专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2004106162A Circular boring tool for soft material 审中-公开
公开(公告)号：JP2004106162A
公开(公告)日：2004-04-08
申请号：JP2002310282
申请日：2002-09-18
申请人： Isamu Tanaka , 田中勇
发明人： TANAKA ISAMU
IPC分类号： B26D3/10 , B23B51/04 , B26F1/20
摘要： PROBLEM TO BE SOLVED: To provide a circular boring tool for a soft material which cleanly and easily bores soft materials such as glass wool, felt, a foam material, a sponge, and cloth or the like without damaging the materials, at the time of boring.
SOLUTION: A brim (1a) and jag (1b) are formed on an external pipe (1), a cap (3) is fixed on an internal pipe (2), and in the inside of the opposite side of the cap, a cutting blade fixing pipe (4) is bound, and a cutting blade (5) is wound around the circumference of the cutting blade fixing pipe (4) and fixed by a fixing tape (6), thereby engaging the external pipe (1) and the internal pipe (2) so as to be freely rotated.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2003320076A Pick-up tool with adhesive material 审中-公开
标题翻译：具有粘合材料的拾取工具
公开(公告)号：JP2003320076A
公开(公告)日：2003-11-11
申请号：JP2002170672
申请日：2002-05-07
申请人： Isamu Tanaka , 勇田中
发明人： TANAKA ISAMU
IPC分类号： A63F5/04
摘要： PROBLEM TO BE SOLVED: To pick up a game coin which has fallen on a floor, by sticking the coin to an adhesive material, and to remove the coin by pressing a knock part without removing the coin with the fingertip.
SOLUTION: A vertically moving inner shaft 4 is provided inside a cylindrical rod 1, and the lower end of the inner shaft 4 is made a push part 2, while a knock part 3 is formed on the opposite side. The lower end of the cylindrical rod 1 is provided with a tip chamber 8 forming an outer adhesive chamber 6 and an inner spring chamber 7 by a partition plate 5. The adhesive material 9 mounted to the adhesive chamber 6, and the partition plate 5 are provided with a through-hole 10 allowing the vertical movement of the push part 2. An external wall of the adhesive chamber 6 is formed of an elastic wall part 15 formed of rubber, soft plastic, or the like.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过将硬币粘贴到粘合剂材料上来拾取落在地板上的游戏硬币，并且通过按压敲击部分而不用指尖去除硬币来移除硬币。解决方案：垂直移动的内轴4设置在圆柱形杆1的内部，内轴4的下端形成为推动部2，而在相反侧形成爆震部3。圆柱形杆1的下端设置有通过隔板5形成外部粘合剂室6和内部弹簧室7的顶端室8。安装到粘合剂室6的粘合剂材料9和隔板5是设置有允许推动部2的垂直移动的通孔10.粘合剂室6的外壁由橡胶，软塑料等形成的弹性壁部15形成。版权所有（C）2004，JPO

3. 发明申请

US20130125982A1 PHOTOELECTRIC CONVERSION DEVICE 审中-公开
标题翻译：光电转换器件
公开(公告)号：US20130125982A1
公开(公告)日：2013-05-23
申请号：US13813011
申请日：2011-07-27
申请人： Seiji Oguri , Isamu Tanaka , Norihiko Matsushima , Akio Yamamoto
发明人： Seiji Oguri , Isamu Tanaka , Norihiko Matsushima , Akio Yamamoto
IPC分类号： H01L31/032
CPC分类号： H01L31/0322 , H01L31/046 , H01L31/0465 , H01L31/0749 , Y02E10/541
摘要： It is aimed to provide a photoelectric conversion device having high adhesion between a light-absorbing layer and an electrode layer as well as high photoelectric conversion efficiency. A photoelectric conversion device comprises a light-absorbing layer including a chalcopyrite-based compound semiconductor and oxygen. The light-absorbing layer includes voids therein. An atomic concentration of oxygen in the vicinity of the voids is higher than an average atomic concentration of oxygen in the light-absorbing layer.
摘要翻译：旨在提供一种在光吸收层和电极层之间具有高粘附性的光电转换装置以及高的光电转换效率。光电转换装置包括包含基于黄铜矿的化合物半导体和氧的光吸收层。光吸收层包括其中的空隙。空隙附近的氧原子浓度高于光吸收层中氧的平均原子浓度。

