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1. 发明申请

US20090000807A1 Connecting Structure and Adhesion Method of Pcb Using Anisotropic Conductive Film, and Method for Evaluating Connecting Condition Using the Same 有权
标题翻译：使用各向异性导电膜的Pcb的连接结构和粘附方法以及使用其的连接条件的评价方法
公开(公告)号：US20090000807A1
公开(公告)日：2009-01-01
申请号：US12161487
申请日：2007-01-22
申请人： Chul-Jong Han , Yoon-Jae Chung , Jong-Yoon Jang , Jeong-Beom Park , Yong-Seok Han , Sung-Uk Choi , Il-Rae Cho , Hyuk-Soo Moon , Kyung-Joon Lee
发明人： Chul-Jong Han , Yoon-Jae Chung , Jong-Yoon Jang , Jeong-Beom Park , Yong-Seok Han , Sung-Uk Choi , Il-Rae Cho , Hyuk-Soo Moon , Kyung-Joon Lee
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K3/361 , H05K3/323 , H05K2201/091 , H05K2203/0278 , Y10T29/41 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144
摘要： A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.
摘要翻译：根据本发明的使用各向异性导电膜的PCB的连接结构，其具有通过使用包括绝缘粘合剂作为基底的各向异性导电膜和分散在绝缘粘合剂中的导电颗粒通过热压缩而彼此连接的构件，其中至少任何一个构件具有柔性，并且由于通过热压缩形成的凹痕，具有柔性的构件的表面粗糙度值（Ra）为0.1至5.0μm。

2. 发明授权

US07968977B2 Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same 有权
标题翻译：具有收缩剥离膜的切割膜和使用其的半导体封装的制造方法
公开(公告)号：US07968977B2
公开(公告)日：2011-06-28
申请号：US11009246
申请日：2004-12-10
申请人： Joon Mo Seo , Hyuk Soo Moon , Cheol Jong Han , Jong Geol Lee , Kyung Tae Wi
发明人： Joon Mo Seo , Hyuk Soo Moon , Cheol Jong Han , Jong Geol Lee , Kyung Tae Wi
IPC分类号： H01L23/58
CPC分类号： H01L21/78 , C09J7/22 , C09J7/35 , C09J2201/134 , C09J2203/326 , C09J2463/00 , C09J2467/006 , C09J2479/08 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83856 , H01L2224/85201 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/32245 , H01L2224/48247
摘要： The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.
摘要翻译：本发明涉及一种具有用于切割晶片的粘合剂膜和用于制造半导体封装的芯片粘合膜的切割膜以及使用其的半导体封装的制造方法。更具体地说，本发明涉及一种切割膜，其中将收缩剥离膜插入在用于切割晶片的粘合膜和模片粘合剂膜之间，使得模片粘合剂膜和模具可以容易地从用于切割的粘合剂膜分离拾取半导体管芯时的晶片，以及使用其制造半导体封装的方法。

3. 发明授权

US07105625B2 Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the same 有权
标题翻译：硅烷加合物，其制造方法以及使用该粘合剂和无机材料偶联的方法
公开(公告)号：US07105625B2
公开(公告)日：2006-09-12
申请号：US10652667
申请日：2003-08-29
申请人： Byoung Un Kang , Hyuk Soo Moon , Jong Kul Lee , Kyoung Tae Wi , Tae Sung Kim
发明人： Byoung Un Kang , Hyuk Soo Moon , Jong Kul Lee , Kyoung Tae Wi , Tae Sung Kim
IPC分类号： C07F7/08 , C07F7/10 , C08G59/14
CPC分类号： C08G59/306 , C08G59/3254 , C08G59/504 , C08L61/00 , C08L79/08 , C08L83/00 , C09J5/02 , C09J2400/123 , C09J2400/143 , C09J2400/163 , C09J2461/00 , C09J2479/00 , C09J2483/00 , H05K3/389
摘要： The present invention relates to silane adducts having a relatively higher adhesive strength as expressed formula X3SiR1, and manufacturing method thereof. wherein X is a hydrogenated form selected from one of epoxy compounds, amino compounds and bisphenolic, and R1 is selected from one of glycidyloxypropyl group, 2-(3,4-epoxycyclohexyl)ethyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, amino-propyl group, 3-[2-(2-aminoethylamino)ethylamino]propyl group, N-methylaminopropyl group, N-phenylaminopropyl group, N,N-dimethyl-3-aminopropyl group, mercapto-propyl group, cyano-propyl group, and isocyanato-propyl group.
摘要翻译：本发明涉及具有如表达式X 3 SiR 1 1的粘合强度相对较高的硅烷加成物及其制备方法。其中X是选自环氧化合物，氨基化合物和双酚的一种氢化形式，R 1选自缩水甘油氧基丙基，2-（3,4-环氧环己基）乙基，3- 丙烯酰氧基丙基，3-甲基丙烯酰氧基丙基，氨基丙基，3- [2-（2-氨基乙基氨基）乙基氨基]丙基，N-甲基氨基丙基，N-苯基氨基丙基，N，N-二甲基-3-氨基丙基，丙基，氰基丙基和异氰酸基 - 丙基。

