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1. 发明授权

US08810016B2 Semiconductor device, substrate and semiconductor device manufacturing method 有权
标题翻译：半导体器件，衬底和半导体器件的制造方法
公开(公告)号：US08810016B2
公开(公告)日：2014-08-19
申请号：US13036869
申请日：2011-02-28
申请人： Yasumasa Kasuya , Motoharu Haga , Hiroaki Matsubara
发明人： Yasumasa Kasuya , Motoharu Haga , Hiroaki Matsubara
IPC分类号： H01L23/495
CPC分类号： H01L24/09 , H01L23/49503 , H01L23/49513 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/0913 , H01L2224/27013 , H01L2224/291 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83194 , H01L2224/83385 , H01L2224/83439 , H01L2224/83444 , H01L2224/83464 , H01L2224/83801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor chip to the junction plane of a chip junction portion such as an island or a die pad. This semiconductor device includes a semiconductor chip and a chip junction portion having a junction plane that is bonded to the back surface of the semiconductor chip with a soldering material. The junction plane is smaller in size than the back surface of the semiconductor chip. This semiconductor device may further include a plurality of extending portions which extend respectively from the periphery of the junction plane to directions parallel with the junction plane.
摘要翻译：即使使用焊接材料将半导体芯片的背面接合到诸如岛或芯片焊盘的芯片接合部的接合面，半导体器件也可以防止半导体芯片的损坏。该半导体器件包括半导体芯片和芯片接合部分，其具有用焊接材料结合到半导体芯片的背面的结面。接合面的尺寸小于半导体芯片的背面。该半导体器件还可以包括多个延伸部分，这些延伸部分分别从接合面的周边延伸到与接合平面平行的方向。

2. 发明申请

US20140106140A1 INKJET RECORDING MEDIUM, PRINTED MATERIAL, METHOD FOR PRODUCING SAME, AND PACKAGE 有权
标题翻译：喷墨记录介质，印刷材料，生产方法和包装
公开(公告)号：US20140106140A1
公开(公告)日：2014-04-17
申请号：US14004731
申请日：2012-03-26
申请人： Takeo Ikeda , Hiroaki Matsubara , Mitsuru Kitada , Yoshitaka Satoh , Kiyomi Nagano
发明人： Takeo Ikeda , Hiroaki Matsubara , Mitsuru Kitada , Yoshitaka Satoh , Kiyomi Nagano
IPC分类号： B41M5/52 , B41M7/00
CPC分类号： B41M5/5254 , B32B7/12 , B32B17/10 , B32B27/08 , B32B27/308 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/40 , B32B2250/24 , B32B2255/10 , B32B2255/26 , B32B2307/4026 , B32B2307/412 , B32B2307/75 , B32B2553/00 , B41M5/506 , B41M5/508 , B41M5/5263 , B41M5/5281 , B41M7/0027 , B41M2205/38 , Y10T428/24802 , Y10T428/24851 , Y10T428/24868 , Y10T428/31855 , Y10T428/31909
摘要： The present invention provides an ink jet recording medium which is capable of uniform coating with an ink-receiving agent without a surface treatment step for a usual plastic film used as a base material, and which, due to excellent adhesion , does not cause the problem of peeling after ink jet printing, and does not cause the problem of ink binning, fading, dropout, or peeling or peeling of an ink-receiving layer and an over-coating layer, and also provides a printed material formed by ink jet printing on the ink jet recording medium. The ink jet recording medium including a first layer containing a polyolefin resin as a main component, a second layer containing an acid-modified olefin resin, and an ink-receiving layer is used, the ink-receiving layer being formed by applying an ink-receiving agent on the second layer after the first and second layers are laminated by a coextrusion laminating method.
摘要翻译：本发明提供了一种喷墨记录介质，其能够在没有用于作为基材的通常的塑料膜的表面处理步骤的情况下用油墨接收剂均匀地涂布，并且由于优异的粘附性，不会引起问题在喷墨打印之后剥离，并且不会引起油墨接收层和涂覆层的墨水收集，褪色，脱落或剥离或剥离的问题，并且还提供通过喷墨印刷形成的印刷材料喷墨记录介质。使用包括含有聚烯烃树脂作为主要成分的第一层，含有酸改性烯烃树脂的第二层和油墨接收层的喷墨记录介质，油墨接收层通过涂布油墨 - 在第一层和第二层之间通过共挤出层压方法层压第二层上的接收剂。

