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1. 发明专利

JP2007283100A Footwear incorporated with cushion and ventilator 审中-公开
标题翻译：鞋垫配有通风口和通风口
公开(公告)号：JP2007283100A
公开(公告)日：2007-11-01
申请号：JP2007101322
申请日：2007-04-09
申请人： ▲曹▼鐘守 , ▲鄭▼玄山 , Jong Soo Cho , Hyeon-San Jeong
发明人： CHO JONG SOO , JEONG HYEON-SAN
IPC分类号： A43B7/08
CPC分类号： A43B7/081 , A43B13/187 , A43B13/206 , A43B17/035 , A43B17/08
摘要： PROBLEM TO BE SOLVED: To heighten the restoring force of an air pump sucking air, to prevent an air passage from being closed in a heat fusion process, and to increase cushioning force by delaying the storage time of air to be stored in an air chamber as much as possible.
SOLUTION: In this footwear incorporated with a cushion and a ventilator, an air pump having an air discharge pipe on one side, a connecting pipeline connected to the air discharge pipe of the air pump, a cushion formed of an air tube having an air chamber and a ventilator are incorporated. The air pump is so constructed that an upper sheet having a hollow part is placed on a lower sheet having a suction hole, the peripheral surfaces of the upper sheet and the lower sheet are heat-fused with high frequency, and sponge having shrinkage force and restoring force is further built in the interiors of the upper sheet and the lower sheet.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提高空气泵吸入空气的恢复力，防止在热熔融过程中空气通道被关闭，并且通过延迟要储存的空气的储存时间来增加缓冲力一个空气室尽可能多。解决方案：在装有缓冲垫和呼吸机的鞋类中，一侧具有排气管的气泵，与空气泵的排气管连接的连接管路，由具有并入有一个空气室和一个呼吸机。该空气泵的结构使得具有中空部分的上部片材放置在具有吸入孔的下部片材上，上部片材和下部片材的周边表面被高频热熔融，并且具有收缩力的海绵和在上板和下板的内部进一步内置恢复力。版权所有（C）2008，JPO＆INPIT

2. 发明申请

US20080230915A1 SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY 审中-公开
标题翻译：使用Ag或Ag合金线的半导体封装
公开(公告)号：US20080230915A1
公开(公告)日：2008-09-25
申请号：US12051078
申请日：2008-03-19
申请人： Jong Soo CHO , Jeong Tak MOON
发明人： Jong Soo CHO , Jeong Tak MOON
IPC分类号： H01L23/49
CPC分类号： H01L24/48 , H01L24/05 , H01L24/45 , H01L24/49 , H01L24/85 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/45139 , H01L2224/45144 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48669 , H01L2224/49175 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/43 , H01L2924/01049
摘要： A semiconductor package using Ag or Ag alloy wire which can maintain superior reliability against a noble metal and lower its manufacturing cost is provided. The semiconductor package comprises a semiconductor substrate. A semiconductor chip is attached to the package substrate and has one or more pads which comprise a noble metal. And one or more wires are bonded so as to electrically connect the one or more pads and the package substrate and comprise Ag or Ag alloy.
摘要翻译：提供一种使用Ag或Ag合金线的半导体封装，其可以保持对贵金属的优异可靠性并降低其制造成本。半导体封装包括半导体衬底。半导体芯片附接到封装基板并且具有包括贵金属的一个或多个焊盘。并且一个或多个导线被接合以便电连接一个或多个焊盘和封装衬底并且包括Ag或Ag合金。

