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    • 1. 发明申请
    • TESTING THE QUALITY OF LIFT-OFF PROCESSES IN WAFER FABRICATION
    • 测试水轮机制造工艺的质量
    • US20090152542A1
    • 2009-06-18
    • US11957483
    • 2007-12-17
    • Edward Hin Pong LeeJennifer Ai-Ming Leung
    • Edward Hin Pong LeeJennifer Ai-Ming Leung
    • H01L23/58H01L21/66
    • H01L22/34
    • Test methods and components are disclosed for testing the quality of lift-off processes in wafer fabrication. A wafer is populated with one or more test components along with the functional components. These test components are fabricated with holes in an insulation layer that is deposited between conductive layers, where the holes were created by the same or similar lift-off process that is used to fabricate the functional components on the wafer. The test components may then be measured in order to determine the quality of the holes created by the lift-off process. The quality of the lift-off process used to fabricate the functional components may then be determined based on the quality of the holes in the test components.
    • 公开了用于测试晶片制造中的剥离过程的质量的测试方法和组件。 晶片与功能部件一起填充一个或多个测试部件。 这些测试部件被制成在绝缘层上的孔,该绝缘层沉积在导电层之间,其中孔是通过用于制造晶片上的功能部件的相同或类似的剥离工艺产生的。 然后可以测量测试部件以确定由剥离过程产生的孔的质量。 然后可以基于测试部件中的孔的质量来确定用于制造功能部件的剥离过程的质量。
    • 2. 发明授权
    • Resistance measurements of a helical coil
    • 螺旋线圈的电阻测量
    • US07741133B2
    • 2010-06-22
    • US11957484
    • 2007-12-17
    • Edward Hin Pong LeeJennifer Ai-Ming Leung
    • Edward Hin Pong LeeJennifer Ai-Ming Leung
    • H01L21/00H01F30/12G01R1/00
    • G01R31/06
    • Test methods and components are disclosed for testing resistances of helical coils formed in magnetic recording heads. Helical coils in magnetic recording heads include a bottom coil structure, a top coil structure, and connecting structures that electrically connect the top and bottom coil structures. A test component is fabricated on the wafer along with the magnetic recording heads. The test component includes a bottom coil structure connected in series, and includes a top coil structure connected in series which is electrically disconnected from the bottom coil structure. Resistances of the top and bottom coil structures are measured in the test component. A total resistance of a helical coil is also measured. The resistance of the connecting structures in the helical coil may then be determined based on the resistance of the bottom coil structure, the resistance of the top coil structure, and the total resistance of the helical coil.
    • 公开了用于测试形成在磁记录头中的螺旋线圈的电阻的测试方法和部件。 磁记录头中的螺旋线圈包括底部线圈结构,顶部线圈结构以及将顶部和底部线圈结构电连接的连接结构。 测试部件与磁记录头一起制造在晶片上。 测试部件包括串联连接的底部线圈结构,并且包括与底部线圈结构电气断开的串联连接的顶部线圈结构。 在测试部件中测量顶部和底部线圈结构的电阻。 还测量螺旋线圈的总电阻。 然后可以基于底部线圈结构的电阻,顶部线圈结构的电阻和螺旋线圈​​的总电阻来确定螺旋线圈中的连接结构的电阻。
    • 5. 发明授权
    • Perpendicular magnetic recording head with photoresist dam between write coil and air bearing surface
    • 在写入线圈和空气轴承表面之间具有光刻胶的垂直磁记录头
    • US07612963B2
    • 2009-11-03
    • US11478925
    • 2006-06-30
    • Donald G. AllenEdward Hin Pong LeeJennifer Ai-Ming Leung
    • Donald G. AllenEdward Hin Pong LeeJennifer Ai-Ming Leung
    • G11B5/17G11B5/31G11B5/39
    • G11B5/1278G11B5/3123G11B5/3163
    • A magnetic recording head for use in perpendicular magnetic recording having a design that allows the write coil to be manufactured by a damascene process for increased coil pitch and reduced coil resistance. The magnetic write head includes a photoresist dam structure that allows a hard baked photoresist to be formed that does not extend to the air bearing surface (ABS). Since the photoresist dam prevents the hard baked photoresist from reaching the ABS, the damascene process, in which the hard baked photoresist remains in the finished write head, can be used to produce the write head. The use of such a damascene process advantageously allows the space between the coil turns to be reduced, which maximizes the number of turns that can be used and also maximizes the number width to which the coil turns can be constructed, thereby minimizing the electrical resistance of the write coil.