4. 发明申请

US20130000722A1 PHOTOELECTRIC CONVERSION DEVICE AND METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE 审中-公开
公开(公告)号：US20130000722A1
公开(公告)日：2013-01-03
申请号：US13634972
申请日：2011-02-28
申请人： Kazuki Yamada , Isamu Tanaka , Seiichiro Inai
发明人： Kazuki Yamada , Isamu Tanaka , Seiichiro Inai
IPC分类号： H01L31/0236 , H01L31/18
CPC分类号： H01L31/03923 , H01L31/02363 , H01L31/046 , H01L31/0465 , Y02E10/541 , Y02P70/521
摘要： It is aimed to provide a photoelectric conversion device having improved conversion efficiency, and a method for manufacturing the photoelectric conversion device. For achieving this object, a photoelectric conversion device including a first semiconductor layer and a second semiconductor layer is employed. In the photoelectric conversion device, the first semiconductor layer includes one principal surface on which a plurality of projections are scattered, includes a I-III-VI group compound semiconductor, and has a first conductivity type. The second semiconductor layer is disposed on the one principal surface, has a thickness in a normal direction of the one principal surface, and has a second conductivity type different from the first conductivity type. Further, a first distance along which each of the projections is projected in the normal direction is longer than a second distance along which the second semiconductor layer is provided in the normal direction.

5. 发明申请

US20060282193A1 Method of and system for managing rack operation, method of and system for managing multistage rack, article conveyance and storage device, and computer product 审中-公开
公开(公告)号：US20060282193A1
公开(公告)日：2006-12-14
申请号：US11493619
申请日：2006-07-27
申请人： Sakae Ishikawa , Satoshi Ishihara , Tomoaki Arai , Isamu Tanaka
发明人： Sakae Ishikawa , Satoshi Ishihara , Tomoaki Arai , Isamu Tanaka
IPC分类号： G06F7/00
CPC分类号： B65D19/44 , B65D19/385 , B65D2203/06
摘要： When a first article is to be delivered to a customer and a second article is to be collected from the customer, first rack components required for delivery of the first article and second rack components not required for delivery of the first article, yet required for collecting the second article, are specified. Delivery procedure and collection procedure of the articles using the specified first rack components and second rack components are instructed to a worksite. Accordingly, delivery and collection of the articles can be carried out by making efficient use of the rack components commonly used for the first article and the second article.

6. 发明授权

US5479262A Digital image forming apparatus 失效
标题翻译：数字图像形成装置
公开(公告)号：US5479262A
公开(公告)日：1995-12-26
申请号：US96981
申请日：1993-07-27
申请人： Kazuhiko Namiki , Eiko Mito , Masahiro Ishikawa , Michihito Ohashi , Isamu Tanaka
发明人： Kazuhiko Namiki , Eiko Mito , Masahiro Ishikawa , Michihito Ohashi , Isamu Tanaka
IPC分类号： G03G21/00 , G03G15/04 , G03G15/36 , G03G21/14 , H04N1/00 , H04N1/04 , H04N1/10 , H04N1/107 , H04N1/193 , H04N1/38 , H04N1/387 , H04N1/21
CPC分类号： H04N1/387 , H04N1/00681 , H04N1/00708 , H04N1/00716 , H04N1/00737 , H04N1/00748 , H04N1/00795 , H04N1/00816 , H04N1/38 , H04N1/1013 , H04N1/193 , H04N2201/0434
摘要： A digital image forming apparatus which detects a center of a book document when reading and writing an image of the document, including a document, a document board on which the document is set, a reading device for reading the document by scanning the document, an A/D converter for converting an analog signal which is read by the reading device to a digital signal, a signal processor for processing the digital signal, including a first detector for detecting the existence of a dark portion in the image of the document and judging the document to be a book document if the document image has the dark portion, based on the signal corresponding to at least two lines on the document in a scanning direction, or in a direction perpendicular to the scanning direction and a second detector for detecting a center portion of the document on the basis of each center dark portion of each signal of the lines if the document is judged to be a book document, and a writing device for writing the digital signal on a photoconductive element in relation to the detected center portion. Edge portions of the document can similarly be detected and used in writing an image of the document so that an unnecessary part of the book document can be erased with simple structure and operation.
摘要翻译：一种数字图像形成装置，其在读取和写入文档的图像时检测书本文档的中心，包括文档，设置有文档的文档板，通过扫描文档读取文档的读取装置，用于将由读取装置读取的模拟信号转换为数字信号的A / D转换器，用于处理数字信号的信号处理器，包括用于检测文档图像中暗部的存在的第一检测器，并且判断基于与扫描方向上的原稿上的至少两条线对应的信号或与扫描方向垂直的方向的文档图像具有暗部的文档作为书本文档，以及第二检测器，用于检测文档如果文档被判断为书本文件，则基于每行信号的每个中心暗部分的文档的中心部分，以及用于写入数字的书写装置相关于检测到的中心部分的感光元件上的信号。文档的边缘部分可以类似地被检测并用于书写文档的图像，使得书本文档的不必要部分能够以简单的结构和操作被擦除。