3. 发明授权

US06700199B2 Gold-silver bonding wire for semiconductor device 有权
标题翻译：用于半导体器件的金 - 银接合线
公开(公告)号：US06700199B2
公开(公告)日：2004-03-02
申请号：US10384027
申请日：2003-03-07
申请人： Jeong-Tak Moon , Jong-Soo Cho , Dong-Ho Joung
发明人： Jeong-Tak Moon , Jong-Soo Cho , Dong-Ho Joung
IPC分类号： H01L2348
CPC分类号： H01L24/45 , H01L24/43 , H01L2224/05554 , H01L2224/05624 , H01L2224/43 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/01205 , H01L2924/01327 , H01L2924/181 , H01L2924/20752 , H01L2924/01046 , H01L2924/01004 , H01L2924/0102 , H01L2924/00014 , H01L2924/01081 , H01L2924/00 , H01L2924/013
摘要： A gold-silver alloy bonding wire for a semiconductor device is provided. The bonding wire contains: a Au-Ag alloy including 5-40% Ag by weight in Au having a purity of 99.999% or greater; at least one element of a first group consisting of Pd, Rh, Pt, and Ir in an amount of about 50-10,000 ppm by weight; at least one element of a second group consisting of B, Be, and Ca in an amount of about 1-50 ppm by weight; at least one element of a third group consisting of P, Sb, and Bi in an amount of about 1-50 ppm by weight; and at least one element of a fourth group consisting of Mg, TI, Zn, and Sn in an amount of about 5-50 ppm by weight. The bonding wire is highly reliable with a strong tensile strength at room temperature and high temperature and favourable bondability. When the bonding wire is looped, no rupture occurs in a ball neck region. Also, no chip cracking occurs since the ball is soft.
摘要翻译：提供了一种用于半导体器件的金 - 银合金接合线。接合线包含：Au-Ag合金，其包含纯度为99.999％以上的Au中的重量比为5-40％的Ag; 由Pd，Rh，Pt和Ir组成的第一组中至少一种元素的量为约50-10,000ppm重量; 由B，Be和Ca组成的第二组的至少一种元素，其量为约1-50重量ppm; 由P，Sb和Bi组成的第三组中的至少一种元素，其量为约1-50重量ppm; 和由约5-50ppm重量的Mg，TI，Zn和Sn组成的第四组的至少一种元素。接合线高度可靠，在室温和高温下具有很强的拉伸强度和良好的粘合性。当接合线环绕时，在球颈区域中不会发生破裂。此外，由于球很软，因此不会出现切屑破裂。

4. 发明授权

US07493706B2 Shoe with cushion and ventilation device 失效
标题翻译：鞋垫与通风装置
公开(公告)号：US07493706B2
公开(公告)日：2009-02-24
申请号：US11412643
申请日：2006-04-27
申请人： Jong Soo Cho , Hyeon San Jeong
发明人： Jong Soo Cho , Hyeon San Jeong
IPC分类号： A43B7/06
CPC分类号： A43B7/081 , A43B13/203 , A43B17/08
摘要： Provided is a shoe with a cushion and ventilation device. The cushion and ventilation device includes an air pump having an air discharge tube provided at its one side, and an air tube having a connection pipe connecting to the air discharge tube of the air pump, and an air chamber, wherein the air pump is provided by placing an upper sheet having a cavity on a lower sheet having an intake hole, and thermally bonding circumference surfaces of the upper and lower sheets using microwave, and wherein the upper and lower sheets further comprise a sponge having contraction and restoring forces therein.
摘要翻译：提供一个带有坐垫和通风装置的鞋子。该缓冲和通风装置包括一个其一侧设置有排气管的空气泵，以及具有连接到空气泵的排气管的连接管的空气管和一个空气室，其中设置有空气泵通过将具有空腔的上片放置在具有进气孔的下片上，并且使用微波热粘合上片和下片的周面，并且其中所述上片和下片还包括其中具有收缩力和恢复力的海绵。

5. 发明授权

US08022541B2 Au-Ag based alloy wire for semiconductor package 失效
标题翻译：用于半导体封装的Au-Ag基合金丝
公开(公告)号：US08022541B2
公开(公告)日：2011-09-20
申请号：US11752729
申请日：2007-05-23
申请人： Jong Soo Cho , Yong Jin Park , Jeong Tak Moon , Eun Kyu Her , Kyu Hwan Oh
发明人： Jong Soo Cho , Yong Jin Park , Jeong Tak Moon , Eun Kyu Her , Kyu Hwan Oh
IPC分类号： H01L23/48
CPC分类号： H01L23/4952 , C22C5/02 , C22C30/00 , H01L24/45 , H01L2224/05624 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48624 , H01L2924/00011 , H01L2924/00014 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01042 , H01L2924/01043 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01204 , H01L2924/01327 , H01L2924/20752 , H01L2924/00 , H01L2924/013 , H01L2224/43 , H01L2924/01049
摘要： A gold-silver based wire for a semiconductor package has high humidity reliability as well as high dry reliability. The wire includes a first additive ingredient that contains 5˜15 wt % of at least one kind of elements from among first group elements composed of palladium (Pd) and platinum (Pt) added to a gold (Au)-silver (Ag) based alloy that contains 10˜40 wt % of Ag added to Au.
摘要翻译：用于半导体封装的金银基线具有高湿度可靠性以及高干燥可靠性。导线包括第一添加成分，其含有5〜15重量％的由添加到金（Au） - 银（Ag）基的钯（Pd）和铂（Pt）组成的第一组元素中的至少一种元素合金，其含有添加到Au中的10〜40重量％的Ag。