4. 发明授权

US08101527B2 Dicing film having shrinkage release film and method for manufacturing semiconductor package using the same 有权
标题翻译：具有收缩剥离膜的切割膜及使用其制造半导体封装的方法
公开(公告)号：US08101527B2
公开(公告)日：2012-01-24
申请号：US12758505
申请日：2010-04-12
申请人： Joon Mo Seo , Hyuk Soo Moon , Cheol Jong Han , Jong Geol Lee , Kyung Tae Wi
发明人： Joon Mo Seo , Hyuk Soo Moon , Cheol Jong Han , Jong Geol Lee , Kyung Tae Wi
IPC分类号： H01L21/31
CPC分类号： H01L21/78 , C09J7/22 , C09J7/35 , C09J2201/134 , C09J2203/326 , C09J2463/00 , C09J2467/006 , C09J2479/08 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83856 , H01L2224/85201 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/32245 , H01L2224/48247
摘要： The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.
摘要翻译：本发明涉及一种具有用于切割晶片的粘合剂膜和用于制造半导体封装的芯片粘合膜的切割膜以及使用其的半导体封装的制造方法。更具体地说，本发明涉及一种切割膜，其中将收缩剥离膜插入在用于切割晶片的粘合膜和模片粘合剂膜之间，使得模片粘合剂膜和模具可以容易地从用于切割的粘合剂膜分离拾取半导体管芯时的晶片，以及使用其制造半导体封装的方法。

5. 发明申请

US20050016672A1 Melt-flow controlling method for elastomer by uv irradiation 审中-公开
标题翻译：通过紫外线照射进行弹性体的熔体流动控制
公开(公告)号：US20050016672A1
公开(公告)日：2005-01-27
申请号：US10494561
申请日：2002-10-18
申请人： Tae-Sung Kim , Hyuk-soo Moon , Jong-Kul Lee
发明人： Tae-Sung Kim , Hyuk-soo Moon , Jong-Kul Lee
IPC分类号： B29C65/52 , C09J4/06 , C09J5/00 , C09J7/02 , C09J201/00 , H01L21/52 , B32B31/00
CPC分类号： C09J7/38 , B29L2009/00 , C09J2205/31
摘要： A melt-flow controlling method for elastomer by uv irradiation for use in semiconductor packages by ultraviolet irradiation, in which a coated polymer composition is crosslinked by ultraviolet irradiation after a coating process of the polymer composition in producing the elastic adhesives. In producing the elastic adhesives for use as the thermal stress relief layer in semiconductor packages, the inventive method comprises irradiating the polymer composition with ultraviolet light of a 100-500 nm wavelength in order to control the flowability and crosslinking degree of the coated polymer composition. Thus, according to the present invention, a heating furnace is not used such that energy consumption can be reduced. Also, curing can be achieved in a short time so as to increase productivity, and the crosslinking degree is easily controlled by changing the ultraviolet dose as compared to the thermal crossliking process. Furthermore, an installation area of ultraviolet irradiation equipment is smaller than the heating furnace, and little or no epoxy reactive groups participate in the crosslinking reaction upon photo-polymerization so that the resulting film product has an excellent storage stability and thus a long life span.
摘要翻译：通过紫外线照射在紫外线照射下使用紫外线照射的弹性体的熔体流动控制方法，其中在制备弹性粘合剂的聚合物组合物的涂布工艺之后，通过紫外线照射将涂覆的聚合物组合物交联。在制造用作半导体封装中的热应力消除层的弹性粘合剂中，本发明的方法包括用100-500nm波长的紫外光照射聚合物组合物，以控制涂覆的聚合物组合物的流动性和交联度。因此，根据本发明，不使用加热炉，能够降低能量消耗。此外，可以在短时间内实现固化，从而提高生产率，并且通过与热交叉处理相比，通过改变紫外线剂量来容易地控制交联度。此外，紫外线照射设备的安装面积小于加热炉，并且在光聚合时很少或没有环氧反应性基团参与交联反应，使得所得膜产品具有优异的储存稳定性并因此具有长的使用寿命。

