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1. 发明授权

US4608333A Radiation sensitive polymer composition 失效
标题翻译：辐射敏感聚合物组成
公开(公告)号：US4608333A
公开(公告)日：1986-08-26
申请号：US579008
申请日：1984-02-10
申请人： Gentaro Ohbayashi , Susumu Umemoto , Hiroo Hiramoto
发明人： Gentaro Ohbayashi , Susumu Umemoto , Hiroo Hiramoto
IPC分类号： C08L77/00 , G03F7/037 , G03F7/038 , G03C1/70 , C08F2/46 , C08F8/00
CPC分类号： G03F7/0387 , C08L77/00 , G03F7/037 , Y10S430/107 , Y10S430/12
摘要： A radiation-sensitive composition is described, which is comprised of (1) a polymer containing repeating units of the formula: ##STR1## wherein R.sup.1 is a trivalent or tetravalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R.sup.2 is a divalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R.sup.3 is hydrogen or an ammonium ion, n is 1 or 2, and COOR.sup.3 is located in an ortho or peri position with respect to the amide linkage, (2) an organic compound having a radiation-dimerizable or radiation-polymerizable olefinic double bond and an amino radical or a quaternary ammonium salt, and (3) an aromatic secondary or tertiary amine compound which is chemically inactive to actinic radiation. This composition has an improved photo-sensitivity or radiation sensitivity and can give highly heat-resistant relief patterns with a good edge sharpness and good mechanical and chemical properties as well as good insulating properties. Heat-resistant relief patterns obtained from this composition are especially useful as insulating, passivating or protective coatings in semiconductor devices.
摘要翻译：描述了一种辐射敏感组合物，其包含（1）含有下式重复单元的聚合物：其中R 1是具有6至30个碳原子的三价或四价芳族或杂芳族残基，R 2是二价芳族或具有6至30个碳原子的杂芳族残基，R 3是氢或铵离子，n是1或2，COOR 3相对于酰胺键位于邻位或邻位置，（2）具有辐射的有机化合物可聚合或可辐射聚合的烯属双键和氨基或季铵盐，和（3）对光化辐射化学惰性的芳族仲胺或叔胺化合物。该组合物具有改进的光敏性或辐射敏感性，并且可以产生具有良好边缘清晰度和良好机械和化学性质以及良好绝缘性能的高耐热浮雕图案。由该组合物获得的耐热浮雕图案特别可用作半导体器件中的绝缘，钝化或保护涂层。

2. 发明授权

US4783391A Radiation-sensitive polyamide polymer composition with anthraquinone monoazide 失效
标题翻译：辐射敏感聚酰胺聚合物组合物与蒽醌单偶氮
公开(公告)号：US4783391A
公开(公告)日：1988-11-08
申请号：US934653
申请日：1986-11-25
申请人： Gentaro Ohbayashi , Susumu Umemoto , Hiroo Hiramoto
发明人： Gentaro Ohbayashi , Susumu Umemoto , Hiroo Hiramoto
IPC分类号： C08F2/00 , C08F2/48 , C08G73/00 , C08G73/10 , C08K5/28 , C08L79/08 , G03F7/012 , G03F7/037 , G03C1/71 , G03C1/52 , G03C1/70 , G03C1/72
CPC分类号： G03F7/0125 , G03F7/037
摘要： A radiation-sensitive composition is described, which is comprised of (1) a polymer containing repeating units of the formula: ##STR1## wherein R.sup.1 is a trivalent or tetravalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R.sup.2 is a divalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R.sup.3 is hydrogen or an ammonium ion, n is 1 or 2, and COOR.sup.3 is located in an ortho or peri position with respect to the amide linkage, (2) an organic compound having a radiation-dimerizable or radiation-polymerizable olefinic double bond and an amino radical or a quaternary ammonium salt, and (3) an aromatic monoazide compound [III] having no substituent or having a neutral or acidic substituent. This composition has a highly improved radiation sensitivity and the sensitive wavelength region of this composition is very broad. This composition can give a highly heat-resistant relief pattern with a good edge sharpness. Heat-resistant relief patterns obtained from this composition are especially useful as insulating passivation or protective coatings in semiconductor devices.
摘要翻译：描述了一种辐射敏感组合物，其包含（1）含有下式重复单元的聚合物：其中R 1是具有6至30个碳原子的三价或四价芳族或杂芳族残基，R 2是二价芳族或具有6至30个碳原子的杂芳族残基，R 3是氢或铵离子，n是1或2，COOR 3相对于酰胺键位于邻位或邻位置，（2）具有辐射的有机化合物可聚合或辐射聚合的烯属双键和氨基或季铵盐，和（3）不具有取代基或具有中性或酸性取代基的芳族单偶氮化合物[III]。该组合物具有高度改善的辐射敏感性，并且该组合物的敏感波长区域非常宽。该组合物可以赋予具有良好边缘清晰度的高耐热浮雕图案。由该组合物获得的耐热浮雕图案特别可用作半导体器件中的绝缘钝化或保护涂层。