6. 发明申请

US20090220304A1 REMEDIATION WITH HYDROEXCAVATION AND SOLVENTS 审中-公开
标题翻译：与水力发电和溶剂的补救
公开(公告)号：US20090220304A1
公开(公告)日：2009-09-03
申请号：US12091698
申请日：2006-10-24
申请人： Jim Ballew , William Anderson , Jong Soo Cho , Mark Yeager , Lee Daniel Starnes
发明人： Jim Ballew , William Anderson , Jong Soo Cho , Mark Yeager , Lee Daniel Starnes
IPC分类号： B09C1/00
CPC分类号： B09C1/02 , B09C1/00 , B09C1/10
摘要： The present invention describes methods of contaminant removal and remediation utilizing hydroexcavation in Hydroexcavation of the soil combination with solvents and/or beneficial microbes, for primary scrubbing and high pressure mixing of the soil. Various embodiments of the present invention are useful for cleaning soil with contaminants, including but not limited to hydrocarbon based materials. The solvent used in conjunction with various embodiments of the present invention comprise a degreasing composition, which may comprise sodium silicate.
摘要翻译：本发明描述了利用水溶剂在与溶剂和/或有益微生物的土壤组合的水力裂化中进行污染物去除和修复的方法，用于初级洗涤和土壤的高压混合。本发明的各种实施方案对于用污染物清洁土壤是有用的，包括但不限于烃基材料。与本发明的各种实施方案结合使用的溶剂包含脱脂组合物，其可以包含硅酸钠。

7. 发明授权

US07254903B2 Footwear with ventilating and shock-absorbing device 失效
标题翻译：鞋类配有通风和减震装置
公开(公告)号：US07254903B2
公开(公告)日：2007-08-14
申请号：US11265663
申请日：2005-11-02
申请人： Jong Soo Cho , Hyeon San Jeong
发明人： Jong Soo Cho , Hyeon San Jeong
IPC分类号： A43B7/06
CPC分类号： A43B13/206 , A43B7/081 , A43B13/203 , A43B17/08
摘要： Disclosed is footwear including a ventilation and shock-absorbing device having an air pump and a check valve for passing air supplied by the air pump. The footwear includes an air chamber provided at a front of the check valve for storing the air supplied through an inlet passage connected to the check valve, and an air tube having one or more discharge holes for discharging the air stored in the air chamber into the footwear.
摘要翻译：公开了包括具有空气泵的通风和减震装置的鞋类，以及用于使由空气泵供给的空气通过的止回阀。鞋类包括设置在止回阀的前部的空气室，用于储存通过连接到止回阀的入口通道供应的空气，以及具有一个或多个排出孔的空气管，用于将存储在空气室中的空气排放到鞋类。

8. 发明申请

US20080240975A1 AG-BASED ALLOY WIRE FOR SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：基于AG的合金线用于半导体封装
公开(公告)号：US20080240975A1
公开(公告)日：2008-10-02
申请号：US12051371
申请日：2008-03-19
申请人： Jong Soo Cho , Jeong Tak Moon
发明人： Jong Soo Cho , Jeong Tak Moon
IPC分类号： C22C5/06 , C22C5/08
CPC分类号： C22C5/06 , C22C5/08 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48624 , H01L2924/00011 , H01L2924/01047 , H01L2924/00 , H01L2924/01078 , H01L2924/01046 , H01L2924/01045 , H01L2924/01076 , H01L2924/01079 , H01L2924/01028 , H01L2924/01029 , H01L2924/01004 , H01L2924/0102 , H01L2924/01012 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01039 , H01L2924/00015 , H01L2924/013 , H01L2924/00014 , H01L2924/01048 , H01L2924/01014 , H01L2924/01022 , H01L2924/00013 , H01L2924/01049
摘要： An Ag-based alloy wire for a semiconductor package is highly reliable and can be fabricated with low costs. The Ag-based alloy wire includes 0.05˜5 wt % of at least one kind of a first additive ingredient selected from the group consisting of platinum (Pt), palladium (Pd), rhodium (Rh), osmium (Os), gold (Au), and nickel (Ni), and Ag as a remainder.
摘要翻译：用于半导体封装的Ag基合金线是高度可靠的，并且可以以低成本制造。 Ag系合金丝包含0.05〜5重量％的选自铂（Pt），钯（Pd），铑（Rh），锇（Os），金（至少一种）的至少一种第一添加剂成分 Au）和镍（Ni），Ag作为余量。

