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1. 发明授权

US5157478A Tape automated bonding packaged semiconductor device incorporating a heat sink 失效
标题翻译：带有自动键合封装的半导体器件，包含散热片
公开(公告)号：US5157478A
公开(公告)日：1992-10-20
申请号：US810354
申请日：1991-12-18
申请人： Tetsuya Ueda , Haruo Shimamoto , Yasuhiro Teraoka , Hideya Yagoura , Hiroshi Seki
发明人： Tetsuya Ueda , Haruo Shimamoto , Yasuhiro Teraoka , Hideya Yagoura , Hiroshi Seki
IPC分类号： H01L21/56 , H01L23/16 , H01L23/433 , H01L23/495
CPC分类号： H01L24/50 , H01L21/565 , H01L23/16 , H01L23/4334 , H01L23/49572 , H01L2224/50 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/07802 , H01L2924/16152 , H01L2924/3511
摘要： A packaged semiconductor device includes an insulating film having an opening, a semiconductor chip disposed in the opening of the insulating film and having a plurality of electrodes, a plurality of leads, each having one end connected to a corresponding electrode, the plurality of leads being supported on the insulating film, a heat radiator disposed opposite and spaced from the semiconductor chip, and a resin package body encapsulating the semiconductor chip and part of the heat radiator, leaving a surface of the heat radiator externally exposed and the second ends of the plurality of leads extending outwardly from the package.
摘要翻译：封装半导体器件包括具有开口的绝缘膜，设置在绝缘膜的开口中并具有多个电极的半导体芯片，多个引线，每个引线的一端连接到相应的电极，多个引线为支撑在绝缘膜上，与半导体芯片相对且间隔开的散热器，以及封装半导体芯片和散热器的一部分的树脂封装体，使散热器的外表面露出，并且多个第二端的引线从封装向外延伸。

2. 发明授权

US5359203A Laser OLB apparatus and method of mounting semiconductor device 失效
标题翻译：激光OLB装置和半导体装置的安装方法
公开(公告)号：US5359203A
公开(公告)日：1994-10-25
申请号：US70242
申请日：1993-06-02
申请人： Mitsuya Hashii , Haruo Shimamoto , Hideya Yagoura
发明人： Mitsuya Hashii , Haruo Shimamoto , Hideya Yagoura
IPC分类号： H05K3/34 , B23K26/03 , B23K26/04 , G01N21/88 , H05K13/08 , G01N21/86
CPC分类号： B23K26/032 , B23K26/04 , G01N21/88 , H05K13/08 , H05K3/3421 , H05K3/3494
摘要： A laser OLB apparatus includes an XY table; a bonding laser source for irradiating bonding parts between bonding lands of a substrate and leads of a semiconductor device located on the substrate thereby bonding the bonding parts; a recognition device for recognizing whether the leads of the semiconductor device are free of flexure and deviation; and a control unit for controlling the XY table and the laser source so that bonding is conducted only when the recognition device has recognized that the leads are free of flexure and deviation.
摘要翻译：激光OLB装置包括XY台; 用于照射基板的接合台面和位于基板上的半导体器件的引线之间的接合部分的接合激光源，从而结合接合部分; 用于识别半导体器件的引线是否没有挠曲和偏差的识别装置; 以及用于控制XY工作台和激光源的控制单元，使得仅当识别装置已经认识到引线没有挠曲和偏移时才进行接合。

3. 发明授权

US5055912A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5055912A
公开(公告)日：1991-10-08
申请号：US577111
申请日：1990-09-04
申请人： Yasuhiro Murasawa , Hitoshi Toda , Hiroshi Sawano , Hideya Yagoura
发明人： Yasuhiro Murasawa , Hitoshi Toda , Hiroshi Sawano , Hideya Yagoura
IPC分类号： H01L23/50 , H01L23/495 , H05K3/34
CPC分类号： H01L23/49555 , H05K3/3426 , H01L2924/0002 , H05K3/3421 , Y02P70/613
摘要： A semiconductor device mounted on a substrate. Outer leads, partially resin-molded, have a greater height above the mounting surface than that of a conventional device. Specifically, each lead projecting from the molded resin has a bent portion which is convex in the direction opposite to the mounting surface, and the length of the lead beyond the bent portion is greater than the distance from the lead portion adjacent to the resin portion of the lead to the mounting surface. The long leads improve reliability during, e.g., heat cycle, tests. In another embodiment, outer leads, partially resin-molded, have reverse J-shaped bent portions, each with a distal end positioned away from the resin. When the bent portions serve as soldering portions, the soldering condition can be easily checked.
摘要翻译：安装在基板上的半导体器件。部分树脂模制的外引线在安装表面上方比传统装置的高度高。具体地说，从模塑树脂突出的每个引线具有在与安装表面相反的方向上凸出的弯曲部分，并且超过弯曲部分的引线的长度大于与引导部分相邻于树脂部分的距离导致安装表面。长引线在例如热循环，测试期间提高了可靠性。在另一个实施例中，部分树脂模制的外引线具有相反的J形弯曲部分，每个部分的远端远离树脂。当弯曲部分用作焊接部分时，可以容易地检查焊接条件。

