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1. 发明申请

US20130330525A1 DECORATIVE COATING 有权
标题翻译：装饰涂料
公开(公告)号：US20130330525A1
公开(公告)日：2013-12-12
申请号：US14000492
申请日：2012-02-20
申请人： Fumitaka Yoshinaga , Hiroshi Yanagimoto
发明人： Fumitaka Yoshinaga , Hiroshi Yanagimoto
IPC分类号： H01Q1/32
CPC分类号： B60R13/005 , B32B3/10 , B32B5/16 , B32B15/08 , G01S7/032 , G01S2013/9375 , H01Q1/3233 , H01Q1/3283 , H01Q1/422 , H01Q1/425 , Y10T428/24851 , Y10T428/24893 , Y10T428/24909 , Y10T428/2991
摘要： A decorative coating (10) that is formed on a surface of a resin substrate F that is placed on a path an electromagnetic waves of a radar device, and the decorative coating (10) is composed of a layer (2) in which metal nanoparticles (1) are covered with an inorganic oxide material.
摘要翻译：在设置在雷达装置的电磁波路径上的树脂基板F的表面上形成的装饰涂层（10）和装饰涂层（10）由层（2）构成，其中金属纳米颗粒（1）被无机氧化物材料覆盖。

2. 发明申请

US20110088945A1 WIRE HARNESS AND PRODUCTION METHOD THEREFOR 审中-公开
标题翻译：电线束及其生产方法
公开(公告)号：US20110088945A1
公开(公告)日：2011-04-21
申请号：US12999759
申请日：2009-06-16
申请人： Hiroshi Yanagimoto , Takeshi Bessho
发明人： Hiroshi Yanagimoto , Takeshi Bessho
IPC分类号： H02G3/04 , H01F7/06
CPC分类号： H05K3/107 , H05K1/028 , H05K2201/051 , H05K2201/09827 , Y10T29/49071
摘要： A wire harness has a wiring film which includes an insulating substrate (10), a plurality of wires (20) arranged on a surface of the insulating substrate (10), and an insulating covering (30) that coats the surface of the insulating substrate (10) so as to cover the wires (20). The wire harness is shaped by winding the wiring film around a longitudinal axis of a core (C), which is paralleled to the longitudinal axis (L) of the wires.
摘要翻译：线束具有布线膜，该布线膜包括绝缘基板（10），布置在所述绝缘基板（10）的表面上的多个布线（20）和覆盖所述绝缘基板的表面的绝缘覆盖物（30）（10）以覆盖电线（20）。线束通过将布线膜围绕与电线的纵向轴线（L）平行的芯（C）的纵向轴线缠绕而成形。

3. 发明申请

US20100270057A1 CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：电路板及其制造方法
公开(公告)号：US20100270057A1
公开(公告)日：2010-10-28
申请号：US12525967
申请日：2008-02-27
申请人： Hiroshi Yanagimoto , Takeshi Bessho , Hidemi Nawafune , Kensuke Akamatsu
发明人： Hiroshi Yanagimoto , Takeshi Bessho , Hidemi Nawafune , Kensuke Akamatsu
IPC分类号： H05K1/00 , H05K3/10 , H05K3/46
CPC分类号： H05K3/107 , H05K3/20 , H05K3/207 , H05K3/246 , H05K2201/0347 , H05K2201/09736 , H05K2203/0108 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158
摘要： According to the present invention, a circuit board having a further-microfabricated circuit pattern that can be manufactured in further simplified steps is obtained. For such purpose, a mold 10, which has protrusions 11 formed in a pattern corresponding to a circuit pattern, is used to apply a conductive material layer (metal paste) 13 to head portions of the protrusions 11 of the mold 10. The mold is heat- and pressure-welded to the surface of a substrate 20 that is made of a resin film or the like. Accordingly, a pattern comprising the protrusions 11 and the conductive material layer (metal paste) 13 are transferred to the substrate 20. After transfer, the resin substrate (resin molding 30) is immersed in a copper sulfate plating bath for electrolytic plating treatment. Copper ions in the plating bath were deposited inside each recess 31 while the conductive material layer 13 is used as a base material for the formation of a metal wiring 32. A pattern of the recesses 31 transferred to the substrate-20 side is determined depending on a pattern comprising the protrusions 11 on the mold 10. Thus, a microfabricated high-density circuit pattern formed with metal wirings 32 having arbitrary aspect ratios can be obtained.
摘要翻译：根据本发明，可以获得可以进一步简化的步骤制造的具有更微细加工电路图案的电路板。为此目的，使用具有与电路图案相对应的图案形成的突起11的模具10，将导电材料层（金属糊）13施加到模具10的突起11的头部。模具为热压并且被压焊到由树脂膜等制成的基板20的表面上。因此，将包括突起11和导电材料层（金属膏）13的图案转印到基板20上。转印后，将树脂基板（树脂成型体30）浸渍在用于电解电镀处理的硫酸铜电镀浴中。将电镀液中的铜离子沉积在每个凹部31内，同时使用导电材料层13作为形成金属布线32的基材。转移到基板20侧的凹部31的图案根据在模具10上包括突起11的图案。因此，可以获得由具有任意长宽比的金属布线32形成的微细加工的高密度电路图案。