9. 发明申请

US20070278634A1 AU-AG BASED ALLOY WIRE FOR SEMICONDUCTOR PACKAGE 失效
标题翻译：基于AU-AG的合金线用于半导体封装
公开(公告)号：US20070278634A1
公开(公告)日：2007-12-06
申请号：US11752729
申请日：2007-05-23
申请人： Jong Soo Cho , Yong Jin Park , Jeong Tak Moon , Eun Kyu Her , Kyu Hwan Oh
发明人： Jong Soo Cho , Yong Jin Park , Jeong Tak Moon , Eun Kyu Her , Kyu Hwan Oh
IPC分类号： H01L23/495
CPC分类号： H01L23/4952 , C22C5/02 , C22C30/00 , H01L24/45 , H01L2224/05624 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48624 , H01L2924/00011 , H01L2924/00014 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01042 , H01L2924/01043 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01204 , H01L2924/01327 , H01L2924/20752 , H01L2924/00 , H01L2924/013 , H01L2224/43 , H01L2924/01049
摘要： A gold-silver based wire for a semiconductor package has high humidity reliability as well as high dry reliability. The wire includes a first additive ingredient that contains 5˜15 wt % of at least one kind of elements from among first group elements composed of palladium (Pd) and platinum (Pt) added to a gold (Au)-silver (Ag) based alloy that contains 10˜40 wt % of Ag added to Au.
摘要翻译：用于半导体封装的金银基线具有高湿度可靠性以及高干燥可靠性。电线包括第一添加剂成分，其含有5〜15重量％的由添加到金（Au） - 银（Ag）基的钯（Pd）和铂（Pt）组成的第一组元素中的至少一种元素合金，其含有10〜40重量％的Ag添加到Au中。

10. 发明授权

US06991854B2 Gold alloy bonding wire for semiconductor device 失效
标题翻译：用于半导体器件的金合金接合线
公开(公告)号：US06991854B2
公开(公告)日：2006-01-31
申请号：US10626344
申请日：2003-07-24
申请人： Jong Soo Cho , Yong Jin Park , Sung Jae Hong
发明人： Jong Soo Cho , Yong Jin Park , Sung Jae Hong
IPC分类号： C22C5/02
CPC分类号： C22C5/02 , H01L24/43 , H01L24/45 , H01L2224/05554 , H01L2224/05624 , H01L2224/43 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/48624 , H01L2924/00011 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01023 , H01L2924/01029 , H01L2924/01042 , H01L2924/01043 , H01L2924/01047 , H01L2924/01049 , H01L2924/01057 , H01L2924/01061 , H01L2924/01079 , H01L2924/01084 , H01L2924/01327 , H01L2924/14 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00014 , H01L2924/01046 , H01L2924/01202 , H01L2924/0102 , H01L2924/01069 , H01L2924/00 , H01L2924/013 , H01L2924/01006
摘要： A gold (Au) alloy bonding wire for a semiconductor device is provided. The Au alloy bonding wire is manufactured by adding at least one of polonium (Po), promethium (Pm), thulium (Tm), and boron (B) to high-purity gold of 99.999% or more in an amount of 3–30 parts per million (ppm) by weight and at least one of magnesium (Mg), sodium (Na), vanadium (V), molybdenum (Mo), and technetium (Tc) in an amount of 3–30 ppm by weight to the high-purity gold. In the Au alloy bonding wire, high-temperature reliability after ball bonding is not reduced and damage near a ball neck in forming an ultra low loop of the Au alloy bonding wire can be prevented.
摘要翻译：提供了一种用于半导体器件的金（Au）合金接合线。 Au合金接合线通过将锑（Po），prom（Pm），ium（Tm）和硼（B）中的至少一种添加至99.999％以上的高纯度金的3-30 以重量计的百万分之几（ppm）和镁（Mg），钠（Na），钒（V），钼（Mo）和锝（Tc）中的至少一种，相对于高纯金。在Au合金接合线中，不会降低球接后的高温可靠性，并且可以防止形成Au合金接合线的超低回路的球颈附近的损伤。

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