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    • 1. 发明申请
    • NAND FLASH MEMORY DEVICE AND METHOD OF OPERATING SAME
    • NAND闪存存储器件及其操作方法
    • US20090257280A1
    • 2009-10-15
    • US12405826
    • 2009-03-17
    • Dong-Yean OhWoo-Kyung LeeJai Hyuk SongChang-Sub Lee
    • Dong-Yean OhWoo-Kyung LeeJai Hyuk SongChang-Sub Lee
    • G11C16/06
    • G11C16/0483G11C16/10
    • An flash memory device includes a block of NAND cell units, each NAND cell unit in the block includes n memory cell transistors MC controlled by a plurality of n wordlines, and is connected in series between a string selection transistor SST connected to a bitline and a ground selection transistor GST. While a programming voltage Vpgm is applied to a selected wordline WL , a cutoff voltage Vss is applied to a nearby unselected wordline closer to the ground selection transistor GST to isolate a first local channel Ch1 from a second local channel Ch2. As the location i of the selected wordline WL increases close to the SST, the second channel potential Vch2 tends to increase excessively, causing errors. The excessive increase of Vch2 is prevented by modifying the voltages applied to string select lines (SSL) and/or to the bit lines (BL), or the pass voltages Vpass applied to the unselected wordlines (WL location i is equal or greater than a predetermined (stored) location number x. If incremental step pulse programming (ISPP) is implemented, the applied voltages are modified only if the ISPP loop count j is equal or greater than a predetermined (stored) critical loop number y.
    • 闪速存储器件包括一块NAND单元单元,该块中的每个NAND单元单元包括由多个n个字线控制的n个存储单元晶体管MC,并串联连接在连接到位线的串选择晶体管SST和 接地选择晶体管GST。 当编程电压Vpgm被施加到所选字线WL时,截止电压Vss被施加到靠近接地选择晶体管GST的附近未选字线,以将第一本地信道Ch1与第二本地信道Ch2隔离。 当所选择的字线WL i的位置i增加到接近于SST时,第二通道电位Vch2会过度增加,导致错误。 通过修改施加到串选择线(SSL)和/或位线(BL)的电压或施加到未选择字线(WL ),只有当所选择的字线WL i位置i等于或大于预定(存储的)位置号码x时。 如果实现增量步进脉冲编程(ISPP),只有当ISPP循环计数j等于或大于预定(存储)的关键循环数y时,才施加电压。
    • 5. 发明申请
    • Method of manufacturing a non-volatile semiconductor device
    • 制造非易失性半导体器件的方法
    • US20090035906A1
    • 2009-02-05
    • US12222074
    • 2008-08-01
    • Choong-Ho LeeJai-Hyuk SongDong-Uk ChoiSuk-Kang Sung
    • Choong-Ho LeeJai-Hyuk SongDong-Uk ChoiSuk-Kang Sung
    • H01L21/336
    • H01L21/324H01L27/115H01L27/11521H01L27/11524H01L27/11568
    • Example embodiments relate to methods of fabricating a non-volatile memory device. According to example embodiments, a method of fabricating a non-volatile memory device may include forming at least one gate structure on an upper face of a substrate. The at least one gate structure may include a tunnel insulation layer pattern, a charge storing layer pattern, a dielectric layer pattern and a control gate. According to example embodiments, a method of fabricating a non-volatile memory device may also include forming a silicon nitride layer on the upper face of the substrate to cover the at least one gate structure, forming an insulating interlayer on the silicon nitride layer on the upper face of the substrate, and providing an annealing gas toward the upper face of the substrate and a lower face of the substrate to cure defects of the tunnel insulation layer pattern.
    • 示例实施例涉及制造非易失性存储器件的方法。 根据示例性实施例,制造非易失性存储器件的方法可以包括在衬底的上表面上形成至少一个栅极结构。 至少一个栅极结构可以包括隧道绝缘层图案,电荷存储层图案,电介质层图案和控制栅极。 根据示例实施例,制造非易失性存储器件的方法还可以包括在衬底的上表面上形成氮化硅层以覆盖至少一个栅极结构,在氮化硅层上形成绝缘中间层 并且朝向基板的上表面和基板的下表面提供退火气体,以固化隧道绝缘层图案的缺陷。
    • 7. 发明授权
    • NAND flash memory device and method of operating same to reduce a difference between channel potentials therein
    • NAND闪存器件及其操作方法以减少其中的沟道电位之间的差异
    • US08456918B2
    • 2013-06-04
    • US12405826
    • 2009-03-17
    • Dong-Yean OhWoon-Kyung LeeJai Hyuk SongChang-Sub Lee
    • Dong-Yean OhWoon-Kyung LeeJai Hyuk SongChang-Sub Lee
    • G11C11/34G11C16/06
    • G11C16/0483G11C16/10
    • An flash memory device includes a block of NAND cell units, each NAND cell unit in the block includes n memory cell transistors MC controlled by a plurality of n wordlines, and is connected in series between a string selection transistor SST connected to a bitline and a ground selection transistor GST. While a programming voltage Vpgm is applied to a selected wordline WL , a cutoff voltage Vss is applied to a nearby unselected wordline closer to the ground selection transistor GST to isolate a first local channel Ch1 from a second local channel Ch2. As the location i of the selected wordline WL increases close to the SST, the second channel potential Vch2 tends to increase excessively, causing errors. The excessive increase of Vch2 is prevented by modifying the voltages applied to string select lines (SSL) and/or to the bit lines (BL), or the pass voltages Vpass applied to the unselected wordlines (WL location i is equal or greater than a predetermined (stored) location number x. If incremental step pulse programming (ISPP) is implemented, the applied voltages are modified only if the ISPP loop count j is equal or greater than a predetermined (stored) critical loop number y.