6. 发明申请

US20110290538A1 CONNECTING STRUCTURE AND ADHESION METHOD OF PCB USING ANISOTROPIC CONDUCTIVE FILM, AND METHOD FOR EVALUATING CONNECTING CONDITION USING THE SAME 审中-公开
标题翻译：使用各向异性导电膜的PCB的连接结构和粘合方法以及使用其评估连接条件的方法
公开(公告)号：US20110290538A1
公开(公告)日：2011-12-01
申请号：US13152000
申请日：2011-06-02
申请人： Chul-Jong HAN , Yoon-Jae CHUNG , Jong-Yoon JANG , Jeong-Beom PARK , Yong-Seok HAN , Sung-Uk CHOI , Il-Rae CHO , Hyuk-Soo MOON , Kyung-Joon LEE
发明人： Chul-Jong HAN , Yoon-Jae CHUNG , Jong-Yoon JANG , Jeong-Beom PARK , Yong-Seok HAN , Sung-Uk CHOI , Il-Rae CHO , Hyuk-Soo MOON , Kyung-Joon LEE
IPC分类号： H05K1/00
CPC分类号： H05K3/361 , H05K3/323 , H05K2201/091 , H05K2203/0278 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144
摘要： A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.
摘要翻译：根据本发明的使用各向异性导电膜的PCB的连接结构，其具有通过使用包括绝缘粘合剂作为基底的各向异性导电膜和分散在绝缘粘合剂中的导电颗粒通过热压缩而彼此连接的构件，其中至少任何一个构件具有柔性，并且由于通过热压缩形成的凹痕，具有柔性的构件的表面粗糙度值（Ra）为0.1〜5.0μm。

7. 发明授权

US07993417B2 Method of adhering a pair of members 有权
标题翻译：粘贴一对成员的方法
公开(公告)号：US07993417B2
公开(公告)日：2011-08-09
申请号：US12161487
申请日：2007-01-22
申请人： Chul-Jong Han , Yoon-Jae Chung , Jong-Yoon Jang , Jeong-Beom Park , Yong-Seok Han , Sung-Uk Choi , Il-Rae Cho , Hyuk-Soo Moon , Kyung-Joon Lee
发明人： Chul-Jong Han , Yoon-Jae Chung , Jong-Yoon Jang , Jeong-Beom Park , Yong-Seok Han , Sung-Uk Choi , Il-Rae Cho , Hyuk-Soo Moon , Kyung-Joon Lee
IPC分类号： H01L21/00
CPC分类号： H05K3/361 , H05K3/323 , H05K2201/091 , H05K2203/0278 , Y10T29/41 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144
摘要： A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.
摘要翻译：根据本发明的使用各向异性导电膜的PCB的连接结构，其具有通过使用包括绝缘粘合剂作为基底的各向异性导电膜和分散在绝缘粘合剂中的导电颗粒通过热压缩而彼此连接的构件，其中至少任何一个构件具有柔性，并且由于通过热压缩形成的凹痕，具有柔性的构件的表面粗糙度值（Ra）为0.1〜5.0μm。

8. 发明申请

US20090198013A1 ADHESIVE FILM FOR SEMICONDUCTOR 审中-公开
标题翻译：半导体贴膜
公开(公告)号：US20090198013A1
公开(公告)日：2009-08-06
申请号：US11915280
申请日：2005-10-31
申请人： Dong-Cheon Shin , Byoung-Un Kang , Tae-Hyun Sung , Jai-Hoon Kim , Kyung-Tae Wi , Joon-Mo Seo , Hyuk-Soo Moon
发明人： Dong-Cheon Shin , Byoung-Un Kang , Tae-Hyun Sung , Jai-Hoon Kim , Kyung-Tae Wi , Joon-Mo Seo , Hyuk-Soo Moon
IPC分类号： C08L63/00
CPC分类号： H01L24/83 , C09J7/35 , C09J163/00 , C09J2201/622 , C09J2203/326 , C09J2463/00 , H01L24/27 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29386 , H01L2224/2939 , H01L2224/8385 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05032
摘要： An adhesive film for semiconductor is disclosed. The present invention provides an adhesive film for semiconductor used in semiconductor packaging, comprising an adhesive layer, wherein the adhesive layer has surface tension of 19 to 52 erg/cm at 60 ° C. Accordingly, the adhesive film for semiconductor according to the present invention may prevent bubbles from being formed between the adhesive film and a supporting member by controlling surface tension in an optimum condition, and also obtain higher reliability in use of the adhesive film in the semi-conductor packaging by controlling tackiness and adhesive force in an optimum condition.
摘要翻译：公开了一种用于半导体的粘合膜。本发明提供一种半导体封装用半导体用粘接膜，其特征在于，具有粘合层，其粘合层在60℃下的表面张力为19〜52erg / cm。因此，本发明的半导体用粘接膜可以通过在最佳条件下控制表面张力来防止在粘合剂膜和支撑构件之间形成气泡，并且通过在最佳条件下控制粘性和粘合力，在半导体封装中使用粘合剂膜也获得更高的可靠性。

