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1. 发明授权

US06689976B1 Electrically isolated liquid metal micro-switches for integrally shielded microcircuits 失效
公开(公告)号：US06689976B1
公开(公告)日：2004-02-10
申请号：US10266872
申请日：2002-10-08
申请人： Lewis R Dove , John F Casey , Marvin Glenn Wong
发明人： Lewis R Dove , John F Casey , Marvin Glenn Wong
IPC分类号： H01H2900
CPC分类号： H01H1/0036 , H01H29/28 , H01H61/00 , H01H2029/008 , H01H2061/006
摘要： Liquid metal micro-switches. Liquid metal micro-switches and techniques for fabricating them in integrally shielded microcircuits are disclosed. The liquid metal micro-switches can be integrated directly into the construction of shielded thick film microwave modules. This integration is useful in applications requiring high frequency switching with high levels of electrical isolation.

2. 发明授权

US06563191B1 Interdigitated capacitor with dielectric overlay 失效
标题翻译：电介质叠层电容器
公开(公告)号：US06563191B1
公开(公告)日：2003-05-13
申请号：US09690075
申请日：2000-10-16
申请人： John F. Casey , J. Mark Foster
发明人： John F. Casey , J. Mark Foster
IPC分类号： H01L2900
CPC分类号： H01L28/86 , H01L27/0805
摘要： A preferred method includes providing a substrate and depositing a capacitor material upon the substrate. A portion of the capacitor material is then removed to form an interdigitated capacitor structure that incorporates a first contact and a second contact. Thereafter, a dielectric material is applied upon the interdigitated capacitor structure so that the structure is at least partially encapsulated by the substrate and the dielectric material. Capacitor structures also are provided.
摘要翻译：优选的方法包括提供衬底并将电容器材料沉积在衬底上。然后去除电容器材料的一部分以形成包含第一接触和第二接触的叉指电容器结构。此后，将介电材料施加到交错电容器结构上，使得该结构至少部分地被衬底和电介质材料封装。还提供电容结构。

3. 发明授权

US06534844B1 Integrated decoupling networks fabricated on a substrate having shielded quasi-coaxial conductors 失效
标题翻译：在具有屏蔽准同轴导体的基板上制造的集成去耦网络
公开(公告)号：US06534844B1
公开(公告)日：2003-03-18
申请号：US10021380
申请日：2001-10-30
申请人： Lewis R Dove , John F Casey , Anthony R Blume
发明人： Lewis R Dove , John F Casey , Anthony R Blume
IPC分类号： H01L2900
CPC分类号： H05K1/162 , H01L23/66 , H01L24/48 , H01L2223/6622 , H01L2223/6627 , H01L2224/05599 , H01L2224/48091 , H01L2224/484 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01058 , H01L2924/01068 , H01L2924/01072 , H01L2924/01079 , H01L2924/1903 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0221 , H05K1/0306 , H05K1/167 , H05K2201/09672 , H05K2201/09809 , H05K2201/09981 , H01L2224/45099
摘要： A hybrid circuit having a quasi-coaxial fully shielded conductor, and incorporating a ground plane on the component side of a substrate, can bypass and/or filter a signal using integrated thick film components and without through holes or vias. A thin pad of suitable dielectric material may be printed onto the ground plane and then have a layer of metal deposited on its top surface, forming a bypass capacitor. The bypass capacitor can be located very near where it is needed, and only a very short conductor is required to connect the metallic top of the bypass capacitor to the location to be bypassed. The short connecting conductor does not go from one side of the substrate to the other, and the thickness and low dielectric constant of the substrate do not compromise the value of the bypass capacitor. Thick film resistors can be included to form filters, and surface mount resistors and capacitors can be used also.
摘要翻译：具有准同轴全屏蔽导体并且在基板的部件侧上并入接地平面的混合电路可以使用集成的厚膜部件并且没有通孔或通孔来旁路和/或滤波信号。可以将合适介电材料的薄垫片印刷到接地平面上，然后在其顶表面上沉积一层金属，形成旁路电容器。旁路电容器可以非常靠近需要的位置，并且只需要非常短的导体将旁路电容器的金属顶部连接到要旁路的位置。短连接导体不从衬底的一侧到另一侧，并且衬底的厚度和低介电常数不会损害旁路电容器的值。可以包括厚膜电阻器以形成滤波器，并且还可以使用表面贴装电阻器和电容器。