4. 发明申请

US20060159854A1 Method for forming inorganic thin film on polyimide resin and method for producing polyimide resin having reformed surface for forming inorganic thin film 审中-公开
标题翻译：在聚酰亚胺树脂上形成无机薄膜的方法和具有用于形成无机薄膜的重整表面的聚酰亚胺树脂的制造方法
公开(公告)号：US20060159854A1
公开(公告)日：2006-07-20
申请号：US11296228
申请日：2005-12-08
申请人： Hiroshi Yanagimoto , Hidemi Nawafune , Kensuke Akamatsu
发明人： Hiroshi Yanagimoto , Hidemi Nawafune , Kensuke Akamatsu
IPC分类号： B05D1/40 , B05D5/00 , B05D1/36 , B05D5/12
CPC分类号： C23C18/08 , C23C18/04 , C23C18/06 , C23C18/1216 , C23C18/1279 , C23C18/1641 , C23C18/1658 , C23C18/2006 , C23C18/206 , C23C18/2086 , H05K1/0346 , H05K3/107 , H05K3/182 , H05K3/381 , H05K2201/0154 , H05K2203/013 , H05K2203/0783 , H05K2203/0793 , H05K2203/1157
摘要： The present invention provides a method for forming an inorganic thin film on a polyimide resin, which includes: (1) a step of applying an alkaline aqueous solution on a polyimide resin at the site where an inorganic thin film is formed to cleave an imide ring of the polyimide resin so as to produce a carboxyl group and to reform the polyimide resin to a polyamic acid whereby a reformed portion including the polyamic acid having the carboxyl group is formed; (2) a step of contacting a solvent in which the polyamic acid is soluble to the reformed portion to remove a part of the reformed portion so as to form a concave part; (3) a step of contacting a solution containing a metal ion to the reformed portion, which is near the concave part, so as to produce a metal salt of the carboxyl group; and (4) a step of separating the metal salt as a metal, a metal oxide or a semiconductor on the surface of the polyimide resin so as to form the inorganic thin film.
摘要翻译：本发明提供了一种在聚酰亚胺树脂上形成无机薄膜的方法，其包括：（1）在形成无机薄膜的位置处将聚酰亚胺树脂上施加碱性水溶液以切割酰亚胺环的步骤的聚酰亚胺树脂以产生羧基并将聚酰亚胺树脂重整为聚酰胺酸，由此形成包含具有羧基的聚酰胺酸的重整部分; （2）将聚酰胺酸溶解的溶剂与重整部分接触以除去部分重整部分以形成凹部的步骤; （3）将含有金属离子的溶液接触到靠近凹部的重整部分的步骤，以产生羧基的金属盐; 和（4）在聚酰亚胺树脂的表面上分离金属盐，金属氧化物或半导体的金属盐以形成无机薄膜的步骤。