3. 发明申请

US20130225492A1 Sustained-Release Pharmaceutical Composition 有权
标题翻译：持续释放药物成分
公开(公告)号：US20130225492A1
公开(公告)日：2013-08-29
申请号：US13824598
申请日：2011-10-14
申请人： Masanori Fukushima , Hiroaki Matsubara , Satoaki Matoba , Shigeki Hijikata , Yu Aso , Tsutomu Sato
发明人： Masanori Fukushima , Hiroaki Matsubara , Satoaki Matoba , Shigeki Hijikata , Yu Aso , Tsutomu Sato
IPC分类号： A61K9/00 , A61K38/18
CPC分类号： A61K9/0002 , A61K9/0024 , A61K9/5123 , A61K31/7004 , A61K31/7008 , A61K38/1808 , A61K38/1816 , A61K38/1825 , A61K38/1858 , A61K38/27 , A61K38/39 , A61K45/06 , A61K47/26 , A61K47/42 , A61K2300/00
摘要： Provided is a pharmaceutical composition, including a drug and a collagen, in which the composition is satisfactory in handleability and has sustained-release property. The sustained-release pharmaceutical composition includes: a drug; a collagen; and at least one kind of sugar selected from monosaccharides, disaccharides, trisaccharides, and tetrasaccharides. The inventors of the present invention have found that the in vivo administration of a collagen solution containing a sugar results in the gelation of a collagen. Based on this finding, the inventors have found that a composition containing a drug, a collagen, and a sugar can control the release rate of the drug, and such composition can be used as a sustained-release pharmaceutical composition.
摘要翻译：本发明提供包含药物和胶原的药物组合物，其组合物的操作性良好且具有缓释性。缓释药物组合物包括：药物; 胶原蛋白和选自单糖，二糖，三糖和四糖中的至少一种糖。本发明的发明人已经发现，含有糖的胶原溶液的体内施用导致胶原蛋白的凝胶化。基于该发现，本发明人发现含有药物，胶原和糖的组合物可以控制药物的释放速度，并且这种组合物可以用作缓释药物组合物。

4. 发明授权

US06801894B2 Speech synthesizer that interrupts audio output to provide pause/silence between words 有权
标题翻译：语音合成器，用于中断音频输出以在字之间提供暂停/静音
公开(公告)号：US06801894B2
公开(公告)日：2004-10-05
申请号：US09814065
申请日：2001-03-22
申请人： Yoshihisa Nakamura , Hiroaki Matsubara
发明人： Yoshihisa Nakamura , Hiroaki Matsubara
IPC分类号： G10L1304
CPC分类号： G10L13/047
摘要： A speech synthesizer includes a data memory having a plurality of address areas, which stores a plurality of phases in the address areas and an address designating circuit designating one of the address areas based on the phase signal. Further, a speech synthesizer includes a speech synthesizing circuit generating a speech synthesizing signal corresponding to the phase, which is stored in the designated area, a digital/analog converter transforming the speech synthesizing signal to an analog signal having amplitude, and a counter setting a period of silence. Furthermore, a speech synthesizer includes a silence-input circuit being connected between the speech synthesizing circuit and the digital/analog converter, which supplies a predetermined voltage to the digital/analog converter for the period that is set by the counter.
摘要翻译：语音合成器包括具有多个地址区域的数据存储器，其存储地址区域中的多个相位，以及地址指定电路，基于该相位信号指定一个地址区域。此外，语音合成器包括语音合成电路，其生成对应于存储在指定区域中的相位的语音合成信号，将该语音合成信号变换成具有幅度的模拟信号的数/模转换器，沉默期此外，语音合成器包括连接在语音合成电路和数字/模拟转换器之间的静音输入电路，其在由计数器设置的时段内向数/模转换器提供预定电压。