7. 发明授权

US5268255A Photo-setting resist composition, a process for producing a printed circuit board by using the composition, and a printed circuit board obtained by using the composition 失效
标题翻译：光固化抗蚀剂组合物，通过使用该组合物制造印刷电路板的方法和通过使用该组合物获得的印刷电路板
公开(公告)号：US5268255A
公开(公告)日：1993-12-07
申请号：US767893
申请日：1991-09-30
申请人： Hiroshi Kikuchi , Makio Watanabe , Shinichiro Imabayashi , Reiko Yano , Isamu Tanaka , Hitoshi Oka , Yukihiro Taniguchi , Shigeru Fujita
发明人： Hiroshi Kikuchi , Makio Watanabe , Shinichiro Imabayashi , Reiko Yano , Isamu Tanaka , Hitoshi Oka , Yukihiro Taniguchi , Shigeru Fujita
IPC分类号： C08G59/00 , C08F2/50 , C08F283/10 , C08G59/18 , C08G59/50 , C08L63/00 , G03F1/00 , G03F7/027 , G03F7/031 , G03F7/032 , G03F7/038 , H05K3/06 , H05K3/18 , H05K3/28 , G03F7/004
CPC分类号： H05K3/287 , C08F283/10 , C08G59/5046 , G03F7/032 , Y10S430/119
摘要： A printed circuit board has a resist layer made from a photo-setting resist composition containing:(A) a polyfunctional unsaturated compound which is solid at room temperature,(B) a polyfunctional unsaturated compound which is liquid at room temperature,(C) a photopolymerization initiator,(D) an epoxy resin,(E) at least one member selected from the group consisting of:(i) a curing agent for the epoxy resin and either melamine or the derivative thereof, and(ii) a compound having a 2,4-diamino-s-triazine ring and an imidazole ring in the molecule.
摘要翻译：印刷电路板具有由光固化抗蚀剂组合物制成的抗蚀剂层，其含有：（A）在室温下为固体的多官能不饱和化合物，（B）室温下为液体的多官能不饱和化合物，（C）光聚合引发剂，（D）环氧树脂，（E）选自以下的至少一种：（i）环氧树脂用固化剂和三聚氰胺或其衍生物，和（ii）具有 2,4-二氨基-s-三嗪环和咪唑环。

8. 发明授权

US5091283A Photocurable diallyl phthalate resin composition and printed circuit board using the same 失效
标题翻译：可光固化的邻苯二甲酸二烯丙酯树脂组合物和使用其的印刷电路板
公开(公告)号：US5091283A
公开(公告)日：1992-02-25
申请号：US499706
申请日：1990-03-27
申请人： Isamu Tanaka , Hitoshi Oka , Makio Watanabe , Hiroshi Kikuchi , Shinichiro Imabayashi , Yukihiro Taniguti
发明人： Isamu Tanaka , Hitoshi Oka , Makio Watanabe , Hiroshi Kikuchi , Shinichiro Imabayashi , Yukihiro Taniguti
IPC分类号： C08L31/08 , C08F290/00 , C08F299/00 , C08G59/00 , C08G59/40 , G03F7/028 , G03F7/038 , H05K3/28
CPC分类号： G03F7/028 , G03F7/038 , H05K3/287 , Y10S430/119
摘要： A photo curable diallyl phthalate resin composition characterized by containing 0.1 to 10 parts by weight of an agent for preventing back side undesirable curing and 20 to 100 parts by weight of a filler per 100 parts by weight of a diallyl phthalate prepolymer is particularly suitable for a partly additive process for forming a solder resist effective for preventing back side undesirable curing by ultraviolet light and having resistance to release of substances from the solder resist for deteriorating properties of plated copper film as well as for giving good mechanical properties.
摘要翻译：一种可光固化的邻苯二甲酸二烯丙酯树脂组合物，其特征在于，相对于100重量份的邻苯二甲酸二烯丙酯预聚物，含有0.1〜10重量份的防止背面不良固化的试剂和20〜100重量份的填料，特别适用于用于形成阻焊剂的部分添加方法，其有效防止紫外线的背面不期望的固化，并且具有抵抗电阻铜的物质释放的性能，以降低电镀铜膜的性能以及提供良好的机械性能。