5. 发明授权

US09233650B2 Decorative coating 有权
标题翻译：装饰涂层
公开(公告)号：US09233650B2
公开(公告)日：2016-01-12
申请号：US14000492
申请日：2012-02-20
申请人： Fumitaka Yoshinaga , Hiroshi Yanagimoto
发明人： Fumitaka Yoshinaga , Hiroshi Yanagimoto
IPC分类号： B60R13/00 , B32B3/10 , B32B5/16 , B32B15/08 , H01Q1/32 , H01Q1/42
CPC分类号： B60R13/005 , B32B3/10 , B32B5/16 , B32B15/08 , G01S7/032 , G01S2013/9375 , H01Q1/3233 , H01Q1/3283 , H01Q1/422 , H01Q1/425 , Y10T428/24851 , Y10T428/24893 , Y10T428/24909 , Y10T428/2991
摘要： A decorative coating (10) that is formed on a surface of a resin substrate F that is placed on a path an electromagnetic waves of a radar device, and the decorative coating (10) is composed of a layer (2) in which metal nanoparticles (1) are covered with an inorganic oxide material.
摘要翻译：在设置在雷达装置的电磁波路径上的树脂基板F的表面上形成的装饰涂层（10）和装饰涂层（10）由层（2）构成，其中金属纳米颗粒（1）被无机氧化物材料覆盖。

6. 发明申请

US20150014178A1 FILM FORMATION DEVICE AND FILM FORMATION METHOD FOR FORMING METAL FILM 审中-公开
标题翻译：薄膜形成装置和薄膜形成方法形成金属薄膜
公开(公告)号：US20150014178A1
公开(公告)日：2015-01-15
申请号：US14371036
申请日：2013-02-21
申请人： Motoki Hiraoka , Hiroshi Yanagimoto , Yuki Sato , Takayasu Yoshioka
发明人： Motoki Hiraoka , Hiroshi Yanagimoto , Yuki Sato , Takayasu Yoshioka
IPC分类号： C25D17/00 , C25D21/14
CPC分类号： C25D17/00 , C25D3/00 , C25D3/38 , C25D5/02 , C25D5/022 , C25D5/08 , C25D5/34 , C25D17/005 , C25D17/12 , C25D17/14 , C25D21/14
摘要： Provided are a film formation device and a film formation method for forming a metal film, with which metal films with a desired thickness can be continuously formed on surfaces of a plurality of substrates. A film formation device 1A includes at least a positive electrode 11, a negative electrode 12, a solid electrolyte membrane 13 arranged on a surface of the positive electrode 12, between. the positive electrode and a substrate to serve as the negative electrode, and a power supply unit E adapted to apply a voltage across the positive electrode 11 and the substrate B. A voltage is applied across the positive electrode 11 and the substrate B to deposit metal on a surface of the substrate from metal ions contained in the solid electrolyte membrane 13, whereby a metal film F made of metal is formed, The positive electrode 11 is made of a porous body that allows a solution L containing metal ions to pass therethrough and supplies the metal ions to the solid electrolyte membrane 13.
摘要翻译：提供一种用于形成金属膜的成膜装置和成膜方法，可以在多个基板的表面上连续地形成具有所需厚度的金属膜。成膜装置1A至少包括正极11，负极12，布置在正极12的表面上的固体电解质膜13。正电极和用作负极的衬底，以及适于在正电极11和衬底B两端施加电压的电源单元E.跨正电极11和衬底B施加电压以沉积金属在固体电解质膜13中的金属离子的表面上形成由金属制成的金属膜F.正极11由允许含有金属离子的溶液L通过的多孔体构成，将金属离子供给固体电解质膜13。