5. 发明授权

US09017779B2 Inkjet recording medium, printed material, method for producing same, and package 有权
标题翻译：喷墨记录介质，印刷材料，其制造方法和包装
公开(公告)号：US09017779B2
公开(公告)日：2015-04-28
申请号：US14004731
申请日：2012-03-26
申请人： Takeo Ikeda , Hiroaki Matsubara , Mitsuru Kitada , Yoshitaka Satoh , Kiyomi Nagano
发明人： Takeo Ikeda , Hiroaki Matsubara , Mitsuru Kitada , Yoshitaka Satoh , Kiyomi Nagano
IPC分类号： B41M5/00 , B41M5/52 , B32B27/08 , B32B27/32 , B32B17/10 , B41M5/50 , B41M7/00
CPC分类号： B41M5/5254 , B32B7/12 , B32B17/10 , B32B27/08 , B32B27/308 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/40 , B32B2250/24 , B32B2255/10 , B32B2255/26 , B32B2307/4026 , B32B2307/412 , B32B2307/75 , B32B2553/00 , B41M5/506 , B41M5/508 , B41M5/5263 , B41M5/5281 , B41M7/0027 , B41M2205/38 , Y10T428/24802 , Y10T428/24851 , Y10T428/24868 , Y10T428/31855 , Y10T428/31909
摘要： The present invention provides an ink jet recording medium which is capable of uniform coating with an ink-receiving agent without a surface treatment step for a usual plastic film used as a base material, and which, due to excellent adhesion , does not cause the problem of peeling after ink jet printing, and does not cause the problem of ink binning, fading, dropout, or peeling or peeling of an ink-receiving layer and an over-coating layer, and also provides a printed material formed by ink jet printing on the ink jet recording medium. The ink jet recording medium including a first layer containing a polyolefin resin as a main component, a second layer containing an acid-modified olefin resin, and an ink-receiving layer is used, the ink-receiving layer being formed by applying an ink-receiving agent on the second layer after the first and second layers are laminated by a coextrusion laminating method.
摘要翻译：本发明提供了一种喷墨记录介质，其能够在没有用于作为基材的通常的塑料膜的表面处理步骤的情况下用油墨接收剂均匀地涂布，并且由于优异的粘附性，不会引起问题在喷墨打印之后剥离，并且不会引起油墨接收层和涂覆层的墨水收集，褪色，脱落或剥离或剥离的问题，并且还提供通过喷墨印刷形成的印刷材料喷墨记录介质。使用包括含有聚烯烃树脂作为主要成分的第一层，含有酸改性烯烃树脂的第二层和油墨接收层的喷墨记录介质，油墨接收层通过涂布油墨 - 在第一层和第二层之间通过共挤出层压方法层压第二层上的接收剂。

6. 发明授权

US08177668B2 Dart 有权
标题翻译：镖
公开(公告)号：US08177668B2
公开(公告)日：2012-05-15
申请号：US12553148
申请日：2009-09-03
申请人： Hiroaki Matsubara
发明人： Hiroaki Matsubara
IPC分类号： A63B65/02
CPC分类号： F42B6/003
摘要： The present invention provides a dart having a durable and break-resistant structure. A dart in accordance with an embodiment of the present invention has, in order from the front thereof, a tip, a barrel, a shaft, and a flight. At the rear of the shaft, a cap-receiving portion having a diameter smaller than that existing elsewhere is formed, this cap-receiving portion being capable of receiving a cap-like portion of the flight. At the front end of the flight, a hollow cylindrical cap-like portion containing a hole for attachment to the cap-receiving portion of the shaft is formed. The shaft and the flight are connected to each other by a sliding engagement method.
摘要翻译：本发明提供一种具有耐久和抗断裂结构的飞镖。根据本发明的实施例的飞镖从前面依次具有尖端，筒体，轴和飞行。在轴的后部，形成直径小于其他位置的直径的盖接收部，该盖接收部能够接收飞行的帽状部分。在飞行器的前端形成有一个中空的圆柱形盖状部分，其中包含一个孔，用于连接到轴的盖接收部分。轴和飞行通过滑动接合方式彼此连接。

