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1. 发明授权

US06173489B1 Organic substrate (PCB) slip plane “stress deflector” for flip chip devices 失效
标题翻译：倒装芯片器件的有机衬底（PCB）滑平面“应力偏转器”
公开(公告)号：US06173489B1
公开(公告)日：2001-01-16
申请号：US09032628
申请日：1998-02-27
申请人： John F. McMahon , Ravi Mahajan
发明人： John F. McMahon , Ravi Mahajan
IPC分类号： H05K334
CPC分类号： H01L23/49822 , H01L23/49816 , H01L2224/16 , H05K1/0271 , H05K1/118 , H05K3/0058 , H05K3/3436 , H05K2201/068 , H05K2201/09109 , H05K2201/10674 , H05K2201/10734 , Y10T29/4913 , Y10T29/49144
摘要： A flip chip integrated circuit package which provides stress relief for the solder bumps of the package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is attached to a plurality of bond pads of the substrate by a number of corresponding solder bumps. The substrate has a first layer that is attached to a second layer. An area that is located between the layers and adjacent to the bond pads is left unattached so that a portion of the first layer can move independent of the remaining portion of the substrate. The unattached area allows the integrated circuit to “float” and expand at a different rate than the substrate when the package is thermally cycled.
摘要翻译：一种倒装芯片集成电路封装，为封装的焊料凸块提供应力消除。封装包括一个安装在基板上的集成电路。集成电路通过多个对应的焊料凸点附着到衬底的多个接合焊盘。衬底具有附接到第二层的第一层。位于层之间并且与接合焊盘相邻的区域不附着，使得第一层的一部分可以独立于衬底的剩余部分移动。未连接区域允许集成电路在封装热循环时以与衬底不同的速率“漂浮”并膨胀。

2. 发明授权

US5321583A Electrically conductive interposer and array package concept for interconnecting to a circuit board 失效
标题翻译：用于与电路板互连的导电插入器和阵列封装概念
公开(公告)号：US5321583A
公开(公告)日：1994-06-14
申请号：US984335
申请日：1992-12-02
申请人： John F. McMahon
发明人： John F. McMahon
IPC分类号： H01R4/28 , H01R12/71 , H01R13/24 , H05K3/32 , H05K7/10 , H05K7/12
CPC分类号： H01R13/2414 , H01R12/714 , H05K3/325 , H05K7/1061 , H01R4/28
摘要： An electronic assembly that includes an electronic package which is coupled to a circuit board by a plurality of metal spheres that are captured by an interposer. The metal spheres electrically couple a plurality of first conductive pads on the electronic package with a plurality of second conductive pads on the circuit board. The spheres are pressed into operative contact with the conductive pads by a clamp adapted to apply a pressure to the electronic package. The metal spheres are captured by the interposer so that the spheres can rotate relative to the electronic package and the circuit board. The rotating spheres function as bearings which allow the interposer and package to be removed from the clamp and board without detaching the clamp. The electronic package can be coupled to the circuit board by merely pushing the package and interposer between the clamp and board until the metal spheres are properly aligned with the conductive pads.
摘要翻译：一种电子组件，其包括电子封装，该电子封装通过由插入器捕获的多个金属球耦合到电路板。金属球将电子封装上的多个第一导电焊盘与电路板上的多个第二导电焊盘电耦合。通过适于向电子包装施加压力的夹具将球体压制成与导电垫片操作性接触。金属球体被插入器捕获，使得球体可以相对于电子封装件和电路板旋转。旋转球体用作轴承，允许插入器和封装从夹具和板上拆卸而不拆卸夹具。电子封装可以通过仅将封装和插入件夹在夹具和板之间而连接到电路板，直到金属球与导电垫正确对准。

3. 外观设计

USD244953S Toy wheeled figure 失效
公开(公告)号：USD244953S
公开(公告)日：1977-07-05
申请号：US646207
申请日：1976-01-02
申请人： John F. McMahon
设计人： John F. McMahon

4. 外观设计

USD244950S Toy wheeled figure 失效
公开(公告)号：USD244950S
公开(公告)日：1977-07-05
申请号：US646204
申请日：1976-01-02
申请人： John F. McMahon
设计人： John F. McMahon

5. 发明授权

US06890798B2 Stacked chip packaging 失效
标题翻译：堆叠芯片封装
公开(公告)号：US06890798B2
公开(公告)日：2005-05-10
申请号：US09768580
申请日：2001-01-23
申请人： John F. McMahon
发明人： John F. McMahon
IPC分类号： H01L23/498 , H01L25/065 , H01L21/48
CPC分类号： H01L23/49833 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L25/18 , H01L2224/05599 , H01L2224/16145 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49109 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/19041 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2924/00012
摘要： A multi-chip package and a method of manufacturing the same. The multi-chip package of the present invention has a plurality of shelves. A first semiconductor is electrically coupled to at least one of the package's shelves. A second semiconductor die is electrically coupled to at least one of the package's shelves, wherein the second semiconductor die is above said first semiconductor die.
摘要翻译：一种多芯片封装及其制造方法。本发明的多芯片封装具有多个搁架。第一半导体电耦合到封装的搁架中的至少一个。第二半导体管芯电耦合到封装的搁架中的至少一个，其中第二半导体管芯位于所述第一半导体管芯之上。

