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    • 1. 发明申请
    • DEVICE AND METHOD FOR MEASURING VIA HOLE OF SILICON WAFER
    • 用于通过硅波孔测量的装置和方法
    • US20130206992A1
    • 2013-08-15
    • US13820575
    • 2011-06-24
    • Jong Han JinJae Wan KimJong Ahn KimChu-Shik Kang
    • Jong Han JinJae Wan KimJong Ahn KimChu-Shik Kang
    • G01B11/22G01B11/12
    • G01B11/22G01B9/02008G01B11/12G01B2210/56G01N21/9501G01N2021/95653
    • The present invention pertains to a device and a method for measuring a via hole of a silicon wafer, wherein it is possible to precisely measure the depth of the via hole without damaging the wafer. Broadband infrared light is radiated to a silicon wafer which has a superior light transmission property, so that the depth of the via hole may be measured from the light which is reflected from each boundary surface of the wafer and the interference signal of reference light. The via hole measuring device according to the present invention includes: a light source unit for generating broadband infrared light; and an interferometer for radiating the light generated from the light source unit to a silicon wafer, so as to measure the depth of a via hole formed on the wafer according to the spectrum period of the interference signal of the light, which is reflected from the silicon wafer.
    • 本发明涉及用于测量硅晶片的通孔的装置和方法,其中可以精确地测量通孔的深度而不损坏晶片。 宽带红外光被照射到具有优异的透光性的硅晶片,从而可以从从晶片的每个边界面反射的光和参考光的干涉信号测量通孔的深度。 根据本发明的通孔测量装置包括:用于产生宽带红外光的光源单元; 以及干涉仪,用于将从光源单元产生的光发射到硅晶片,以便根据光的干涉信号的光谱周期来测量形成在晶片上的通孔的深度,该距离从 硅晶片。