会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Method of fabricating non-volatile memory device having vertical structure
    • 制造具有垂直结构的非易失性存储器件的方法
    • US08133784B2
    • 2012-03-13
    • US12588534
    • 2009-10-19
    • Dew-ill ChungHan-soo KimJae-hun JeongJin-soo LimKi-hyun KimJu-young Lim
    • Dew-ill ChungHan-soo KimJae-hun JeongJin-soo LimKi-hyun KimJu-young Lim
    • H01L21/8238H01L21/336H01L21/8236
    • H01L27/11578G11C16/0483H01L27/11582
    • A method of fabricating a non-volatile memory device according to an example embodiment may include etching a plurality of sacrificial films and insulation films to form a plurality of first openings that expose a plurality of first portions of a semiconductor substrate. A plurality of channel layers may be formed in the plurality of first openings so as to coat the plurality of first portions of the semiconductor substrate and side surfaces of the plurality of first openings. A plurality of insulation pillars may be formed on the plurality of channel layers so as to fill the plurality of first openings. The plurality of sacrificial films and insulation films may be further etched to form a plurality of second openings that expose a plurality of second portions of the semiconductor substrate. A plurality of side openings may be formed by removing the plurality of sacrificial films. A plurality of gate dielectric films may be formed on surfaces of the plurality of side openings. A plurality of gate electrodes may be formed on the plurality of gate dielectric films so as to fill the plurality of side openings.
    • 根据示例性实施例的制造非易失性存储器件的方法可以包括蚀刻多个牺牲膜和绝缘膜以形成暴露半导体衬底的多个第一部分的多个第一开口。 可以在多个第一开口中形成多个沟道层,以便涂覆半导体衬底的多个第一部分和多个第一开口的侧表面。 可以在多个通道层上形成多个绝缘柱,以填充多个第一开口。 可以进一步蚀刻多个牺牲膜和绝缘膜以形成暴露半导体衬底的多个第二部分的多个第二开口。 可以通过去除多个牺牲膜来形成多个侧开口。 多个栅极电介质膜可以形成在多个侧面开口的表面上。 可以在多个栅极电介质膜上形成多个栅电极,以填充多个侧开口。
    • 6. 发明申请
    • Method of fabricating non-volatile memory device having vertical structure
    • 制造具有垂直结构的非易失性存储器件的方法
    • US20100248439A1
    • 2010-09-30
    • US12588534
    • 2009-10-19
    • Dew-Ill ChungHan-soo KimJae-hun JeongJin-soo LimKi-hyun KimJu-young Lim
    • Dew-Ill ChungHan-soo KimJae-hun JeongJin-soo LimKi-hyun KimJu-young Lim
    • H01L21/336
    • H01L27/11578G11C16/0483H01L27/11582
    • A method of fabricating a non-volatile memory device according to an example embodiment may include etching a plurality of sacrificial films and insulation films to form a plurality of first openings that expose a plurality of first portions of a semiconductor substrate. A plurality of channel layers may be formed in the plurality of first openings so as to coat the plurality of first portions of the semiconductor substrate and side surfaces of the plurality of first openings. A plurality of insulation pillars may be formed on the plurality of channel layers so as to fill the plurality of first openings. The plurality of sacrificial films and insulation films may be further etched to form a plurality of second openings that expose a plurality of second portions of the semiconductor substrate. A plurality of side openings may be formed by removing the plurality of sacrificial films. A plurality of gate dielectric films may be formed on surfaces of the plurality of side openings. A plurality of gate electrodes may be formed on the plurality of gate dielectric films so as to fill the plurality of side openings.
    • 根据示例性实施例的制造非易失性存储器件的方法可以包括蚀刻多个牺牲膜和绝缘膜以形成暴露半导体衬底的多个第一部分的多个第一开口。 可以在多个第一开口中形成多个沟道层,以便涂覆半导体衬底的多个第一部分和多个第一开口的侧表面。 可以在多个通道层上形成多个绝缘柱,以填充多个第一开口。 可以进一步蚀刻多个牺牲膜和绝缘膜以形成暴露半导体衬底的多个第二部分的多个第二开口。 可以通过去除多个牺牲膜来形成多个侧开口。 多个栅极电介质膜可以形成在多个侧面开口的表面上。 可以在多个栅极电介质膜上形成多个栅电极,以填充多个侧开口。
    • 9. 发明申请
    • METHODS OF FORMING NAND-TYPE NONVOLATILE MEMORY DEVICES
    • 形成NAND型非易失性存储器件的方法
    • US20090233405A1
    • 2009-09-17
    • US12474896
    • 2009-05-29
    • Hoo-Sung ChoSoon-Moon JungWon-Seok ChoJong-Hyuk KimJae-Hun JeongJae-Hoon Jang
    • Hoo-Sung ChoSoon-Moon JungWon-Seok ChoJong-Hyuk KimJae-Hun JeongJae-Hoon Jang
    • H01L21/336
    • H01L27/11524H01L27/0688H01L27/11551
    • Methods of forming a NAND-type nonvolatile memory device include: forming first common drains and first common sources alternatively in an active region which is defined in a semiconductor substrate and extends one direction, forming a first insulating layer covering an entire surface of the semiconductor substrate, patterning the first insulating layer to form seed contact holes which are arranged at regular distance and expose the active region, forming a seed contact structure filling each of the seed contact holes and a semiconductor layer disposed on the first insulating layer and contacting the seed contact structures, patterning the semiconductor layer to form a semiconductor pattern which extends in the one direction and is disposed over the active region, forming second common drains and second common sources disposed alternatively in the semiconductor pattern in the one direction, forming a second insulating layer covering an entire surface of the semiconductor substrate, forming a source line pattern continuously penetrating the second insulating layer, the semiconductor pattern and the first insulating layer, the source line pattern being connected with the first and second common sources, wherein a grain boundary of the semiconductor layer is positioned at a center between the one pair of seed contact structures adjacent to each other, and is positioned over the first common drain or the first common source.
    • 形成NAND型非易失性存储器件的方法包括:在半导体衬底中限定的有源区域中交替形成第一公共漏极和第一公共源,并延伸一个方向,形成覆盖半导体衬底的整个表面的第一绝缘层 图案化第一绝缘层以形成以规则距离布置的暴露有源区域的种子接触孔,形成填充每个种子接触孔的种子接触结构以及设置在第一绝缘层上并接触种子接触的半导体层 结构,图案化所述半导体层以形成在所述一个方向上延伸并设置在所述有源区上方的半导体图案,形成沿所述一个方向交替设置在所述半导体图案中的第二公共漏极和第二公共源,形成第二绝缘层覆盖层 半导体衬底的整个表面 使源极线图案连续地穿过第二绝缘层,半导体图案和第一绝缘层,源极线图案与第一和第二共用源连接,其中半导体层的晶界位于第二绝缘层之间的中心 一对种子接触结构彼此相邻,并且位于第一公共漏极或第一公共源的上方。