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1. 发明授权

US08022541B2 Au-Ag based alloy wire for semiconductor package 失效
标题翻译：用于半导体封装的Au-Ag基合金丝
公开(公告)号：US08022541B2
公开(公告)日：2011-09-20
申请号：US11752729
申请日：2007-05-23
申请人： Jong Soo Cho , Yong Jin Park , Jeong Tak Moon , Eun Kyu Her , Kyu Hwan Oh
发明人： Jong Soo Cho , Yong Jin Park , Jeong Tak Moon , Eun Kyu Her , Kyu Hwan Oh
IPC分类号： H01L23/48
CPC分类号： H01L23/4952 , C22C5/02 , C22C30/00 , H01L24/45 , H01L2224/05624 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48624 , H01L2924/00011 , H01L2924/00014 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01042 , H01L2924/01043 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01204 , H01L2924/01327 , H01L2924/20752 , H01L2924/00 , H01L2924/013 , H01L2224/43 , H01L2924/01049
摘要： A gold-silver based wire for a semiconductor package has high humidity reliability as well as high dry reliability. The wire includes a first additive ingredient that contains 5˜15 wt % of at least one kind of elements from among first group elements composed of palladium (Pd) and platinum (Pt) added to a gold (Au)-silver (Ag) based alloy that contains 10˜40 wt % of Ag added to Au.
摘要翻译：用于半导体封装的金银基线具有高湿度可靠性以及高干燥可靠性。导线包括第一添加成分，其含有5〜15重量％的由添加到金（Au） - 银（Ag）基的钯（Pd）和铂（Pt）组成的第一组元素中的至少一种元素合金，其含有添加到Au中的10〜40重量％的Ag。

2. 发明授权

US06569378B2 Apparatus for manufacturing solder balls 失效
公开(公告)号：US06569378B2
公开(公告)日：2003-05-27
申请号：US09964305
申请日：2001-09-26
申请人： Jin-Hyung Lee , Byung Chul Moon , Jin Lee , Jeong-Tak Moon , Chang-Rok Oh , Jae Gyu Nam
发明人： Jin-Hyung Lee , Byung Chul Moon , Jin Lee , Jeong-Tak Moon , Chang-Rok Oh , Jae Gyu Nam
IPC分类号： B22F908
CPC分类号： B23K35/0244 , B22F1/0048 , B22F9/08 , B22F2009/086 , B22F2999/00 , Y10S75/953 , B22F2202/01
摘要： An apparatus for manufacturing solder balls including a tundish, a vibrator, a cooling liquid tank an inactive atmospheric chamber, a molten metal receiving tray, a ball collecting barrel, and a cooling liquid reservoir. The tundish has orifices at its bottom. The vibrator is immersed in the molten metal of the tundish and generates vibrations. The cooling liquid tank is situated under the tundish and is provided with a cooling liquid heater at its upper and middle outer surface, a cooling liquid cooler at its lower outer surface, and a cooling liquid discharge conduit at its top. The inactive atmospheric chamber is interposed between the bottom of the tundish and the op surface of the cooling liquid. The molten metal receiving tray is seated on a portion of the inactive atmospheric chamber and is horizontally movable. The ball collecting barrel is positioned under the cooling liquid tank and is provided with a cut-off valve at its top, a ball removing valve at its bottom, and a cooling liquid supply conduit at it s upper portion. The cooling liquid reservoir is situated under the ball collecting barrel, is provided with a ball collecting sieve at its inlet and is connected with the cooling liquid discharge conduit and the cooling liquid supply conduit.

3. 发明申请

US20080240975A1 AG-BASED ALLOY WIRE FOR SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：基于AG的合金线用于半导体封装
公开(公告)号：US20080240975A1
公开(公告)日：2008-10-02
申请号：US12051371
申请日：2008-03-19
申请人： Jong Soo Cho , Jeong Tak Moon
发明人： Jong Soo Cho , Jeong Tak Moon
IPC分类号： C22C5/06 , C22C5/08
CPC分类号： C22C5/06 , C22C5/08 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48624 , H01L2924/00011 , H01L2924/01047 , H01L2924/00 , H01L2924/01078 , H01L2924/01046 , H01L2924/01045 , H01L2924/01076 , H01L2924/01079 , H01L2924/01028 , H01L2924/01029 , H01L2924/01004 , H01L2924/0102 , H01L2924/01012 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01039 , H01L2924/00015 , H01L2924/013 , H01L2924/00014 , H01L2924/01048 , H01L2924/01014 , H01L2924/01022 , H01L2924/00013 , H01L2924/01049
摘要： An Ag-based alloy wire for a semiconductor package is highly reliable and can be fabricated with low costs. The Ag-based alloy wire includes 0.05˜5 wt % of at least one kind of a first additive ingredient selected from the group consisting of platinum (Pt), palladium (Pd), rhodium (Rh), osmium (Os), gold (Au), and nickel (Ni), and Ag as a remainder.
摘要翻译：用于半导体封装的Ag基合金线是高度可靠的，并且可以以低成本制造。 Ag系合金丝包含0.05〜5重量％的选自铂（Pt），钯（Pd），铑（Rh），锇（Os），金（至少一种）的至少一种第一添加剂成分 Au）和镍（Ni），Ag作为余量。