4. 发明授权

US06187372B1 Method for producing large area thick film resistors with uniform thickness 失效
标题翻译：生产厚度均匀的大面积厚膜电阻的方法
公开(公告)号：US06187372B1
公开(公告)日：2001-02-13
申请号：US09301898
申请日：1999-04-29
申请人： Rosemary O Johnson , John F Casey , Lewis R Dove
发明人： Rosemary O Johnson , John F Casey , Lewis R Dove
IPC分类号： B05D512
CPC分类号： H01C17/065 , H05K1/167 , H05K3/1233
摘要： A method for creating large area, thick film resistors with improved predictability and uniformity. “Tent poles” are employed during the printing of the large area resistors to prop up the screen mesh to ensure the resultant resistor does not have a scooped out center portion. The tent poles can be made from gold pads, resistor spots or emulsion spots.
摘要翻译：一种创建具有改进的可预测性和均匀性的大面积厚膜电阻器的方法。在打印大面积电阻器期间采用“帐篷杆”来支撑筛网，以确保所得到的电阻器不具有舀出的中心部分。帐篷杆可以由金垫，电阻点或乳液点制成。

5. 发明授权

US07265043B2 Methods for making microwave circuits 失效
标题翻译：制作微波电路的方法
公开(公告)号：US07265043B2
公开(公告)日：2007-09-04
申请号：US11510102
申请日：2006-08-25
申请人： John F. Casey , Lewis R. Dove , Ling Liu , James R. Drehle , R. Frederick Rau, Jr. , Rosemary O. Johnson , Julius Botka
发明人： John F. Casey , Lewis R. Dove , Ling Liu , James R. Drehle , R. Frederick Rau, Jr. , Rosemary O. Johnson , Julius Botka
IPC分类号： H01L21/44
CPC分类号： H05K1/0221 , H01C17/065 , H01L2924/0002 , H01P11/003 , H05K1/0237 , H05K1/053 , H05K1/092 , H05K1/167 , H05K3/06 , H05K3/4664 , H05K2201/09809 , H05K2201/09981 , H05K2203/1476 , H01L2924/00
摘要： Disclosed are methods for making microwave circuits using thickfilm components. In an embodiment, the method includes depositing a dielectric over a ground plane, and then forming a conductor on the dielectric. The conductor is formed by depositing a conductive thickfilm on the dielectric and then “subsintering” the conductive thickfilm. In one embodiment, before the subsintering, the conductive thickfilm is patterned to define at least one conductor. In another embodiment, after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired at a full sintering temperature.
摘要翻译：公开了使用厚膜组件制造微波电路的方法。在一个实施例中，该方法包括在接地平面上沉积电介质，然后在电介质上形成导体。导体通过在电介质上沉积导电厚膜并且然后“导通”导电厚膜形成。在一个实施例中，在子切割之前，将导电厚膜图案化以限定至少一个导体。在另一个实施例中，在子切换之后，将导电厚膜图案化以限定至少一个导体。在再次切割之后，蚀刻导电厚膜以暴露导体，然后在完全烧结温度下对导体进行烧制。

6. 发明授权

US07098413B2 Photoimaged channel plate for a switch, and method for making a switch using same 失效
标题翻译：用于开关的光电通道板，以及使用该开关的开关的方法
公开(公告)号：US07098413B2
公开(公告)日：2006-08-29
申请号：US11047949
申请日：2005-01-31
申请人： Marvin Glenn Wong , John F. Casey
发明人： Marvin Glenn Wong , John F. Casey
IPC分类号： H01H29/00
CPC分类号： H01H1/0036 , H01H2029/008
摘要： Disclosed herein is a channel plate for a fluid-based switch. The channel plate is produced by 1) depositing a photoimagable dielectric layer onto a substrate, 2) photoimaging at least one channel plate feature on the dielectric layer, and 3) developing the dielectric layer to form the at least one channel plate feature in the dielectric layer, thereby forming the channel plate. A method for making a switch with a photoimaged channel plate is also disclosed.
摘要翻译：本文公开了一种用于基于流体的开关的通道板。通道板通过以下步骤制造：1）将光可塑性介电层沉积到基底上，2）对电介质层上的至少一个通道板特征进行光成像，以及3）显影介电层以形成电介质中的至少一个通道板特征从而形成通道板。还公开了一种用光电传导通道板进行开关的方法。

