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    • 4. 发明申请
    • TRANSPARENT ELECTRODE
    • 透明电极
    • US20110171445A1
    • 2011-07-14
    • US13120033
    • 2009-09-22
    • Hak Gee JungJeong Han KimHyo Jun ParkSang Min Song
    • Hak Gee JungJeong Han KimHyo Jun ParkSang Min Song
    • B32B7/02B82Y99/00
    • H05B33/28H01B1/20H01B1/24H01J2211/225H01L51/5206H01L2251/55Y10T428/24975
    • Disclosed herein is a transparent electrode, including: a polyimide film having an average linear thermal expansion coefficient of 50.0 ppm/° C. or less, which is measured by thermo-mechanical analysis based on a film thickness of 50˜100 μm at a temperature of 50˜250° C., and a yellowness of 15 or less; and an electrode layer including a conductive material and a polyimide resin having an average linear thermal expansion coefficient of 50.0 ppm/° C. or less, which is measured by thermo-mechanical analysis based on a film thickness of 50˜100 μm at a temperature of 50˜250° C., and a yellowness of 15 or less. The transparent electrode is advantageous in that a problem of a short circuit does not occur even when apparatuses including this transparent electrode are over-heated because it has excellent heat resistance, and in that it is transparent and has high electroconductivity.
    • 这里公开了一种透明电极,其包括:平均线性热膨胀系数为50.0ppm /℃以下的聚酰亚胺膜,其通过在温度为50〜100μm的膜厚度的热机械分析下测定 为50〜250℃,黄度为15以下; 以及包含导电性材料的电极层和平均线性热膨胀系数为50.0ppm /℃以下的聚酰亚胺树脂,其通过在温度为50〜100μm的膜厚度的热机械分析下测定 为50〜250℃,黄度为15以下。 透明电极的优点在于,即使包括该透明电极的装置由于具有优异的耐热性而被过热,并且其透明且具有高导电性,所以不会发生短路的问题。
    • 6. 发明申请
    • Quaternary Pb-free solder composition incorporating Sn-Ag-Cu-In
    • 含有Sn-Ag-Cu-In的第四纪无铅焊料组合物
    • US20080292493A1
    • 2008-11-27
    • US12081195
    • 2008-04-11
    • Jong-Hyun LeeChang-Woo LeeJeong-Han Kim
    • Jong-Hyun LeeChang-Woo LeeJeong-Han Kim
    • C22C13/02C22C13/00
    • B23K35/262C22C13/00C22C13/02
    • Provided is a quaternary Pb-free solder composition incorporating Sn—Ag—Cu—In, which can prevent a cost increase and sufficiently ensure proccessability and mechanical property as a solder material. To this end, indium (In) with appropriate amount is added into the Pb-free solder composition, and the addition amount of Ag is optimized, thus preventing a decrease in wettability caused by a decrease in the amount of Ag and improving resistance to a thermal cycling and a mechanical impact. The quaternary Pb-free solder composition includes silver (Ag) of about 0.3 wt. % or more, and less than about 2.5 wt. %, copper (Cu) of about 0.2 wt. % or more, and less than about 2.0 wt. %, indium (In) of about 0.2 wt. % or more, and less than about 1.0 wt. % or less, and a balance of tin (Sn).
    • 提供了含有Sn-Ag-Cu-In的四价无铅焊料组合物,其可以防止成本增加并充分确保作为焊料材料的可操作性和机械性能。 为此,将适量的铟(In)添加到无铅焊料组合物中,并且优化Ag的添加量,从而防止由于Ag量的降低而导致的润湿性的降低,并且提高了对 热循环和机械冲击。 四次无铅焊料组合物包含约0.3wt。%的银(Ag) %以上,小于约2.5重量% %,铜(Cu)为约0.2重量% %以上,小于约2.0重量% %,铟(In)为约0.2wt。 %以上,小于约1.0重量% %以下,余量为锡(Sn)。