6. 发明授权

US5375041A Ra-tab array bump tab tape based I.C. package 失效
标题翻译： Ra-tab阵列凸点胶带包
公开(公告)号：US5375041A
公开(公告)日：1994-12-20
申请号：US985175
申请日：1992-12-02
申请人： John F. McMahon
发明人： John F. McMahon
IPC分类号： H01L23/495 , H05K1/00
CPC分类号： H01L24/50 , H01L23/49534 , H01L23/49572 , H01L2224/49109 , H01L24/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/01088 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15747 , H01L2924/30107 , H01L2924/3011 , Y10T29/49121 , Y10T29/49128
摘要： An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top surface of the substrate. The flexible circuit has a plurality of metal pads located adjacent to the bottom surface of the substrate. The flexible circuit also contains a power/ground plane and a number of conductive signal lines that couple the integrated circuit to the metal pads. The pads can be soldered to a printed circuit board to electrically couple the integrated circuit to the board.
摘要翻译：一种包括缠绕在金属基底上的柔性电路的电子封装组件。柔性电路的引线连接到安装到基板的顶表面的集成电路。柔性电路具有邻近基板的底表面定位的多个金属焊盘。柔性电路还包含将集成电路耦合到金属焊盘的电源/接地平面和多条导电信号线。焊盘可以焊接到印刷电路板，以将集成电路电耦合到电路板。

7. 发明授权

US5476401A Compact water jet propulsion system for a marine vehicle 失效
标题翻译：紧凑型水上喷气推进系统
公开(公告)号：US5476401A
公开(公告)日：1995-12-19
申请号：US314301
申请日：1994-09-30
申请人： Frank B. Peterson , Charles M. Dai , John F. McMahon
发明人： Frank B. Peterson , Charles M. Dai , John F. McMahon
IPC分类号： B63H11/08 , B63H11/103
CPC分类号： B63H11/08
摘要： The invention is directed to an improved water jet propulsion system for a marine vehicle. The water jet propulsion system of the present invention incorporates an unconventional and compact design including a short, steep, hydrodynamically designed inlet duct adapted for mounting to the surface of the vehicle hull and extending internally thereof, a water jet pump having an inlet end attached to the outlet end of the inlet duct, a motor for rotating the pump impeller, a drive shaft located completely outside of the flow path connecting the motor with the pump impeller, a flow passage for discharging accelerated flow received from the pump in a generally rearward direction, and a steering and reversing mechanism pivotably mounted about a substantially vertical axis to the aft portion of the vehicle hull for redirect accelerated flow received from the outlet nozzle so as to provide maneuvering capability to the vehicle.
摘要翻译：本发明涉及用于船用车辆的改进的水喷射推进系统。本发明的喷水推进系统包括非常规且紧凑的设计，包括适于安装到车体表面并在其内部延伸的短，陡，流体动力学设计的入口管道，水喷射泵，其入口端连接到入口管道的出口端，用于旋转泵叶轮的马达，完全位于将马达与泵叶轮连接的流动路径外侧的驱动轴，用于沿大致向后的方向排出从泵接收的加速流的流动通道以及转向和反向机构，该转向和反向机构绕着基本上垂直的轴线枢转地安装到车身的后部，用于从出口喷嘴接收的重定向加速流，从而为车辆提供操纵能力。

8. 发明授权

US5307240A Chiplid, multichip semiconductor package design concept 失效
标题翻译： Chiplid，多芯片半导体封装设计理念
公开(公告)号：US5307240A
公开(公告)日：1994-04-26
申请号：US985209
申请日：1992-12-02
申请人： John F. McMahon
发明人： John F. McMahon
IPC分类号： H01L23/13 , H01L25/065 , H01L25/18 , H05K7/00
CPC分类号： H01L25/18 , H01L23/13 , H01L25/0657 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2225/0651 , H01L2225/06555 , H01L2225/06589 , H01L2225/06596 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/3011
摘要： An electronic package assembly which has a first electrical device mounted to a housing and a second electrical device attached to the lid of the package. The first and second devices are completely encapsulated by the lid and housing, and are typically coupled to a printed circuit board by pads on the bottom surface of the package. The electrical devices may be active or passive elements that are coupled together by conductive pads located on the top and bottom surfaces of the housing and lid, respectively. The conductive pads are typically soldered together when the lid is attached to the housing.
摘要翻译：一种电子封装组件，其具有安装到壳体的第一电气装置和附接到封装盖的第二电气装置。第一和第二装置由盖和壳完全封装，并且通常通过封装底表面上的焊盘耦合到印刷电路板。电气装置可以是分别通过位于壳体和盖的顶表面和底表面上的导电垫连接在一起的有源或无源元件。当盖附接到壳体时，导电垫通常被焊接在一起。

9. 外观设计

USD256816S Toy glider 失效
公开(公告)号：USD256816S
公开(公告)日：1980-09-09
申请号：US909812
申请日：1978-05-26
申请人： John F. McMahon , Arthur P. Venditti
设计人： John F. McMahon , Arthur P. Venditti

10. 外观设计

USD244955S Toy wheeled figure 失效
公开(公告)号：USD244955S
公开(公告)日：1977-07-05
申请号：US646209
申请日：1976-01-02
申请人： John F. McMahon
设计人： John F. McMahon

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