7. 发明授权

US07022251B2 Methods for forming a conductor on a dielectric 失效
标题翻译：在电介质上形成导体的方法
公开(公告)号：US07022251B2
公开(公告)日：2006-04-04
申请号：US10601042
申请日：2003-06-19
申请人： John F. Casey , Lewis R. Dove , Ling Liu , James R. Drehle , R. Frederick Rau, Jr. , Rosemary O. Johnson
发明人： John F. Casey , Lewis R. Dove , Ling Liu , James R. Drehle , R. Frederick Rau, Jr. , Rosemary O. Johnson
IPC分类号： C23F1/00
CPC分类号： H01P11/003 , H05K1/0306 , H05K1/092 , H05K3/06 , H05K3/38 , H05K2203/1131 , H05K2203/1476 , Y10T29/49155 , Y10T29/49156 , Y10T29/49163
摘要： Disclosed is a method for forming a conductor on a dielectric. The method commences with the deposition of a conductive thickfilm on the dielectric, followed by a “subsintering” of the conductive thickfilm. Either before or after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired. A brief chemical etch may be used after the final firing step if improved wire-bondability is required.
摘要翻译：公开了一种在电介质上形成导体的方法。该方法开始于在电介质上沉积导电厚膜，接着是导电厚膜的“次级”。在接下来的切割之前或之后，导电厚膜被图案化以限定至少一个导体。在次切割之后，蚀刻导电厚膜以暴露导体，然后将导体烧制。如果需要改进的引线接合性，则在最后的烧制步骤之后可以使用简单的化学蚀刻。

8. 发明授权

US06777630B1 Liquid metal micro switches using as channels and heater cavities matching patterned thick film dielectric layers on opposing thin ceramic plates 失效
标题翻译：液态金属微动开关，用作通道和加热器腔体，在相对的薄陶瓷板上匹配图案化的厚膜电介质层
公开(公告)号：US06777630B1
公开(公告)日：2004-08-17
申请号：US10426449
申请日：2003-04-30
申请人： Lewis R Dove , Paul Thomas Carson , John F Casey , Marvin Glenn Wong
发明人： Lewis R Dove , Paul Thomas Carson , John F Casey , Marvin Glenn Wong
IPC分类号： H01H2900
CPC分类号： H01H1/0036 , H01H29/28 , H01H2029/008 , H01H2061/006
摘要： An efficient way to fabricate the channels and cavities in a LIMMS device is to form them as matching upper and lower portions each created as a patterned layer of thick film dielectric material deposited on a respective upper or lower substrate. The two portions are adhered together by a patterned layer of adhesive, and hermetically sealed around an outer perimeter. The heater resistors are mounted atop the lower layer, thus suspending them away from that substrate and exposing more of their surface area. Vias can be used to route the conductors for the heaters and the switched signal contacts through the lower substrate to cooperate with surface mount techniques using solder balls on an array of contact pads. These vias can be made hermetic by their placement within the patterned layers of dielectric material and by covering their exposed ends with pads of hermetic metal. Suitable thick film dielectric materials that may be deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heracus and the 4141A/D thick film compositions from DuPont.
摘要翻译：在LIMMS装置中制造通道和空腔的有效方法是将它们形成为匹配上部和下部，每个上部和下部被形成为沉积在相应的上部或下部基底上的厚膜介电材料的图案化层。两个部分通过图案化的粘合剂层粘合在一起，并围绕外周密封。加热电阻器安装在下层的顶部，从而将它们悬挂在远离基板并暴露出更多的表面积。通孔可用于将加热器的导体和切换的信号触点通过下基板布线，以使用在接触焊盘阵列上的焊球的表面贴装技术配合。这些通孔可以通过它们放置在图案化的电介质材料层内并通过用气密金属垫覆盖其暴露的末端而形成为气密的。可以作为糊料沉积并随后固化的合适的厚膜电介质材料包括来自Heraeus的KQ 150和KQ 115厚膜电介质和来自DuPont的4141A / D厚膜组合物。

