesive combined with a crystalline polymer to realize anisotropic conductivity and PTC (Positive Temperature Coefficient) characteristics at the same time. The anisotropic conductive adhesive having PTC characteristics according to the present invention comprises an insulating adhesive component and a plurality of conductive particles dispersed in adhesive component, in which the insulating adhesive component comprises a crystalline polymer. Since the anisotropic conductive adhesive according to the present invention includes a crystalline polymer, when temperature rises and the volume expands, electrical resistance is rapidly increased, whereby current flow is intercepted resulting in blocking current, providing PTC characteristics acting as a switch. Thus, it shows circuit protection function as well. Accordingly, it is possible to intercept a circuit upon occurrence of excess current without using a separate element for circuit protection such as PTC thermistor.
摘要翻译：本发明涉及包含与结晶聚合物组合的各向异性导电粘合剂以同时实现各向异性导电性和PTC（正温度系数）特性的各向异性导电粘合剂。根据本发明的具有PTC特性的各向异性导电粘合剂包括分散在粘合剂组分中的绝缘粘合剂组分和多个导电颗粒，其中绝缘粘合剂组分包含结晶聚合物。由于根据本发明的各向异性导电粘合剂包括结晶聚合物，当温度升高并且体积膨胀时，电阻迅速增加，由此截流电流导致阻塞电流，提供作为开关的PTC特性。因此，它也显示电路保护功能。因此，可以在不使用诸如PTC热敏电阻之类的用于电路保护的单独元件的情况下在发生过电流时截获电路。

3. 发明申请

US20110290538A1 CONNECTING STRUCTURE AND ADHESION METHOD OF PCB USING ANISOTROPIC CONDUCTIVE FILM, AND METHOD FOR EVALUATING CONNECTING CONDITION USING THE SAME 审中-公开
标题翻译：使用各向异性导电膜的PCB的连接结构和粘合方法以及使用其评估连接条件的方法
公开(公告)号：US20110290538A1
公开(公告)日：2011-12-01
申请号：US13152000
申请日：2011-06-02
申请人： Chul-Jong HAN , Yoon-Jae CHUNG , Jong-Yoon JANG , Jeong-Beom PARK , Yong-Seok HAN , Sung-Uk CHOI , Il-Rae CHO , Hyuk-Soo MOON , Kyung-Joon LEE
发明人： Chul-Jong HAN , Yoon-Jae CHUNG , Jong-Yoon JANG , Jeong-Beom PARK , Yong-Seok HAN , Sung-Uk CHOI , Il-Rae CHO , Hyuk-Soo MOON , Kyung-Joon LEE
IPC分类号： H05K1/00
CPC分类号： H05K3/361 , H05K3/323 , H05K2201/091 , H05K2203/0278 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144
摘要： A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.
摘要翻译：根据本发明的使用各向异性导电膜的PCB的连接结构，其具有通过使用包括绝缘粘合剂作为基底的各向异性导电膜和分散在绝缘粘合剂中的导电颗粒通过热压缩而彼此连接的构件，其中至少任何一个构件具有柔性，并且由于通过热压缩形成的凹痕，具有柔性的构件的表面粗糙度值（Ra）为0.1〜5.0μm。

4. 发明授权

US07993417B2 Method of adhering a pair of members 有权
标题翻译：粘贴一对成员的方法
公开(公告)号：US07993417B2
公开(公告)日：2011-08-09
申请号：US12161487
申请日：2007-01-22
申请人： Chul-Jong Han , Yoon-Jae Chung , Jong-Yoon Jang , Jeong-Beom Park , Yong-Seok Han , Sung-Uk Choi , Il-Rae Cho , Hyuk-Soo Moon , Kyung-Joon Lee
发明人： Chul-Jong Han , Yoon-Jae Chung , Jong-Yoon Jang , Jeong-Beom Park , Yong-Seok Han , Sung-Uk Choi , Il-Rae Cho , Hyuk-Soo Moon , Kyung-Joon Lee
IPC分类号： H01L21/00
CPC分类号： H05K3/361 , H05K3/323 , H05K2201/091 , H05K2203/0278 , Y10T29/41 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144
摘要： A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.
摘要翻译：根据本发明的使用各向异性导电膜的PCB的连接结构，其具有通过使用包括绝缘粘合剂作为基底的各向异性导电膜和分散在绝缘粘合剂中的导电颗粒通过热压缩而彼此连接的构件，其中至少任何一个构件具有柔性，并且由于通过热压缩形成的凹痕，具有柔性的构件的表面粗糙度值（Ra）为0.1〜5.0μm。

5. 发明授权

US07452923B2 Anisotropic conductive adhesive 有权
标题翻译：各向异性导电胶
公开(公告)号：US07452923B2
公开(公告)日：2008-11-18
申请号：US10958825
申请日：2004-10-05
申请人： Young Mi Jeon , Yoon Jae Chung , Jong Yoon Jang , Woo Young Ahn , Yong Seok Han
发明人： Young Mi Jeon , Yoon Jae Chung , Jong Yoon Jang , Woo Young Ahn , Yong Seok Han
IPC分类号： C08F2/50 , H01B1/00 , H01B1/20 , H01B1/22
CPC分类号： H05K3/323 , C08F283/00 , C08K2201/001 , C08L21/00 , C08L23/16 , C08L33/20 , C08L35/06 , C08L2205/22 , C08L2666/02 , C08L2666/24 , C09J9/02 , C09J121/00 , C09J133/08 , C09J135/06 , C09J151/003 , C09J151/04 , C09J151/06 , C09J155/02 , H05K2201/0133
摘要： The present invention discloses an anisotropic conductive adhesive comprising an insulating adhesive component and a number of conductive particles dispersed in the insulating adhesive component, wherein the insulating adhesive component contains a crosslinked rubber resin. The anisotropic conductive adhesive of the present invention prevents exfoliation of an adhesive or reduction in adhesive strength of circuit by minimizing its the heat-contraction occurring in the process of a polymerization or a hardening reaction when connecting micro-circuits, whereby a short circuit between adjacent electrodes can be prevented when connecting the circuits, and excellent connection reliability according to a long-term use is achieved.
摘要翻译：本发明公开了一种各向异性导电粘合剂，其包含绝缘粘合剂组分和分散在绝缘粘合剂组分中的多个导电颗粒，其中绝缘粘合剂组分含有交联橡胶树脂。本发明的各向异性导电粘合剂通过在连接微电路时使其在聚合或硬化反应过程中发生的热收缩最小化来防止粘合剂的剥离或降低粘合强度，由此在相邻的在连接电路时可以防止电极，并且实现根据长期使用的良好的连接可靠性。

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