    • 一种用于垂直磁记录的磁记录头,其具有允许通过镶嵌工艺制造写入线圈以增加线圈间距并减小线圈电阻的设计。 磁写头包括光致抗蚀剂阻挡结构,其允许形成不延伸到空气轴承表面(ABS)的硬烘烤光致抗蚀剂。 由于光致抗蚀剂防止了硬烘烤的光致抗蚀剂到达ABS,因此可以使用其中硬烧结光致抗蚀剂保留在完成的写头中的镶嵌工艺来产生写头。 使用这种镶嵌工艺有利地减小了线圈匝之间的空间,这使得可以使用的匝数最大化,并且还使构造线圈匝数的数量最大化,从而最小化电阻 写线圈。
    • 7. 发明授权
    • Testing the quality of lift-off processes in wafer fabrication
    • 测试晶圆制造中剥离过程的质量
    • US07713762B2
    • 2010-05-11
    • US11957483
    • 2007-12-17
    • Edward Hin Pong LeeJennifer Ai-Ming Leung
    • Edward Hin Pong LeeJennifer Ai-Ming Leung
    • G01R31/26H01L21/66
    • H01L22/34
    • Test methods and components are disclosed for testing the quality of lift-off processes in wafer fabrication. A wafer is populated with one or more test components along with the functional components. These test components are fabricated with holes in an insulation layer that is deposited between conductive layers, where the holes were created by the same or similar lift-off process that is used to fabricate the functional components on the wafer. The test components may then be measured in order to determine the quality of the holes created by the lift-off process. The quality of the lift-off process used to fabricate the functional components may then be determined based on the quality of the holes in the test components.
    • 公开了用于测试晶片制造中的剥离过程的质量的测试方法和组件。 晶片与功能部件一起填充一个或多个测试部件。 这些测试部件被制成在绝缘层上的孔,该绝缘层沉积在导电层之间,其中孔是通过用于制造晶片上的功能部件的相同或类似的剥离工艺产生的。 然后可以测量测试部件以确定由剥离过程产生的孔的质量。 然后可以基于测试部件中的孔的质量来确定用于制造功能部件的剥离过程的质量。
    • 9. 发明申请
    • RESISTANCE MEASUREMENTS OF A HELICAL COIL
    • 螺旋线圈的电阻测量
    • US20090153157A1
    • 2009-06-18
    • US11957484
    • 2007-12-17
    • Edward Hin Pong LeeJennifer Ai-Ming Leung
    • Edward Hin Pong LeeJennifer Ai-Ming Leung
    • G01R27/00
    • G01R31/06
    • Test methods and components are disclosed for testing resistances of helical coils formed in magnetic recording heads. Helical coils in magnetic recording heads include a bottom coil structure, a top coil structure, and connecting structures that electrically connect the top and bottom coil structures. A test component is fabricated on the wafer along with the magnetic recording heads. The test component includes a bottom coil structure connected in series, and includes a top coil structure connected in series which is electrically disconnected from the bottom coil structure. Resistances of the top and bottom coil structures are measured in the test component. A total resistance of a helical coil is also measured. The resistance of the connecting structures in the helical coil may then be determined based on the resistance of the bottom coil structure, the resistance of the top coil structure, and the total resistance of the helical coil.
    • 公开了用于测试形成在磁记录头中的螺旋线圈的电阻的测试方法和部件。 磁记录头中的螺旋线圈包括底部线圈结构,顶部线圈结构以及将顶部和底部线圈结构电连接的连接结构。 测试部件与磁记录头一起制造在晶片上。 测试部件包括串联连接的底部线圈结构,并且包括与底部线圈结构电气断开的串联连接的顶部线圈结构。 在测试部件中测量顶部和底部线圈结构的电阻。 还测量螺旋线圈的总电阻。 然后可以基于底部线圈结构的电阻,顶部线圈结构的电阻和螺旋线圈​​的总电阻来确定螺旋线圈中的连接结构的电阻。