7. 发明授权

US07902681B2 Semiconductor device, production method for the same, and substrate 有权
标题翻译：半导体装置及其制造方法以及基板
公开(公告)号：US07902681B2
公开(公告)日：2011-03-08
申请号：US12064434
申请日：2006-08-18
申请人： Motoharu Haga , Yasumasa Kasuya , Hiroaki Matsubara
发明人： Motoharu Haga , Yasumasa Kasuya , Hiroaki Matsubara
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L24/29 , H01L23/49811 , H01L23/49866 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/04026 , H01L2224/29 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/29298 , H01L2224/32225 , H01L2224/32507 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83444 , H01L2224/83801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/01028 , H01L2924/00012 , H01L2924/01049 , H01L2924/01083 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device is provided in which a semiconductor chip is bonded to a substrate with a sufficiently increased bonding strength and cracking is assuredly prevented which may otherwise occur due to heat shock, heat cycle and the like. The semiconductor device includes a semiconductor chip and a substrate having a bonding area to which the semiconductor chip is bonded via a metal layer. The metal layer includes an Au—Sn—Ni alloy layer and a solder layer provided on the Au—Sn—Ni alloy layer. Undulations are formed in an interface between the Au—Sn—Ni alloy layer and the solder layer.
摘要翻译：提供一种半导体器件，其中半导体芯片以足够高的接合强度结合到基板上，可靠地防止由于热冲击，热循环等而发生的开裂。半导体器件包括半导体芯片和具有通过金属层与半导体芯片接合的接合区域的基板。金属层包括Au-Sn-Ni合金层和设置在Au-Sn-Ni合金层上的焊料层。在Au-Sn-Ni合金层和焊料层之间的界面中形成凹凸。

8. 发明授权

US5579502A Memory card apparatus using EEPROMS for storing data and an interface buffer for buffering data transfer between the EEPROMS and an external device 失效
标题翻译：使用EEPROMS存储数据的存储卡装置和用于缓冲EEPROMS和外部设备之间的数据传输的接口缓冲器
公开(公告)号：US5579502A
公开(公告)日：1996-11-26
申请号：US505369
申请日：1995-07-21
申请人： Kazuo Konishi , Shimpei Yoshioka , Setsuo Terasaki , Hiroaki Matsubara , Koji Maruyama , Toshiaki Sato , Takaaki Suyama
发明人： Kazuo Konishi , Shimpei Yoshioka , Setsuo Terasaki , Hiroaki Matsubara , Koji Maruyama , Toshiaki Sato , Takaaki Suyama
IPC分类号： G06F11/16 , G11C16/10 , G11C29/00 , H04N5/907 , G06F12/04
CPC分类号： G11C29/765 , G06F11/141 , G11C16/102 , H04N5/907 , G06F2212/2022 , G11C29/76
摘要： A memory card apparatus using EEPROMs as semiconductor memories. Externally input data are temporarily recorded in a buffer memory and are subsequently written in the EEPROMs. Verify processing is automatically performed between the buffer memory and the EEPROMs. Similarly, data read out from the EEPROMs are temporarily recorded in the buffer memory and are subsequently output to an external unit. Even with the EEPROMs, it seems that this memory card can be used in the same manner as a memory card using an SRAM, when viewed from the outside of the card.
摘要翻译：使用EEPROM作为半导体存储器的存储卡装置。外部输入数据临时记录在缓冲存储器中，随后写入EEPROM。在缓冲存储器和EEPROM之间自动执行验证处理。类似地，从EEPROM读出的数据被临时记录在缓冲存储器中，随后被输出到外部单元。即使使用EEPROM，当从卡的外部观察时，似乎该存储卡可以以与使用SRAM的存储卡相同的方式使用。