4. 发明授权

US4945391A Semiconductor device housing with laser diode and light receiving element 失效
标题翻译：具有激光二极管和光接收元件的半导体器件外壳
公开(公告)号：US4945391A
公开(公告)日：1990-07-31
申请号：US323660
申请日：1989-03-15
申请人： Hideya Yagoura , Isamu Yamamoto
发明人： Hideya Yagoura , Isamu Yamamoto
IPC分类号： H01S5/00 , G02B6/42 , H01S5/022
CPC分类号： G02B6/4295 , G02B6/4204 , H01S5/02248 , H01L2224/48091 , H01S5/0071 , H01S5/0683
摘要： A semiconductor device includes a laser diode and a light receiving element arranged on a common surface of a substrate and a monitor laser beam from the laser diode is reflected by a reflecting plate to the light receiving element. With the arrangement of the laser diode and the light receiving element on the same surface of the substrate, die-bondings and wire-bondings for the laser diode and the light receiving element can be performed in a single step. Thermal stress due to heat generation of the laser diode is minimized by a use of a sub-mount between the laser diode and the substrate.
摘要翻译：半导体器件包括激光二极管和设置在基板的公共表面上的光接收元件，来自激光二极管的监视激光束被反射板反射到光接收元件。利用激光二极管和光接收元件在基板的相同表面上的布置，可以在一个步骤中进行激光二极管和光接收元件的管芯接合和引线接合。通过使用激光二极管和衬底之间的子安装，使激光二极管发热引起的热应力最小化。

5. 发明授权

US4826068A Outer lead bonding device utilizing tape carriers 失效
标题翻译：使用带载体的外引线接合装置
公开(公告)号：US4826068A
公开(公告)日：1989-05-02
申请号：US210083
申请日：1988-06-22
申请人： Hideya Yagoura , Haruo Shimamoto
发明人： Hideya Yagoura , Haruo Shimamoto
IPC分类号： H05K3/32 , H01L21/60 , H05K3/30 , H05K3/34 , H05K13/04 , B23K1/20
CPC分类号： H01L24/50 , H01L24/32 , H01L24/86 , H05K13/0465 , H05K3/303 , H01L2224/4899 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K2201/10681 , H05K2201/2036 , H05K2203/0195 , H05K3/3421 , H05K3/3494 , Y02P70/613 , Y10T29/49135
摘要： A bonding device for effecting outer lead bonding is disclosed which comprises a bonding stage, a pair of bonding tools, and lead supporting means. The lead supporting means may take the form of a pair of projections formed on the upper surface of the bonding stage at horizontal locations thereof which are situated below the lead supporting portion of the tape carrier. Alternatively, the lead supporting means may take the form of a pair of horizontally extending rectangular columns which are retractably inserted into the above specified horizontal locations of the upper surface of the bonding stage. Thus, leads can be formed simultaneously with the outer lead bonding. The bonding stage may be divided into upper and lower stages, and the projections may be formed on the upper surface of the lower stage to extend through holes formed in the upper stage. This structure makes the projections retractable.
摘要翻译：公开了一种用于实现外引线接合的接合装置，其包括接合台，一对接合工具和引线支撑装置。引线支撑装置可以采取形成在接合台的上表面上的水平位置处的一对突起的形式，其位于带状物的引线支撑部分的下方。或者，引线支撑装置可以采取一对水平延伸的矩形柱的形式，其可伸缩地插入到结合台的上表面的上述指定的水平位置中。因此，可以与外引线接合同时形成引线。接合台可以分为上段和下段，并且突起可以形成在下级的上表面上，以延伸通过形成在上段中的孔。这种结构使得突起可伸缩。