9. 发明授权

US5789999A Distributed lossy capacitive circuit element with two resistive layers 失效
标题翻译：具有两个电阻层的分布式有损电容电路元件
公开(公告)号：US5789999A
公开(公告)日：1998-08-04
申请号：US743442
申请日：1996-11-01
申请人： Ron Barnett , John F. Casey
发明人： Ron Barnett , John F. Casey
IPC分类号： H01G4/33 , H01C1/02 , H01C7/00 , H01G4/35 , H01G4/40 , H03H1/02 , H03H7/01 , H05K1/16
CPC分类号： H01G4/35
摘要： A lossy capacitive circuit element, or DC scrubber, is printed on a circuit substrate and absorptively filters high frequency signals in circuit modules. A top conductor of the DC scrubber is separated from a ground conductor by a layer of high dielectric material. A resistive layer, positioned either above or below the top conductor absorbs high frequency signals applied to the top conductor while the dielectric layer shunts the signals to the ground conductor. Alternatively, a pair of DC scrubbers are stacked vertically to configure the lossy capacitive structures in parallel. Signal isolation provided by the DC scrubber and the stacked DC scrubber enables inexpensive DC interfaces to be used in the circuit modules.
摘要翻译：有损电容电路元件或DC洗涤器印刷在电路基板上，并对电路模块中的高频信号进行吸收滤波。 DC洗涤器的顶部导体通过高介电材料层与接地导体分离。位于顶部导体上方或下方的电阻层吸收施加到顶部导体的高频信号，同时电介质层将信号分流到接地导体。或者，垂直堆叠一对DC洗涤器以并联构成有损电容结构。由DC洗涤器和堆叠式DC洗涤器提供的信号隔离使得可以在电路模块中使用便宜的DC接口。

10. 发明授权

US5617298A Collinear terminated transmission line structure 失效
标题翻译：共线端接传输线结构
公开(公告)号：US5617298A
公开(公告)日：1997-04-01
申请号：US575423
申请日：1995-12-20
申请人： John F. Casey , Ronald W. Schroeder , Lewis R. Dove , Philip J. Yearsley
发明人： John F. Casey , Ronald W. Schroeder , Lewis R. Dove , Philip J. Yearsley
IPC分类号： H05K1/02 , H01C17/065 , H01C17/242 , H01L23/64 , H01L27/01 , H05K1/09 , H05K1/16 , H05K3/02 , H01C7/00
CPC分类号： H05K1/167 , H01C17/065 , H01C17/242 , H01L23/647 , H01L24/48 , H01L24/49 , H01L27/013 , H01L2224/05624 , H01L2224/05644 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/49175 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H05K1/0237 , H05K1/092 , H05K2201/0317 , H05K2201/09236 , H05K2203/049 , H05K2203/171 , H05K3/027
摘要： A collinear terminated transmission line structure and method for producing same is presented. The structure comprises a plurality of conductors electrically connected to a plurality of resistors. A predetermined spacing between each of the plurality of conductors ranges from 2 mils to 7 mils. Greater spacings are easily accomplished with the present method. The method comprises the steps of screen-printing a resistor swath onto a substrate, the swath being adjacent to one end of the plurality of conductors. After the substrate is dipped into a solution, the resistor swath is laser trimmed to form the plurality of resistors. The substrate is then rinsed with warm water to remove the solution. The solution can be a poly-vinyl alcohol and isopropyl alcohol mixture.
摘要翻译：提出了共线终端传输线结构及其制造方法。该结构包括电连接到多个电阻器的多个导体。多个导体中的每一个之间的预定间隔范围为2密耳至7密耳。使用本方法可以容易地实现更大的间隔。该方法包括以下步骤：将电阻丝网丝网印刷到基底上，该条带与多个导体的一端相邻。在将基板浸入溶液中之后，电阻器条被激光修整以形成多个电阻器。然后用温水冲洗底物以除去溶液。该溶液可以是聚乙烯醇和异丙醇混合物。

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