9. 发明申请

US20100197078A1 DICING FILM HAVING SHRINKAGE RELEASE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME. 有权
标题翻译：具有收缩膜的定影膜和使用其制造半导体封装的方法。
公开(公告)号：US20100197078A1
公开(公告)日：2010-08-05
申请号：US12758505
申请日：2010-04-12
申请人： Joon Mo Seo , Hyuk Soo Moon , Cheol Jong Han , Jong Geol Lee , Kyung Tae Wi
发明人： Joon Mo Seo , Hyuk Soo Moon , Cheol Jong Han , Jong Geol Lee , Kyung Tae Wi
IPC分类号： H01L21/50
CPC分类号： H01L21/78 , C09J7/22 , C09J7/35 , C09J2201/134 , C09J2203/326 , C09J2463/00 , C09J2467/006 , C09J2479/08 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83856 , H01L2224/85201 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/32245 , H01L2224/48247
摘要： The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.
摘要翻译：本发明涉及一种具有用于切割晶片的粘合剂膜和用于制造半导体封装的芯片粘合膜的切割膜以及使用其的半导体封装的制造方法。更具体地说，本发明涉及一种切割膜，其中将收缩剥离膜插入在用于切割晶片的粘合膜和模片粘合剂膜之间，使得模片粘合剂膜和模具可以容易地从用于切割的粘合剂膜分离拾取半导体管芯时的晶片，以及使用其制造半导体封装的方法。

10. 发明授权

US07408015B2 Reacting functionalized trialkoxysilane with polyepoxide or diamine to yield silane adduct 有权
标题翻译：用聚环氧化物或二胺反应官能化三烷氧基硅烷，得到硅烷加合物
公开(公告)号：US07408015B2
公开(公告)日：2008-08-05
申请号：US11311198
申请日：2005-12-19
申请人： Byoung Un Kang , Hyuk Soo Moon , Jong Kul Lee , Kyoung Tae Wi , Tae Sung Kim
发明人： Byoung Un Kang , Hyuk Soo Moon , Jong Kul Lee , Kyoung Tae Wi , Tae Sung Kim
IPC分类号： C07F7/08 , C07F7/10 , C08G59/14
CPC分类号： C08G59/306 , C08G59/3254 , C08G59/504 , C08L61/00 , C08L79/08 , C08L83/00 , C09J5/02 , C09J2400/123 , C09J2400/143 , C09J2400/163 , C09J2461/00 , C09J2479/00 , C09J2483/00 , H05K3/389
摘要： The present invention relates to silane adducts having a relatively higher adhesive strength as expressed formula X3SiR1, and manufacturing method thereof. wherein X is a hydrogenated form selected from one of epoxy compounds, amino compounds and bisphenolic, and R1 is selected from one of glycidyloxypropyl group, 2-(3,4-epoxycyclohexyl)ethyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, amino-propyl group, 3-[2-(2-aminoethylamino)ethylamino]propyl group, N-methylaminopropyl group, N-phenylaminopropyl group, N,N-dimethyl-3-aminopropyl group, mercapto-propyl group, cyano-propyl group, and isocyanato-propyl group.
摘要翻译：本发明涉及具有如表达式X 3 SiR 1 1的粘合强度相对较高的硅烷加成物及其制造方法。其中X是选自环氧化合物，氨基化合物和双酚的一种氢化形式，R 1选自缩水甘油氧基丙基，2-（3,4-环氧环己基）乙基，3- 丙烯酰氧基丙基，3-甲基丙烯酰氧基丙基，氨基丙基，3- [2-（2-氨基乙基氨基）乙基氨基]丙基，N-甲基氨基丙基，N-苯基氨基丙基，N，N-二甲基-3-氨基丙基，丙基，氰基丙基和异氰酸基 - 丙基。

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