    • 闪速存储器件包括一块NAND单元单元,该块中的每个NAND单元单元包括由多个n个字线控制的n个存储单元晶体管MC,并串联连接在连接到位线的串选择晶体管SST和 接地选择晶体管GST。 当编程电压Vpgm被施加到所选字线WL时,截止电压Vss被施加到靠近接地选择晶体管GST的附近未选字线,以将第一本地信道Ch1与第二本地信道Ch2隔离。 当所选择的字线WL i的位置i增加到接近于SST时,第二通道电位Vch2会过度增加,导致错误。 通过修改施加到串选择线(SSL)和/或位线(BL)的电压或施加到未选择字线(WL ),只有当所选择的字线WL i位置i等于或大于预定(存储的)位置号码x时。 如果实现增量步进脉冲编程(ISPP),只有当ISPP循环计数j等于或大于预定(存储)的关键循环数y时,才施加电压。
    • 9. 发明申请
    • NONVOLATILE MEMORY DEVICE FOR REDUCING INTERFERENCE BETWEEN WORD LINES AND OPERATION METHOD THEREOF
    • 用于减少字线之间的干扰的非易失性存储器件及其操作方法
    • US20110222339A1
    • 2011-09-15
    • US13044683
    • 2011-03-10
    • Sung-Hoon KimJai-Hyuk SongYong-Joon Choi
    • Sung-Hoon KimJai-Hyuk SongYong-Joon Choi
    • G11C16/28G11C16/10G11C16/08
    • G11C16/3418G11C16/10G11C16/28
    • Provided are a nonvolatile memory device and a method of operating the same. The nonvolatile memory device in accordance with an embodiment of the inventive concept may include a string select line; a ground select line; a dummy word line adjacent to the ground select line; a first word line adjacent to the dummy word line; and a second word line disposed between the string select line and the first word line. The nonvolatile memory device is configured to apply a voltage to the dummy word line. When programming a memory cell connected to the first word line, a first dummy word line voltage lower than a voltage applied to the second word line is applied to the dummy word line. When programming a memory cell connected to the second word line, a second dummy word line voltage between a voltage applied to the first word line and the first dummy word line voltage is applied to the dummy word line. Accordingly, when a program operation is performed, a charge loss of a memory cell connected to a word line adjacent to a dummy word line can be reduced by changing a voltage applied to the dummy word line according to a select word line.
    • 提供一种非易失性存储器件及其操作方法。 根据本发明构思的实施例的非易失性存储器件可以包括串选择线; 地选线; 与地面选择线相邻的虚拟字线; 与虚拟字线相邻的第一字线; 以及设置在所述串选择线和所述第一字线之间的第二字线。 非易失性存储器件被配置为向虚拟字线施加电压。 当编程连接到第一字线的存储单元时,低于施加到第二字线的电压的第一虚拟字线电压被施加到虚拟字线。 当编程连接到第二字线的存储单元时,施加到第一字线的电压和第一虚拟字线电压之间的第二虚拟字线电压被施加到伪字线。 因此,当执行编程操作时,可以通过根据选择字线改变施加到虚拟字线的电压来减少连接到与虚拟字线相邻的字线的存储单元的电荷损失。
    • 10. 发明授权
    • Method of manufacturing a non-volatile semiconductor device
    • 制造非易失性半导体器件的方法
    • US07867849B2
    • 2011-01-11
    • US12222074
    • 2008-08-01
    • Choong-Ho LeeJai-Hyuk SongDong-Uk ChoiSuk-Kang Sung
    • Choong-Ho LeeJai-Hyuk SongDong-Uk ChoiSuk-Kang Sung
    • H01L21/336
    • H01L21/324H01L27/115H01L27/11521H01L27/11524H01L27/11568
    • Example embodiments relate to methods of fabricating a non-volatile memory device. According to example embodiments, a method of fabricating a non-volatile memory device may include forming at least one gate structure on an upper face of a substrate. The at least one gate structure may include a tunnel insulation layer pattern, a charge storing layer pattern, a dielectric layer pattern and a control gate. According to example embodiments, a method of fabricating a non-volatile memory device may also include forming a silicon nitride layer on the upper face of the substrate to cover the at least one gate structure, forming an insulating interlayer on the silicon nitride layer on the upper face of the substrate, and providing an annealing gas toward the upper face of the substrate and a lower face of the substrate to cure defects of the tunnel insulation layer pattern.
    • 示例实施例涉及制造非易失性存储器件的方法。 根据示例性实施例,制造非易失性存储器件的方法可以包括在衬底的上表面上形成至少一个栅极结构。 至少一个栅极结构可以包括隧道绝缘层图案,电荷存储层图案,电介质层图案和控制栅极。 根据示例实施例,制造非易失性存储器件的方法还可以包括在衬底的上表面上形成氮化硅层以覆盖至少一个栅极结构,在氮化硅层上形成绝缘中间层 并且朝向基板的上表面和基板的下表面提供退火气体,以固化隧道绝缘层图案的缺陷。