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    • 6. 发明申请
    • Scratch-Resistant Flameproof Thermoplastic Resin Composition with Improved Compatibility
    • 具有改进兼容性的抗划伤性防火热塑性树脂组合物
    • US20100256288A1
    • 2010-10-07
    • US12817302
    • 2010-06-17
    • Il Jin KIMKee Hae KWONBok Nam JANG
    • Il Jin KIMKee Hae KWONBok Nam JANG
    • C08L33/10
    • C08L33/10C08K3/016C08K5/0066C08L33/12C08L69/00C08L2205/03C08L2666/18C08L2666/02C08L2666/04
    • Disclosed herein is a scratch-resistant flameproof thermoplastic resin composition, the resin composition comprising a base resin including (A) about 50 to about 90% by weight of a polycarbonate resin; (B) about 1 to about 50% by weight of a methacrylic copolymer resin with a refractive index of about 1.495 to about 1.590; and (C) about 0 to about 49% by weight of a (meth)acrylic resin, and (D) about 5 to about 40 parts by weight of a flame retardant, based on about 100 parts by weight of the base resin comprising (A)+(B)+(C). The resin composition of the present invention can have good flame retardancy, scratch resistance, colorability, and good appearance due to its improved compatibility. The resin composition of the invention can be used to produce plastic molded articles which can exhibit better physical properties than products produced using conventional resin compositions.
    • 本发明公开了一种抗刮防火热塑性树脂组合物,该树脂组合物包括基础树脂,其包含(A)约50至约90重量%的聚碳酸酯树脂; (B)约1至约50重量%的折射率为约1.495至约1.590的甲基丙烯酸共聚物树脂; 和(C)约0至约49重量%的(甲基)丙烯酸树脂,和(D)约5至约40重量份的阻燃剂,基于约100重量份的基础树脂,其包含( A)+(B)+(C)。 由于其相容性的提高,本发明的树脂组合物可以具有良好的阻燃性,耐刮擦性,着色性和良好的外观。 本发明的树脂组合物可用于生产与使用常规树脂组合物制备的产品相比可以表现出更好的物理性能的塑料模塑制品。
    • 8. 发明申请
    • Soldering apparatus for printed circuit board, soldering method for printed circuit board and soldering cream printing unit for soldering printed circuit board
    • 印刷电路板焊接设备,印刷电路板焊接方法和印刷电路板焊接焊膏印刷单元
    • US20060273138A1
    • 2006-12-07
    • US11445203
    • 2006-06-02
    • Seung-hoon LeeSuk-young KangIl-jin KimJun-chul ShinSang-kyoon Yoon
    • Seung-hoon LeeSuk-young KangIl-jin KimJun-chul ShinSang-kyoon Yoon
    • A47J36/02
    • H05K3/3415H05K3/3447H05K3/3484H05K2203/0126H05K2203/1476H05K2203/1563Y02P70/613
    • Provided is a soldering apparatus for a printed circuit board (PCB) for soldering the PCB and one or more electronic components populated on the PCB, the PCB having an upper side and a bottom side that is opposite the upper side, including a PCB INVERTING UNIT for rotatably supporting the PCB; a soldering cream PRINTING UNIT for printing on the lower side of the PCB a soldering cream substantially on a plurality of lead holes formed in the PCB in an inverted state, wherein in the inverted state a position of the PCB is inverted by the PCB INVERTING UNIT such that the lower side of the PCB faces in an upward direction; and a hardener for hardening the printed soldering cream while the one or more electronic components are inserted into the lead holes in a reverted state, wherein in the reverted state a position of the PCB is reverted by the PCB inverter such that the upper side of the PCB faces in a upward direction. Thus, provided is a soldering apparatus for a PCB, a soldering method for the PCB, and a soldering cream PRINTING UNIT for soldering on the PCB electronic components that are soldered on the PCB in high density and more reliability.
    • 本发明提供一种用于焊接印刷电路板的印刷电路板(PCB)和PCB上的一个或多个电子元件的焊接装置,PCB具有与上侧相对的上侧和底侧,包括PCB反相单元 用于可旋转地支撑PCB; 一种焊膏印刷单元,用于在PCB的下侧印刷基本上在反相状态下形成在PCB中的多个引线孔上的焊膏,其中在倒置状态下,PCB的位置被PCB反相单元反转 使得PCB的下侧面向上方向; 以及用于在所述一个或多个电子部件以回复状态插入所述引线孔中时硬化所述印刷焊膏的硬化剂,其中在所述还原状态下,所述PCB的位置由所述PCB逆变器回复,使得所述PCB逆变器的上侧 PCB面向上方。 因此,提供了用于PCB的焊接装置,用于PCB的焊接方法以及用于以高密度和更可靠的方式焊接在PCB上焊接在PCB上的PCB电子部件的焊膏印刷单元。
    • 10. 发明申请
    • Transparent Thermoplastic Resin Composition with Improved Impact Strength and Melt Flow Index
    • 具有改善的冲击强度和熔体流动指数的透明热塑性树脂组合物
    • US20110160383A1
    • 2011-06-30
    • US12973975
    • 2010-12-21
    • Kee Hae KwonJin Hwa ChungKwang Soo ParkDong Kil ChoiIl Jin Kim
    • Kee Hae KwonJin Hwa ChungKwang Soo ParkDong Kil ChoiIl Jin Kim
    • C08L33/10C08L51/00
    • C08L33/06C08L2205/02C08L2205/025
    • The present invention provides a transparent thermoplastic resin composition which may comprise (A) about 1 to about 100 parts by weight of an ultra-high molecular weight branched acrylic copolymer resin; (B) about 0 to about 99 parts by weight of an acrylic resin; and (C) about 0 to about 40 parts by weight of an acrylic impact modifier, based on 100 parts by weight of (A) and (B). The ultra-high molecular branched acrylic copolymer resin (A) may be prepared by polymerizing a monomer mixture comprising (a1) about 50 to about 99.899% by weight of a mono-functional monomer, (a2) about 0.1 to about 40% by weight of a (meth)acrylic monomer having a flexible segment represented following Chemical Formula 1, and (a3) about 0.001 to about 10% by weight of a branch-inducing monomer. The thermoplastic resin composition of the present invention can have improved transparency, scratch resistance, flowability, and impact strength. wherein m is an integer from 3 to 18, Y is methyl or hydrogen, and X is methyl or hydrocarbon.
    • 本发明提供一种透明热塑性树脂组合物,其可以包含(A)约1至约100重量份的超高分子量支化丙烯酸共聚物树脂; (B)约0至约99重量份的丙烯酸树脂; 和(C)基于100重量份的(A)和(B),约0至约40重量份的丙烯酸类抗冲改性剂。 超高分子支链丙烯酸共聚物树脂(A)可以通过将单体混合物(a1)为约50-约99.899重量%的单官能单体(a2)为约0.1至约40重量% 的(甲基)丙烯酸单体,其具有按化学式1表示的柔性链段,和(a3)约0.001至约10重量%的分枝诱导性单体。 本发明的热塑性树脂组合物可以提高透明性,耐划伤性,流动性和冲击强度。 其中m为3至18的整数,Y为甲基或氢,X为甲基或烃。