7. 发明申请

US20130302515A1 METHOD OF FABRICATING INSULATING RESIN MATERIAL 有权
标题翻译：制造绝缘树脂材料的方法
公开(公告)号：US20130302515A1
公开(公告)日：2013-11-14
申请号：US13981196
申请日：2012-01-04
申请人： Hiroshi Yanagimoto
发明人： Hiroshi Yanagimoto
IPC分类号： H01B3/44
CPC分类号： H01B3/441 , C08J3/128 , C08J3/20 , C08J5/18 , C09D1/00 , C09D7/20 , H01B3/442
摘要： The present invention relates to a method of fabricating an insulating resin material (4) from a core/shell particle (3) having a core particle (2) containing a macromolecular compound and a shell layer (1) coating the core particle (2) and containing an inorganic compound. The method of fabrication includes mixing the core/shell particles (3) with a good solvent (10) for the macromolecular compound, infiltrating the good solvent (10) through the shell layer (1), impregnating the good solvent (10) into the macromolecular compound, molding a compact from the impregnated core/shell particles (3), and removing the good solvent from the compact by heating the molded compact.
摘要翻译：本发明涉及一种由含有高分子化合物的核心颗粒（2）和涂覆核心颗粒（2）的壳层（1）的核/壳颗粒（3）制备绝缘树脂材料（4）的方法，并含有无机化合物。制备方法包括将核/壳颗粒（3）与高分子化合物的良溶剂（10）混合，通过壳层（1）渗透好的溶剂（10），将良溶剂（10）浸渍到高分子化合物，从浸渍的核/壳粒子（3）中成型成型体，通过加热成型体从成形体中除去良溶剂。

8. 发明授权

US08771566B2 Method of fabricating insulating resin material 有权
标题翻译：制造绝缘树脂材料的方法
公开(公告)号：US08771566B2
公开(公告)日：2014-07-08
申请号：US13981196
申请日：2012-01-04
申请人： Hiroshi Yanagimoto
发明人： Hiroshi Yanagimoto
IPC分类号： C08J5/12
CPC分类号： H01B3/441 , C08J3/128 , C08J3/20 , C08J5/18 , C09D1/00 , C09D7/20 , H01B3/442
摘要： The present invention relates to a method of fabricating an insulating resin material (4) from a core/shell particle (3) having a core particle (2) containing a macromolecular compound and a shell layer (1) coating the core particle (2) and containing an inorganic compound. The method of fabrication includes mixing the core/shell particles (3) with a good solvent (10) for the macromolecular compound, infiltrating the good solvent (10) through the shell layer (1), impregnating the good solvent (10) into the macromolecular compound, molding a compact from the impregnated core/shell particles (3), and removing the good solvent from the compact by heating the molded compact.
摘要翻译：本发明涉及一种由含有高分子化合物的核心颗粒（2）和涂覆核心颗粒（2）的壳层（1）的核/壳颗粒（3）制备绝缘树脂材料（4）的方法，并含有无机化合物。制备方法包括将核/壳颗粒（3）与高分子化合物的良溶剂（10）混合，通过壳层（1）渗透好的溶剂（10），将良溶剂（10）浸渍到高分子化合物，从浸渍的核/壳粒子（3）中成型成型体，通过加热成型体从成形体中除去良溶剂。