9. 发明授权

US4555532A Epoxy resin composition 失效
标题翻译：环氧树脂组合物
公开(公告)号：US4555532A
公开(公告)日：1985-11-26
申请号：US659565
申请日：1984-10-10
申请人： Isamu Tanaka , Hiroshi Kikuchi , Akira Tomizawa , Hitoshi Oka
发明人： Isamu Tanaka , Hiroshi Kikuchi , Akira Tomizawa , Hitoshi Oka
IPC分类号： B23K35/22 , C08G59/50 , C08L63/00 , H05K3/00 , H05K3/18 , H05K3/28 , C09D3/58
CPC分类号： C08L63/00 , B23K35/224 , C08G59/5053 , C23C18/1605 , H05K3/184 , H05K3/285 , H05K2201/0166 , H05K2201/0209 , H05K3/0076
摘要： An epoxy resin composition containing as a latent hardener a diaminotriazine-modified imidazole compound and dicyandiamide is improved in the usable life of an solder resist ink composition and can give a solder resist also excellent in resistance to an electroless plating bath.
摘要翻译：含有二氨基三嗪改性咪唑化合物和双氰胺作为潜在硬化剂的环氧树脂组合物在阻焊油墨组合物的使用寿命方面得到改善，并且可以得到耐化学镀浴的抗蚀剂也优异。

10. 发明申请

US20120319244A1 METHOD FOR MANUFACTURING SEMICONDUCTOR LAYER, METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE, AND SEMICONDUCTOR LAYER FORMING SOLUTION 审中-公开
标题翻译：制造半导体层的方法，制造光电转换装置的方法和形成解决方案的半导体层
公开(公告)号：US20120319244A1
公开(公告)日：2012-12-20
申请号：US13575916
申请日：2011-01-25
申请人： Seiji Oguri , Keizo Takeda , Koichiro Yamada , Kotaro Tanigawa , Isamu Tanaka , Riichi Sasamori , Hiromitsu Ogawa
发明人： Seiji Oguri , Keizo Takeda , Koichiro Yamada , Kotaro Tanigawa , Isamu Tanaka , Riichi Sasamori , Hiromitsu Ogawa
IPC分类号： H01L31/18 , H01L21/20 , H01L29/20
CPC分类号： H01L31/0749 , H01L31/0322 , H01L31/046 , Y02E10/541 , Y02P70/521
摘要： A method for manufacturing a semiconductor layer according to an embodiment of the present invention comprises preparing a first compound, preparing a second compound, making a semiconductor layer forming solution, and forming a semiconductor layer including a group compound by using this semiconductor layer forming solution. The first compound contains a first chalcogen-element-containing organic compound, a first Lewis base, a I-B group element, and a first III-B group element. The second compound contains an organic ligand and a second III-B group element. The semiconductor layer forming solution contains the first compound, the second compound, and an organic solvent.
摘要翻译：根据本发明的实施方案的半导体层的制造方法包括通过使用该半导体层形成溶液制备第一化合物，制备第二化合物，制备半导体层形成溶液，以及形成包含基团化合物的半导体层。第一化合物含有第一含硫族元素的有机化合物，第一路易斯碱，I-B族元素和第一III-B族元素。第二化合物含有有机配体和第二III-B族元素。半导体层形成溶液含有第一化合物，第二化合物和有机溶剂。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式