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1. 发明授权

US08288506B2 Conductive material and manufacturing method thereof 有权
标题翻译：导电材料及其制造方法
公开(公告)号：US08288506B2
公开(公告)日：2012-10-16
申请号：US12747804
申请日：2008-12-12
申请人： Jeong Han Kim , Ji Sung Kim , Ki Nam Kwak , Sang Min Song , Chung Seock Kang
发明人： Jeong Han Kim , Ji Sung Kim , Ki Nam Kwak , Sang Min Song , Chung Seock Kang
IPC分类号： C08G69/26 , C08J3/02 , C08G69/00 , C08J3/00
CPC分类号： H01B1/24
摘要： Disclosed is a method of manufacturing a conductive coating film having superior chemical resistance or solvent resistance and durability by chemically bonding a resin having an amine group (—NH2) with carbon nanotubes having a carboxyl group (—COOH). The conductive material having high bondability with carbon nanotubes and superior electrical properties includes carbon nanotubes uniformly contained therein, and thus has appropriate surface resistivity, and thereby can be used for antistatic, electrostatic dissipation and electromagnetic shielding purposes and in transparent or opaque electrodes depending on the resistivity value.
摘要翻译：公开了通过化学键合具有胺基（-NH 2）的树脂与具有羧基（-COOH）的碳纳米管的树脂，制造具有优异的耐化学性或耐溶剂性和耐久性的导电性涂膜的方法。与碳纳米管具有高粘合性和优异的电性能的导电材料包括均匀地包含在其中的碳纳米管，因此具有适当的表面电阻率，从而可用于抗静电，静电消散和电磁屏蔽目的，并且可用于透明或不透明电极，这取决于电阻率值。

2. 发明申请

US20100305298A1 CONDUCTIVE MATERIAL AND MANUFACTURING METHOD THEREOF 有权
标题翻译：导电材料及其制造方法
公开(公告)号：US20100305298A1
公开(公告)日：2010-12-02
申请号：US12747804
申请日：2008-12-12
申请人： Jeong Han Kim , Ji Sung Kim , Ki Nam Kwak , Sang Min Song , Chung Seock Kang
发明人： Jeong Han Kim , Ji Sung Kim , Ki Nam Kwak , Sang Min Song , Chung Seock Kang
IPC分类号： C08G69/26
CPC分类号： H01B1/24
摘要： Disclosed is a method of manufacturing a conductive coating film having superior chemical resistance or solvent resistance and durability by chemically bonding a resin having an amine group (—NH2) with carbon nanotubes having a carboxyl group (—COOH). The conductive material having high bondability with carbon nanotubes and superior electrical properties includes carbon nanotubes uniformly contained therein, and thus has appropriate surface resistivity, and thereby can be used for antistatic, electrostatic dissipation and electromagnetic shielding purposes and in transparent or opaque electrodes depending on the resistivity value.
摘要翻译：公开了通过化学键合具有胺基（-NH 2）的树脂与具有羧基（-COOH）的碳纳米管的树脂，制造具有优异的耐化学性或耐溶剂性和耐久性的导电性涂膜的方法。与碳纳米管具有高粘合性和优异的电性能的导电材料包括均匀地包含在其中的碳纳米管，因此具有适当的表面电阻率，从而可用于抗静电，静电消散和电磁屏蔽目的，并且可用于透明或不透明电极，这取决于电阻率值。

3. 发明申请

US20130224481A1 SEAMLESS BELT 审中-公开
标题翻译：无缝皮带
公开(公告)号：US20130224481A1
公开(公告)日：2013-08-29
申请号：US13877073
申请日：2011-09-28
申请人： Ki Nam Kwak , Jeong Han Kim , Ji Sung Kim
发明人： Ki Nam Kwak , Jeong Han Kim , Ji Sung Kim
IPC分类号： C09D1/00
CPC分类号： C09D1/00 , C08G77/62 , C09D5/165 , C09D7/20 , C09D183/16 , G03G15/162 , Y10T428/265
摘要： Disclosed is a belt for an image forming apparatus including a releasing coating layer including a layered inorganic compound.
摘要翻译：公开了一种用于图像形成装置的带，其包括具有层状无机化合物的剥离涂层。