4. 发明申请

US20070278634A1 AU-AG BASED ALLOY WIRE FOR SEMICONDUCTOR PACKAGE 失效
标题翻译：基于AU-AG的合金线用于半导体封装
公开(公告)号：US20070278634A1
公开(公告)日：2007-12-06
申请号：US11752729
申请日：2007-05-23
申请人： Jong Soo Cho , Yong Jin Park , Jeong Tak Moon , Eun Kyu Her , Kyu Hwan Oh
发明人： Jong Soo Cho , Yong Jin Park , Jeong Tak Moon , Eun Kyu Her , Kyu Hwan Oh
IPC分类号： H01L23/495
CPC分类号： H01L23/4952 , C22C5/02 , C22C30/00 , H01L24/45 , H01L2224/05624 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48624 , H01L2924/00011 , H01L2924/00014 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01042 , H01L2924/01043 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01204 , H01L2924/01327 , H01L2924/20752 , H01L2924/00 , H01L2924/013 , H01L2224/43 , H01L2924/01049
摘要： A gold-silver based wire for a semiconductor package has high humidity reliability as well as high dry reliability. The wire includes a first additive ingredient that contains 5˜15 wt % of at least one kind of elements from among first group elements composed of palladium (Pd) and platinum (Pt) added to a gold (Au)-silver (Ag) based alloy that contains 10˜40 wt % of Ag added to Au.
摘要翻译：用于半导体封装的金银基线具有高湿度可靠性以及高干燥可靠性。电线包括第一添加剂成分，其含有5〜15重量％的由添加到金（Au） - 银（Ag）基的钯（Pd）和铂（Pt）组成的第一组元素中的至少一种元素合金，其含有10〜40重量％的Ag添加到Au中。

5. 发明申请

US20080230915A1 SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY 审中-公开
标题翻译：使用Ag或Ag合金线的半导体封装
公开(公告)号：US20080230915A1
公开(公告)日：2008-09-25
申请号：US12051078
申请日：2008-03-19
申请人： Jong Soo CHO , Jeong Tak MOON
发明人： Jong Soo CHO , Jeong Tak MOON
IPC分类号： H01L23/49
CPC分类号： H01L24/48 , H01L24/05 , H01L24/45 , H01L24/49 , H01L24/85 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/45139 , H01L2224/45144 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48669 , H01L2224/49175 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/43 , H01L2924/01049
摘要： A semiconductor package using Ag or Ag alloy wire which can maintain superior reliability against a noble metal and lower its manufacturing cost is provided. The semiconductor package comprises a semiconductor substrate. A semiconductor chip is attached to the package substrate and has one or more pads which comprise a noble metal. And one or more wires are bonded so as to electrically connect the one or more pads and the package substrate and comprise Ag or Ag alloy.
摘要翻译：提供一种使用Ag或Ag合金线的半导体封装，其可以保持对贵金属的优异可靠性并降低其制造成本。半导体封装包括半导体衬底。半导体芯片附接到封装基板并且具有包括贵金属的一个或多个焊盘。并且一个或多个导线被接合以便电连接一个或多个焊盘和封装衬底并且包括Ag或Ag合金。

