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    • 1. 发明专利
    • Scaffolding board connector
    • SCAFFINGING BOARD连接器
    • JP2005068749A
    • 2005-03-17
    • JP2003298173
    • 2003-08-22
    • Nobuyuki NakazawaHironori Ota信行 中沢博則 太田
    • NAKAZAWA NOBUYUKIOTA HIRONORI
    • E04G5/08
    • PROBLEM TO BE SOLVED: To provide a scaffolding board connector easy in the insertion of a scaffolding board, safe in carrying in an installing state to the scaffolding board, reduced in a step of a connecting part of the scaffolding board, and adaptable to the scaffolding boards provided in various widths, when using the scaffolding boards by connecting them in the longitudinal direction.
      SOLUTION: This scaffolding board connector has a structure for connecting right and left frame materials by a pipe nut extended to a position sandwiched by the scaffolding board and a bolt fitted to the pipe nut, by fitting the frame materials molded in U shapes each having a reinforcing doubling plate, to right and left both sides of a connecting part of the scaffolding board. The scaffolding board connector has a thickness adjusting plate for restraining the looseness of the scaffolding board, and an oblique cutout for facilitating the insertion of the scaffolding board on each of the longitudinal directional both ends of the frame materials, and can be adaptable to the scaffolding boards having various widths by changing the pipe nut to the one having a length adjusted to the width of the scaffolding board.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了在脚手架板的插入中容易地插入脚手架板连接器,安全地将脚手架板安装在安装状态,减少了脚手架板的连接部分的步骤,并且具有适应性 通过在纵向方向上连接脚手架板而将其设置在各种宽度的脚手板上。 解决方案:该脚手架连接器具有用于通过管状螺母连接右框架材料和左框架结构的结构,该管状螺母延伸到由脚手架板夹持的位置,以及通过将模制成U形的框架材料 每个具有加强加倍板,到脚手架板的连接部分的左右两侧。 脚手架板连接器具有用于抑制脚手架板松动的厚度调节板,以及用于便于将脚手架插入框架材料的纵向方向两端的倾斜切口,并且可以适用于脚手架 通过将管螺母改变为具有调整到脚手架板的宽度的长度的板,具有各种宽度的板。 版权所有(C)2005,JPO&NCIPI
    • 2. 发明申请
    • Optical recording medium
    • 光记录介质
    • US20070261068A1
    • 2007-11-08
    • US11236840
    • 2005-09-28
    • Masafumi YoshihiroOsamu IshizakiToshinori SugiyamaYoshiyuki NagatakiHironori Ota
    • Masafumi YoshihiroOsamu IshizakiToshinori SugiyamaYoshiyuki NagatakiHironori Ota
    • G11B7/24
    • G11B7/24038G11B7/00454G11B7/00455G11B7/00736G11B7/1267
    • An optical recording medium having two information sections (L0 and L1 layers) is provided by holding relationships: R1≧R3+r R2≦R4−r wherein R1, R2, R3, and R4 represent distances from the center of the medium at radial positions: R of an innermost circumferential track of a test area disposed on an inner circumferential side of the L1 layer; R of an outermost circumferential track of a test area disposed on an outer circumferential side of the L1 layer; R of an innermost circumferential guide groove of an information-recording area of the L0 layer; and R of an outermost circumferential guide groove of the information-recording area of the L0 layer respectively, and r represents a radius of a light beam on the L0 layer when the light beam is collected on the L1 layer.