9. 发明授权

US08414924B2 Preparation for treating heart disease used in cell therapy 有权
标题翻译：用于治疗细胞治疗中使用的心脏病的制剂
公开(公告)号：US08414924B2
公开(公告)日：2013-04-09
申请号：US12681940
申请日：2008-10-09
申请人： Hidemasa Oh , Naofumi Takehara , Hiroaki Matsubara , Yasuhiko Tabata
发明人： Hidemasa Oh , Naofumi Takehara , Hiroaki Matsubara , Yasuhiko Tabata
IPC分类号： A61K35/34 , A61K9/00 , A61P9/00
CPC分类号： A61L27/24 , A61L27/222 , A61L27/3834 , A61L27/3839 , A61L27/52 , A61L27/54 , A61L2300/414 , C12N5/0657 , C12N2501/115 , C12N2533/54
摘要： An object of the present invention is to establish a cell transplantation method which can markedly improve the survival of grafted pluripotent stem cells and the efficiency of cardiomyocyte regeneration in cell therapy using pluripotent stem cells derived from heart tissue and can treat heart disease further effectively. Specifically, according to the present invention, enhancement in the survival of grafted pluripotent stem cells and significant improvement in the efficiency of cardiomyocyte regeneration are achieved by using, in combination, pluripotent stem cells derived from heart tissue and a hydrogel containing a basic fibroblast growth factor (bFGF) in cell therapy for heart disease.
摘要翻译：本发明的目的是建立一种可以显着提高移植多能干细胞的存活率和使用源自心脏组织的多能干细胞进行细胞治疗的心肌细胞再生的效率的细胞移植方法，并可进一步有效治疗心脏病。具体地，根据本发明，通过组合使用衍生自心脏组织的多能干细胞和含有碱性成纤维细胞生长因子的水凝胶来实现移植多能干细胞的存活的增强和心肌细胞再生效率的显着改善（bFGF）在心脏病的细胞治疗中。

10. 发明申请

US20110140256A1 SEMICONDUCTOR DEVICE, SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 有权
标题翻译：半导体器件，衬底和半导体器件制造方法
公开(公告)号：US20110140256A1
公开(公告)日：2011-06-16
申请号：US13036869
申请日：2011-02-28
申请人： Yasumasa KASUYA , Motoharu HAGA , Hiroaki MATSUBARA
发明人： Yasumasa KASUYA , Motoharu HAGA , Hiroaki MATSUBARA
IPC分类号： H01L23/495
CPC分类号： H01L24/09 , H01L23/49503 , H01L23/49513 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/0913 , H01L2224/27013 , H01L2224/291 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83194 , H01L2224/83385 , H01L2224/83439 , H01L2224/83444 , H01L2224/83464 , H01L2224/83801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor chip to the junction plane of a chip junction portion such as an island or a die pad. This semiconductor device includes a semiconductor chip and a chip junction portion having a junction plane that is bonded to the back surface of the semiconductor chip with a soldering material. The junction plane is smaller in size than the back surface of the semiconductor chip. This semiconductor device may further include a plurality of extending portions which extend respectively from the periphery of the junction plane to directions parallel with the junction plane.
摘要翻译：即使使用焊接材料将半导体芯片的背面接合到诸如岛或芯片焊盘的芯片接合部的接合面，半导体器件也可以防止半导体芯片的损坏。该半导体器件包括半导体芯片和芯片接合部分，其具有用焊接材料结合到半导体芯片的背面的结面。接合面的尺寸小于半导体芯片的背面。该半导体器件还可以包括多个延伸部分，这些延伸部分分别从接合面的周边延伸到与接合平面平行的方向。

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