6. 发明授权

US06700199B2 Gold-silver bonding wire for semiconductor device 有权
标题翻译：用于半导体器件的金 - 银接合线
公开(公告)号：US06700199B2
公开(公告)日：2004-03-02
申请号：US10384027
申请日：2003-03-07
申请人： Jeong-Tak Moon , Jong-Soo Cho , Dong-Ho Joung
发明人： Jeong-Tak Moon , Jong-Soo Cho , Dong-Ho Joung
IPC分类号： H01L2348
CPC分类号： H01L24/45 , H01L24/43 , H01L2224/05554 , H01L2224/05624 , H01L2224/43 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/01205 , H01L2924/01327 , H01L2924/181 , H01L2924/20752 , H01L2924/01046 , H01L2924/01004 , H01L2924/0102 , H01L2924/00014 , H01L2924/01081 , H01L2924/00 , H01L2924/013
摘要： A gold-silver alloy bonding wire for a semiconductor device is provided. The bonding wire contains: a Au-Ag alloy including 5-40% Ag by weight in Au having a purity of 99.999% or greater; at least one element of a first group consisting of Pd, Rh, Pt, and Ir in an amount of about 50-10,000 ppm by weight; at least one element of a second group consisting of B, Be, and Ca in an amount of about 1-50 ppm by weight; at least one element of a third group consisting of P, Sb, and Bi in an amount of about 1-50 ppm by weight; and at least one element of a fourth group consisting of Mg, TI, Zn, and Sn in an amount of about 5-50 ppm by weight. The bonding wire is highly reliable with a strong tensile strength at room temperature and high temperature and favourable bondability. When the bonding wire is looped, no rupture occurs in a ball neck region. Also, no chip cracking occurs since the ball is soft.
摘要翻译：提供了一种用于半导体器件的金 - 银合金接合线。接合线包含：Au-Ag合金，其包含纯度为99.999％以上的Au中的重量比为5-40％的Ag; 由Pd，Rh，Pt和Ir组成的第一组中至少一种元素的量为约50-10,000ppm重量; 由B，Be和Ca组成的第二组的至少一种元素，其量为约1-50重量ppm; 由P，Sb和Bi组成的第三组中的至少一种元素，其量为约1-50重量ppm; 和由约5-50ppm重量的Mg，TI，Zn和Sn组成的第四组的至少一种元素。接合线高度可靠，在室温和高温下具有很强的拉伸强度和良好的粘合性。当接合线环绕时，在球颈区域中不会发生破裂。此外，由于球很软，因此不会出现切屑破裂。

7. 发明授权

US06312498B1 Method of manufacturing solder balls 有权
标题翻译：制造焊球的方法
公开(公告)号：US06312498B1
公开(公告)日：2001-11-06
申请号：US09460573
申请日：1999-12-14
申请人： Jin-Hyung Lee , Byung Chul Moon , Jin Lee , Jeong-Tak Moon , Chang-Rok Oh , Jae Gyu Nam
发明人： Jin-Hyung Lee , Byung Chul Moon , Jin Lee , Jeong-Tak Moon , Chang-Rok Oh , Jae Gyu Nam
IPC分类号： B22F908
CPC分类号： B23K35/0244 , B22F1/0048 , B22F9/08 , B22F2009/086 , B22F2999/00 , Y10S75/953 , B22F2202/01
摘要： Method for manufacturing solder balls is disclosed. The apparatus comprises a tundish, a vibrator, a cooling liquid tank, an inactive atmospheric chamber, a molten metal receiving tray, a ball collecting barrel and a cooling liquid reservoir. The tundish has orifices at its bottom. The vibrator is immersed in the molten metal of the tundish and generates vibrations. The cooling liquid tank is situated under the tundish and is provided with a cooling liquid heater at its upper and middle outer surface and a cooling liquid cooler at its lower outer surface. The inactive atmospheric chamber is interposed between the bottom of the tundish and the top surface of the cooling liquid. The molten metal receiving tray is seated on a portion of the inactive atmospheric chamber and is horizontally movable. The ball collecting barrel is positioned under the cooling liquid tank and is provided with a cut-off valve at its top, a ball removing valve at its bottom and a cooling liquid supply conduit at its upper portion.
摘要翻译：公开了制造焊球的方法。该装置包括中间包，振动器，冷却液罐，无效大气室，熔融金属接收托盘，球收集筒和冷却液储存器。中间包底部有孔。振动器浸入中间包的熔融金属中并产生振动。冷却液箱位于中间包下方，在其中部外表面设有冷却液加热器，在其下外表面设有冷却液冷却器。惰性气氛室介于中间包的底部和冷却液的上表面之间。熔融金属接收托盘位于非活动大气室的一部分上并且可水平移动。集尘筒位于冷却液箱下方，在其顶部设有截止阀，底部设有截止阀，其上部设有冷却液供给管。

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