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    • 3. 发明申请
    • RESISTIVE MEMORY DEVICES INCLUDING SELECTED REFERENCE MEMORY CELLS
    • 包括选择的参考存储器单元的电阻存储器件
    • US20090067216A1
    • 2009-03-12
    • US12265941
    • 2008-11-06
    • Hyun-Jo KimKyung-Tae NamIn-Gyu BaekSe-Chung OhJang-Eun LeeJun-Ho Jeong
    • Hyun-Jo KimKyung-Tae NamIn-Gyu BaekSe-Chung OhJang-Eun LeeJun-Ho Jeong
    • G11C11/00G11C11/02G11C7/00
    • G11C11/1675G11C11/1673
    • A magnetic memory cell array device can include a first current source line extending between pluralities of first and second memory cells configured for respective simultaneous programming and configured to conduct adequate programming current for writing one of the pluralities of first and second memory cells, a first current source transistor coupled to the first current source line and to a word line, a programming conductor coupled to the first current source transistor and extending across bit lines coupled to the one of the pluralities of first and second memory cells, configured to conduct the programming current across the bit lines, a second current source transistor coupled to the programming conductor and configured to switch the programming current from the programming conductor to a second current source transistor output, a second current source line extending adjacent the one of the pluralities of first and second memory cells opposite the first current source line, a first bias circuit configured to apply a first bias voltage to the first or second memory cells selected for accessed during a read operation, and a second bias circuit configured to apply a second bias voltage to the first or second memory cells unselected for access during the read operation.
    • 磁存储单元阵列器件可以包括在多个第一和第二存储器单元之间延伸的第一电流源线,该第一和第二存储器单元被配置用于相应的同时编程,并且被配置为进行用于写入多个第一和第二存储器单元之一的足够的编程电流,第一电流 源极晶体管,耦合到第一电流源线和字线,编程导体,其耦合到第一电流源晶体管并且延伸跨越耦合到多个第一和第二存储器单元中的一个的位线,被配置为导通编程电流 耦合到编程导体并被配置为将编程电流从编程导体切换到第二电流源晶体管输出的第二电流源晶体管,与多个第一和第二晶体管中的一个相邻延伸的第二电流源极线 与第一电流源线相对的存储单元,af 第一偏置电路,被配置为将第一偏置电压施加到在读取操作期间被选择访问的第一或第二存储器单元;以及第二偏置电路,被配置为将第二偏置电压施加到未被选择以在读取期间访问的第一或第二存储器单元 操作。
    • 6. 发明申请
    • Magnetic random access memory device and method of forming the same
    • 磁性随机存取存储器件及其形成方法
    • US20060174473A1
    • 2006-08-10
    • US11347280
    • 2006-02-06
    • Se-Chung OhJang-Eun LeeJun-Soo BaeHyun-Jo KimKyung-Tae NamYoung-Ki Ha
    • Se-Chung OhJang-Eun LeeJun-Soo BaeHyun-Jo KimKyung-Tae NamYoung-Ki Ha
    • G11B5/33G11B5/127H04R31/00
    • G11C11/16B82Y10/00B82Y25/00G11B5/3909H01L27/228H01L43/08H01L43/12Y10T29/49034Y10T29/49044
    • Example embodiments of the present invention disclose a semiconductor memory device and a method of forming a memory device. A semiconductor memory device may include a digit line disposed on a substrate, an intermediate insulating layer covering the digit line, a magnetic tunnel junction (MTJ) pattern disposed on the intermediate insulating layer and over the digit line, the MTJ pattern including a sequentially stacked lower magnetic pattern, upper magnetic pattern, and capping pattern, wherein the capping pattern does not react with the upper magnetic pattern at a temperature above about 280° C., and a bit line connected to the capping pattern and disposed to intersect the digit line. A method of forming a semiconductor memory device may include forming a digit line on a substrate, forming an intermediate insulating layer covering the digit line, forming a magnetic tunnel junction (MTJ) pattern on the intermediate insulating layer, the MTJ pattern including a sequentially stacked lower magnetic pattern, upper magnetic pattern, and capping pattern, wherein the capping pattern does not react with the upper magnetic pattern at a temperature above about 280° C., performing an annealing operation at a temperature of about 350° C. or higher, and forming a bit line connected to the capping pattern and disposed to intersect the digit line.
    • 本发明的示例性实施例公开了半导体存储器件和形成存储器件的方法。 半导体存储器件可以包括设置在衬底上的数字线,覆盖数字线的中间绝缘层,设置在中间绝缘层上方和数字线上的磁性隧道结(MTJ)图案,MTJ图案包括顺序堆叠 下磁性图案,上磁性图案和封盖图案,其中封盖图案在高于约280℃的温度下不与上磁性图案反应,而位线连接到封盖图案并且设置成与数字线相交 。 形成半导体存储器件的方法可以包括在衬底上形成数字线,形成覆盖数字线的中间绝缘层,在中间绝缘层上形成磁隧道结(MTJ)图案,MTJ图案包括顺序层叠的 较低的磁性图案,上部磁性图案和封盖图案,其中封盖图案在高于约280℃的温度下不与上部磁性图案反应,在约350℃或更高的温度下进行退火操作, 并且形成连接到所述封盖图案并且设置成与所述数字线相交的位线。