4. 发明授权

US08267242B2 Seamless belt 有权
标题翻译：无缝皮带
公开(公告)号：US08267242B2
公开(公告)日：2012-09-18
申请号：US12551943
申请日：2009-09-01
申请人： Ji Sung Kim , Ki Nam Kwak , Deug Soo Ryu , Jeong Han Kim
发明人： Ji Sung Kim , Ki Nam Kwak , Deug Soo Ryu , Jeong Han Kim
IPC分类号： B65G15/30 , B65G17/00
CPC分类号： G03G15/326 , G03G15/0435 , Y10T428/24777
摘要： Disclosed is a large seamless belt which is prevented from being curled in a width direction of the belt.
摘要翻译：公开了防止在带的宽度方向卷曲的大型无缝带。

5. 发明申请

US20130213700A1 MANUFACTURING METHOD OF ELECTRODE SUBSTRATE 审中-公开
标题翻译：电极基板的制造方法
公开(公告)号：US20130213700A1
公开(公告)日：2013-08-22
申请号：US13877040
申请日：2011-09-28
申请人： Ye Seul Kim , Jeong Han Kim , Ji Sung Kim , Ki Nam Kwak
发明人： Ye Seul Kim , Jeong Han Kim , Ji Sung Kim , Ki Nam Kwak
IPC分类号： H05K3/00 , H05K1/09
CPC分类号： H05K3/00 , H01B1/24 , H05K1/097
摘要： Provided is a manufacturing method of an electrode substrate in which a carbon nanotube is strongly bonded on a base by forming a mixed film of the carbon nanotube and a silicon-based organic and inorganic hybrid polymer.
摘要翻译：提供一种电极基板的制造方法，其中通过形成碳纳米管和硅基有机和无机混合聚合物的混合膜将碳纳米管牢固地结合在基底上。

6. 发明申请

US20100051423A1 SEAMLESS BELT 有权
标题翻译：无缝皮带
公开(公告)号：US20100051423A1
公开(公告)日：2010-03-04
申请号：US12551943
申请日：2009-09-01
申请人： Ji Sung KIM , Ki Nam Kwak , Deug Soo Ryu , Jeong Han Kim
发明人： Ji Sung KIM , Ki Nam Kwak , Deug Soo Ryu , Jeong Han Kim
IPC分类号： B65G15/30
CPC分类号： G03G15/326 , G03G15/0435 , Y10T428/24777
摘要： Disclosed is a large seamless belt which is prevented from being curled in a width direction of the belt.
摘要翻译：公开了防止在带的宽度方向卷曲的大型无缝带。

7. 发明申请

US20110171445A1 TRANSPARENT ELECTRODE 审中-公开
标题翻译：透明电极
公开(公告)号：US20110171445A1
公开(公告)日：2011-07-14
申请号：US13120033
申请日：2009-09-22
申请人： Hak Gee Jung , Jeong Han Kim , Hyo Jun Park , Sang Min Song
发明人： Hak Gee Jung , Jeong Han Kim , Hyo Jun Park , Sang Min Song
IPC分类号： B32B7/02 , B82Y99/00
CPC分类号： H05B33/28 , H01B1/20 , H01B1/24 , H01J2211/225 , H01L51/5206 , H01L2251/55 , Y10T428/24975
摘要： Disclosed herein is a transparent electrode, including: a polyimide film having an average linear thermal expansion coefficient of 50.0 ppm/° C. or less, which is measured by thermo-mechanical analysis based on a film thickness of 50˜100 μm at a temperature of 50˜250° C., and a yellowness of 15 or less; and an electrode layer including a conductive material and a polyimide resin having an average linear thermal expansion coefficient of 50.0 ppm/° C. or less, which is measured by thermo-mechanical analysis based on a film thickness of 50˜100 μm at a temperature of 50˜250° C., and a yellowness of 15 or less. The transparent electrode is advantageous in that a problem of a short circuit does not occur even when apparatuses including this transparent electrode are over-heated because it has excellent heat resistance, and in that it is transparent and has high electroconductivity.
摘要翻译：这里公开了一种透明电极，其包括：平均线性热膨胀系数为50.0ppm /℃以下的聚酰亚胺膜，其通过在温度为50〜100μm的膜厚度的热机械分析下测定为50〜250℃，黄度为15以下; 以及包含导电性材料的电极层和平均线性热膨胀系数为50.0ppm /℃以下的聚酰亚胺树脂，其通过在温度为50〜100μm的膜厚度的热机械分析下测定为50〜250℃，黄度为15以下。透明电极的优点在于，即使包括该透明电极的装置由于具有优异的耐热性而被过热，并且其透明且具有高导电性，所以不会发生短路的问题。