    • 通过保持关系提供具有两个信息部分(L0和L1层)的光学记录介质:<?in-line-formula description =“In-line formula”end =“lead”?> R1> = R3 + r < in-line-formula description =“In-line Formulas”end =“tail”?> <?in-line-formula description =“In-line Formulas”end =“lead”?> R2 <= R4-r < in-line-formula description =“In-line Formulas”end =“tail”?>其中R 1,R 2,R 3和R 4表示在径向位置处介质中心的距离:R 设置在L1层的内周侧的测试区域的轨迹; R设置在L1层的外周侧的测试区域的最外圆周轨迹; R为L0层的信息记录区域的最内圆周引导槽; 和R是L0层的信息记录区域的最外周向引导槽的R,r表示在L1层上收集光束时的L0层上的光束的半径。
    • 4. 发明申请
    • PROCESS FOR PRODUCING COMPOSITE MATERIAL COMPRISING RESIN MOLDED PRODUCT
    • 用于生产包含树脂模制产品的复合材料的方法
    • US20110020550A1
    • 2011-01-27
    • US12921912
    • 2009-03-12
    • Hironori OtaAtsushi YusaSatoshi Yamamoto
    • Hironori OtaAtsushi YusaSatoshi Yamamoto
    • C23C18/28C23C18/54C23C18/31
    • C23C18/30C08J7/06C23C18/1651C23C18/1653C23C18/1682C23C18/1685C23C18/2073C23C18/31
    • The present invention provides a method for allowing a metal complex to stably penetrate into a polymer and immobilizing the metal complex in the polymer by a low temperature treatment, in a batch processing for a plating pre-treatment wherein the metal complex is allowed to penetrate into the polymer with the use of high-pressure carbon dioxide. In particular, the present invention provides a method for producing a composite material containing a resin molded product, characterized in that a reducing agent is brought into contact with the resin molded product so as to allow the reducing agent to penetrate into the resin molded product, and in that high-pressure carbon dioxide having an organic metal complex dissolved therein is brought into contact with the resin molded product into which said reducing agent has penetrated, so as to immobilize the organic metal complex in the resin molded product by the reducing agent.
    • 本发明提供一种允许金属络合物稳定地渗透到聚合物中并通过低温处理将金属络合物固定在聚合物中的方法,其中允许金属络合物渗入的电镀预处理的间歇式处理 该聚合物使用高压二氧化碳。 特别地,本发明提供一种含有树脂成型体的复合材料的制造方法,其特征在于,与所述树脂成形体接触还原剂,使所述还原剂渗透到所述树脂成形体中, 并且将其中溶解有有机金属配合物的高压二氧化碳与所述还原剂渗入的树脂成型体接触,从而通过还原剂将有机金属配合物固定在树脂成型体中。
    • 6. 发明申请
    • SEMICONDUCTOR CHIP HOUSING TRAY
    • 半导体芯片住宅托盘
    • US20090050519A1
    • 2009-02-26
    • US12171945
    • 2008-07-11
    • Ryohei TAMURATomoyuki SHINDOHironori OTAKazuo YAZAWA
    • Ryohei TAMURATomoyuki SHINDOHironori OTAKazuo YAZAWA
    • B65D85/00
    • H01L21/67333
    • A semiconductor chip housing tray that is used in a state of being stacked in a plurality of stages and houses a plurality of semiconductor chips, includes: a base plate; a plurality of upper surface protruding parts provided to an upper surface of the base plate and dividing the upper surface of the base plate into a plurality of first semiconductor chip housing areas; and a plurality of under surface protruding parts provided to an under surface of the base plate and dividing the under surface of the base plate into a plurality of second semiconductor chip housing areas. In the semiconductor chip housing tray, a margin width of the first semiconductor chip housing areas with respect to the semiconductor chips is smaller than a margin width of the second semiconductor chip housing areas with respect to the semiconductor chips.
    • 一种半导体芯片外壳托盘,其以多个层叠的状态使用并容纳多个半导体芯片,包括:基板; 多个上表面突出部,设置在所述基板的上表面,并将所述基板的上表面分割成多个第一半导体芯片容纳区域; 以及设置在所述基板的下表面的多个下表面突出部,并且将所述基板的下表面分割成多个第二半导体芯片容纳区域。 在半导体芯片外壳托盘中,相对于半导体芯片的第一半导体芯片容纳区域的边缘宽度小于第二半导体芯片容纳区域相对于半导体芯片的边缘宽度。
    • 8. 发明申请
    • METHOD FOR PRODUCING POLYMER MEMBER HAVING PLATED FILM
    • 用于生产具有镀膜的聚合物成员的方法
    • US20100320635A1
    • 2010-12-23
    • US12816958
    • 2010-06-16
    • Hironori OTAAtsushi YusaTetsuya Ano
    • Hironori OTAAtsushi YusaTetsuya Ano
    • B29C45/16B05D3/10
    • C23C18/208C23C18/1682C23C18/30C23C18/32
    • To provide a method for producing a polymer member having a plated film with excellent adhesion by subjecting a polymer member in which a catalyst component is dispersed by using pressurized carbon dioxide to electroless plating under ordinary pressure. A polymer member in which a catalyst component is dispersed is formed by using a pressurized fluid in which a catalyst component containing a metal which serves as a plating catalyst is dissolved in pressurized carbon dioxide; the polymer member in which the catalyst component is dispersed is immersed in an alcohol treatment liquid under ordinary pressure; and the polymer member, which has been subjected to the pretreatment with the alcohol treatment liquid, is immersed in an electroless plating solution containing an alcohol under ordinary pressure to form a plated film.