3. 发明授权

US4547455A Process of forming polyimide pattern and developer therefor 失效
标题翻译：形成聚酰亚胺图案和显影剂的方法
公开(公告)号：US4547455A
公开(公告)日：1985-10-15
申请号：US505206
申请日：1983-06-17
申请人： Hiroo Hiramoto , Masuichi Eguchi
发明人： Hiroo Hiramoto , Masuichi Eguchi
IPC分类号： H01L21/30 , G03F7/32 , H01L21/027 , G03C5/16 , G03C1/70
CPC分类号： G03F7/325
摘要： A process of forming a polyimide pattern on a base plate, which comprises exposing imagewise a layer of photosensitive polyimide precursor on the base plate, removing unexposed areas by developing and curing the resultant pattern of the polyimide precursor, characterized by employing a developer containing (A) at least one solvent selected from the group consisting of N,N-dimethylacetamide, N-methyl-2-pyrrolidone, N,N-dimethylformamide, dimethylsulfoxide and .gamma.-butyrolactone, (B) methanol and (C) at least one solvent represented by the formula;R.sup.1 OCH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 OR.sup.2wherein R.sup.1 is a hydrogen atom or R.sup.2 and R.sup.2 is an alkyl group having 1 to 4 carbon atoms.
摘要翻译：在基板上形成聚酰亚胺图案的方法，其包括在基板上成像曝光感光聚酰亚胺前体层，通过显影和固化聚酰亚胺前体的所得图案来去除未曝光区域，其特征在于使用含有（A ）至少一种选自N，N-二甲基乙酰胺，N-甲基-2-吡咯烷酮，N，N-二甲基甲酰胺，二甲基亚砜和γ-丁内酯的溶剂，（B）甲醇和（C）至少一种溶剂，按公式 R1OCH2CH2OCH2CH2OR2其中R1是氢原子或R2和R2是具有1-4个碳原子的烷基。

4. 发明授权

US4243743A Photosensitive compositions 失效
标题翻译：感光组合物
公开(公告)号：US4243743A
公开(公告)日：1981-01-06
申请号：US29154
申请日：1979-04-11
申请人： Hiroo Hiramoto , Masuichi Eguchi
发明人： Hiroo Hiramoto , Masuichi Eguchi
IPC分类号： G03C7/10 , C08F2/00 , C08F2/48 , C08G69/28 , C08G73/00 , C08G73/10 , C08G73/14 , C08G73/16 , G03F7/037 , G03F7/038 , H01L21/027 , H05K3/28 , G03C1/68
CPC分类号： C08G73/1003 , C08G69/28 , C08G73/1025 , C08G73/14 , G03F7/037 , Y10S430/107
摘要： This invention relates to a photosensitive composition comprising a precursor of a heat resistant polymer having carboxylic groups and a compound having a photosensitive olefinic double bond and an amino or quaternary ammonium salt. The photosensitive composition can give highly heat resistant relief patterns with good edge sharpness, good mechanical and chemical properties as well as good insulating properties. The heat resistant relief patterns obtained from the composition of this invention are especially useful as insulating, passivation or protective coatings in semiconductor devices.
摘要翻译：本发明涉及包含具有羧基的耐热性聚合物的前体和具有感光性烯属双键的化合物和氨基或季铵盐的感光性组合物。感光性组合物可以赋予高耐热的浮雕图案，具有良好的边缘清晰度，良好的机械和化学性能以及良好的绝缘性能。由本发明组合物获得的耐热浮雕图案特别适用于半导体器件中的绝缘，钝化或保护涂层。

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