8. 发明授权

US10062474B2 Transparent electrode, conductive laminate and conductive layer 有权
公开(公告)号：US10062474B2
公开(公告)日：2018-08-28
申请号：US12750058
申请日：2010-03-30
申请人： Ji Sung Kim , Hak Gee Jung , Jeong Han Kim
发明人： Ji Sung Kim , Hak Gee Jung , Jeong Han Kim
IPC分类号： H01J1/02 , H01B1/24
CPC分类号： H01B1/24
摘要： Disclosed is a conductive layer including photopolymerizable resin having dispersed carbon nanotubes, which is transparent with high electrical conductivity and facilitates the formation of an electrode pattern. A laminate and a transparent electrode, including the conductive layer, are also provided.

9. 发明授权

US08486827B2 Device of filling metal in through-via-hole of semiconductor wafer and method using the same 有权
标题翻译：在半导体晶片的通孔中填充金属的装置及其使用方法
公开(公告)号：US08486827B2
公开(公告)日：2013-07-16
申请号：US13262293
申请日：2009-12-30
申请人： Se Hoon Yoo , Chang Woo Lee , Jun Ki Kim , Jeong Han Kim , Cheol Hee Kim , Young Ki Ko , Yue Seon Shin
发明人： Se Hoon Yoo , Chang Woo Lee , Jun Ki Kim , Jeong Han Kim , Cheol Hee Kim , Young Ki Ko , Yue Seon Shin
IPC分类号： H01L21/768
CPC分类号： H01L21/68785 , H01L21/68721 , H01L21/76898
摘要： A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole.
摘要翻译：公开了一种在半导体晶片中形成的通孔中填充金属的装置以及使用该通孔的贯通孔中填充金属的方法。在半导体晶片中形成的通孔中填充金属的装置包括夹具基座，其包括夹具，其被配置为固定其中形成有通孔的晶片; 安装在夹具基座上的上腔室120; 安装在夹具底下的下腔室; 安装在所述上部腔室中的加热器，所述加热器构造成对放置在所述晶片上的填充金属施加热量以熔化所述填充金属; 以及真空泵，其构造成通过下部腔室130的空气排出而被下部腔室的压力产生上部腔室和下部腔室之间的压力差，仅将填充金属填充到通孔中。

10. 发明授权

US08187387B2 Dryer and method of controlling cleaning operation thereof 失效
标题翻译：干燥器及其清洗操作的控制方法
公开(公告)号：US08187387B2
公开(公告)日：2012-05-29
申请号：US12216801
申请日：2008-07-10
申请人： Tai Eun Kim , Jeong Han Kim , Byoung Yull Yang
发明人： Tai Eun Kim , Jeong Han Kim , Byoung Yull Yang
IPC分类号： B08B7/04
CPC分类号： D06F58/203 , D06F25/00 , D06F35/008 , D06F58/28 , D06F2058/2819 , D06F2058/2854
摘要： Disclosed herein are a dryer and a method of controlling a cleaning operation thereof that are capable of supplying moisture into a drying chamber of the dryer to wet contaminants in the drying chamber and blowing air to the wetted contaminants to remove the contaminants. The method includes supplying moisture into a drying chamber to wet contaminants in the drying chamber and removing the contaminants wetted by the moisture.
摘要翻译：本文公开了一种干燥器和控制其清洁操作的方法，其能够将湿气供应到干燥器的干燥室中，以湿化干燥室中的污染物并将空气吹送到润湿的污染物以除去污染物。该方法包括向干燥室中提供湿气以湿化干燥室中的污染物并除去被水分润湿的污染物。

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