    • 提供一种通过使用加压二氧化碳在常压下对其中分散有催化剂组分的聚合物构件进行化学镀以提供具有优异粘附性的聚合物构件的方法。 通过使用其中含有作为电镀催化剂的金属的催化剂组分溶解在加压二氧化碳中的加压流体形成其中分散有催化剂组分的聚合物构件; 将其中分散有催化剂组分的聚合物构件在常压下浸入醇处理液中; 将用醇处理液进行预处理的聚合物部件浸渍在含有醇的无电镀液中,形成镀膜。
    • 9. 发明申请
    • Optical information-recording medium
    • 光信息记录介质
    • US20060104194A1
    • 2006-05-18
    • US11272976
    • 2005-11-15
    • Hironori OtaYoshiyuki NagatakiToshinori Sugiyama
    • Hironori OtaYoshiyuki NagatakiToshinori Sugiyama
    • G11B7/24
    • G11B7/24079G11B7/0053G11B7/00736
    • An optical information-recording medium, which is provided with a substrate and a light-absorbing layer formed of a dye material on the substrate, includes a user information area in which a concave/convex pattern including spiral-shaped or concentric grooves are formed, and BCA which is provided on an inner circumferential side of the user information area and in which information is recorded with a bar code, wherein a concave/convex pattern, which is different from the concave/convex pattern in the user information area, is formed in BCA. With this construction, an optical information-recording medium, on which BCA information is reproduced without performing any tracking, is provided, wherein a BCA reproduced signal having a satisfactory signal quality is obtained from BCA.
    • 在基板上设置有基板和由染料构成的光吸收层的光信息记录介质包括用户信息区,其中形成包括螺旋形或同心凹槽的凹凸图案, 和BCA,其设置在用户信息区域的内周侧,并且其中信息被记录有条形码,其中形成与用户信息区域中的凹凸图案不同的凹凸图案 在BCA。 利用这种结构,提供一种在不进行任何跟踪的情况下再现BCA信息的光学信息记录介质,其中从BCA获得具有令人满意的信号质量的BCA再现信号。
    • 10. 发明授权
    • Semiconductor chip housing tray
    • 半导体芯片外壳托盘
    • US07757862B2
    • 2010-07-20
    • US12171945
    • 2008-07-11
    • Ryohei TamuraTomoyuki ShindoHironori OtaKazuo Yazawa
    • Ryohei TamuraTomoyuki ShindoHironori OtaKazuo Yazawa
    • B65D85/00
    • H01L21/67333
    • A semiconductor chip housing tray that is used in a state of being stacked in a plurality of stages and houses a plurality of semiconductor chips, includes: a base plate; a plurality of upper surface protruding parts provided to an upper surface of the base plate and dividing the upper surface of the base plate into a plurality of first semiconductor chip housing areas; and a plurality of under surface protruding parts provided to an under surface of the base plate and dividing the under surface of the base plate into a plurality of second semiconductor chip housing areas. In the semiconductor chip housing tray, a margin width of the first semiconductor chip housing areas with respect to the semiconductor chips is smaller than a margin width of the second semiconductor chip housing areas with respect to the semiconductor chips.
    • 一种半导体芯片外壳托盘,其以多个层叠的状态使用并容纳多个半导体芯片,包括:基板; 多个上表面突出部,设置在所述基板的上表面,并将所述基板的上表面分割成多个第一半导体芯片容纳区域; 以及设置在所述基板的下表面的多个下表面突出部,并且将所述基板的下表面分割成多个第二半导体芯片容纳区域。 在半导体芯片外壳托盘中,相对于半导体芯片的第一半导体芯片容纳区域的边缘宽度小于第二半导体芯片容纳区域相对于半导体芯片的边缘宽度。