9. 发明授权

US08261437B2 Method for manufacturing a circuit board 失效
标题翻译：电路板制造方法
公开(公告)号：US08261437B2
公开(公告)日：2012-09-11
申请号：US12525967
申请日：2008-02-27
申请人： Hiroshi Yanagimoto , Takeshi Bessho , Hidemi Nawafune , Kensuke Akamatsu
发明人： Hiroshi Yanagimoto , Takeshi Bessho , Hidemi Nawafune , Kensuke Akamatsu
IPC分类号： H05K3/02
CPC分类号： H05K3/107 , H05K3/20 , H05K3/207 , H05K3/246 , H05K2201/0347 , H05K2201/09736 , H05K2203/0108 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158
摘要： According to the present invention, a circuit board having a further-microfabricated circuit pattern that can be manufactured in further simplified steps is obtained. For such purpose, a mold 10, which has protrusions 11 formed in a pattern corresponding to a circuit pattern, is used to apply a conductive material layer (metal paste) 13 to head portions of the protrusions 11 of the mold 10. The mold is heat- and pressure-welded to the surface of a substrate 20 that is made of a resin film or the like. Accordingly, a pattern comprising the protrusions 11 and the conductive material layer (metal paste) 13 are transferred to the substrate 20. After transfer, the resin substrate (resin molding 30) is immersed in a copper sulfate plating bath for electrolytic plating treatment. Copper ions in the plating bath were deposited inside each recess 31 while the conductive material layer 13 is used as a base material for the formation of a metal wiring 32. A pattern of the recesses 31 transferred to the substrate-20 side is determined depending on a pattern comprising the protrusions 11 on the mold 10. Thus, a microfabricated high-density circuit pattern formed with metal wirings 32 having arbitrary aspect ratios can be obtained.
摘要翻译：根据本发明，可以获得可以进一步简化的步骤制造的具有更微细加工电路图案的电路板。为此目的，使用具有与电路图案相对应的图案形成的突起11的模具10，将导电材料层（金属糊）13施加到模具10的突起11的头部。模具为热压并且被压焊到由树脂膜等制成的基板20的表面上。因此，将包括突起11和导电材料层（金属膏）13的图案转印到基板20上。转印后，将树脂基板（树脂成型体30）浸渍在用于电解电镀处理的硫酸铜电镀浴中。将电镀液中的铜离子沉积在每个凹部31内，同时使用导电材料层13作为形成金属布线32的基材。转移到基板20侧的凹部31的图案根据在模具10上包括突起11的图案。因此，可以获得由具有任意长宽比的金属布线32形成的微细加工的高密度电路图案。

10. 发明申请

US20110236672A1 DECORATIVE FILM AND METHOD FOR FORMING THE SAME 审中-公开
标题翻译：装饰膜及其形成方法
公开(公告)号：US20110236672A1
公开(公告)日：2011-09-29
申请号：US13132050
申请日：2008-12-01
申请人： Hiroshi Yanagimoto , Takeshi Bessho
发明人： Hiroshi Yanagimoto , Takeshi Bessho
IPC分类号： G01S7/02 , B32B5/16 , B05D5/00 , B82Y30/00
CPC分类号： B05D7/02 , B05D5/00 , C08K3/08 , C08K9/04 , C09D7/61 , G01S7/03 , G01S7/032 , G01S2013/9375 , H01Q1/44 , Y10T428/25
摘要： The present invention relates to a decorative film formed on the surface of a resin substrate positioned within a radar device path and a method for forming the same. The present invention provides a decorative film that can be formed with high yield and efficiency without highly accurate film thickness regulation and is excellent in terms of radiowave transmission performance and appearance design, with a metallic color tone, and to provide a method for forming the same. Such method is a method for forming a decorative film 10 on the surface of a resin substrate 101 positioned within a radar device path, wherein a decorative film 10 comprising an organic film 12 in which metal nanoparticles 11 are dispersed is formed by producing an organic material comprising a solvent in which metal nanoparticles 11 (to which organic molecules are coordinated) are dispersed, applying the organic material to the surface of a resin substrate 101, and volatilizing the solvent.
摘要翻译：本发明涉及形成在位于雷达装置路径内的树脂基板的表面上的装饰膜及其形成方法。本发明提供一种装饰膜，其可以以高产率和高效率形成，而没有高精度的膜厚度调节，并且在无光波传播性能和外观设计方面具有优异的金属色调，并提供其形成方法。这种方法是在位于雷达装置路径内的树脂基板101的表面上形成装饰膜10的方法，其中包括分散有金属纳米颗粒11的有机膜12的装饰膜10通过生产有机材料包括其中分散有金属纳米颗粒11（有机分子被配位的）的溶剂，将有机材料施加到树脂基板101的表面，并使溶剂挥发。

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