6. 发明授权

US5412157A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5412157A
公开(公告)日：1995-05-02
申请号：US91929
申请日：1993-07-16
申请人： Hideya Yagoura , Noriaki Higuchi , Haruo Shimamoto
发明人： Hideya Yagoura , Noriaki Higuchi , Haruo Shimamoto
IPC分类号： H01L23/50 , H01L21/48 , H01L23/495 , H05K1/18 , H05K3/34 , H01L23/02
CPC分类号： H01L21/4842 , H01L23/49558 , H05K3/3426 , H01L2924/0002 , H05K2201/10424 , H05K2201/10689 , H05K3/3489 , Y02P70/613 , Y10T29/4922
摘要： A semiconductor device includes a molded resin encapsulating a semiconductor chip, outer leads extending from the molded resin and having free ends, and a resin layer connecting and supporting the outer leads along the entire length of the outer leads. The resin layer may have an activating ability for soldering. A method for manufacturing a semiconductor device includes preparing a semiconductor device having a molded resin and a plurality of outer lead portions extending from the molded resin and connected to a lead frame, forming a resin film on and between the outer lead portions; cutting the lead portions to provide cantilevered outer leads having free ends; lead-forming the outer leads with lead-forming dies while heating the resin film to form a resin layer connecting and supporting the outer leads along the entire lengths of the outer leads, and taking the semiconductor device out of the lead-forming dies after the resin layer has been cured.
摘要翻译：半导体器件包括封装半导体芯片的模制树脂，从模制树脂延伸并具有自由端的外部引线以及沿外部引线的整个长度连接和支撑外部引线的树脂层。树脂层可以具有用于焊接的活化能力。一种制造半导体器件的方法包括制备具有模制树脂的半导体器件和从模制树脂延伸并连接到引线框架的多个外引线部分，在外引线部分之间和之间形成树脂膜; 切割引线部分以提供具有自由端的悬臂式外引线; 在加热树脂膜的同时对引线形成外引线，以形成沿着外引线的整个长度连接和支撑外引线的树脂层，并且将半导体器件从引线成形模具中取出树脂层已经固化。

7. 发明授权

US5064706A Carrier tape including molten resin flow path element for resin packaged semiconductor devices 失效
标题翻译：载带，包括树脂封装半导体器件的熔融树脂流路元件
公开(公告)号：US5064706A
公开(公告)日：1991-11-12
申请号：US281401
申请日：1988-12-08
申请人： Tetsuya Ueda , Haruo Shimamoto , Hideya Yagoura , Hiroshi Seki , Yasuhiro Teraoka
发明人： Tetsuya Ueda , Haruo Shimamoto , Hideya Yagoura , Hiroshi Seki , Yasuhiro Teraoka
IPC分类号： H01L21/60 , H01L21/56 , H01L23/495
CPC分类号： H01L24/50 , H01L21/565 , H01L23/49524 , H01L23/49572 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , Y10S428/901 , Y10S428/906 , Y10T29/49121 , Y10T428/24273 , Y10T428/24298 , Y10T428/24322
摘要： A carrier tape includes a film having an opening for receiving a semiconductor chip to be resin-molded by a pair of mold halves and outer lead holes formed around the periphery of the opening, a plurality of leads for mounting the semiconductor chip on the film, and a resin running portion cooperating, when the mold halves are closed with the film held between the mold halves, with a gate formed on a parting surface of one of the mold halves to define a resin running path which extends from a portion of the film outside the outer lead holes to the opening for guiding a molten resin into the mold halves while preventing the resin from entering the outer lead holes.
摘要翻译：载带包括具有用于接收半导体芯片的开口的膜，该半导体芯片由一对半模形成，并且形成在开口周围的外部引线孔;多个用于将半导体芯片安装在膜上的引线，以及当所述半模被所述半模保持在所述半模之间的所述半模封闭时，与所述半模中的一个的分离面上形成的门形成一个树脂运行路径，从而形成从所述膜的一部分延伸的树脂行进路径，在外部引线孔外面到开口，用于将熔融树脂引导到半模中，同时防止树脂进入外部引线孔。

8. 发明授权

US4839713A Package structure for semiconductor device 失效
标题翻译：半导体器件的封装结构
公开(公告)号：US4839713A
公开(公告)日：1989-06-13
申请号：US156571
申请日：1988-02-17
申请人： Yasuhiro Teraoka , Tetsuya Ueda , Hideya Yagoura , Haruo Shimamoto , Shigeyuki Nango , Toshinobu Banjo , Hiroshi Seki
发明人： Yasuhiro Teraoka , Tetsuya Ueda , Hideya Yagoura , Haruo Shimamoto , Shigeyuki Nango , Toshinobu Banjo , Hiroshi Seki
IPC分类号： H01L23/057 , H01L23/24 , H01L23/31 , H01L23/495
CPC分类号： H01L24/50 , H01L23/057 , H01L23/24 , H01L23/3121 , H01L23/49572 , H01L2924/01005 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082
摘要： A package structure comprising a metallic cap having a bottom wall to which the bottom surface of the semiconductor chip is electrically and mechanically connected, a side wall extending from said bottom wall and surrounding the semiconductor chip, and a flange extending outwardly from said side wall substantially parallel to said bottom wall, said flange supporting the lead conductors thereon through an electrically insulating material. The electrical connection means is disposed between the metallic cap flange and the lead conductor for establishing an electrical connection therebetween. The electrical connection means may comprise an electrically conductive projection formed on the flange of the metal cap, extending through a notch in the insulating material and electrically connected to the lead conductor. The electrical connection means may be an electrically conductive bonding material filled within a cavity defined by an opening in the flange of the metal cap, a through hole in the insulating material and a connecting pad of the lead conductor.
摘要翻译：一种包装结构，包括具有底壁的金属盖，半导体芯片的底表面电气和机械连接到该底壁，从所述底壁延伸并围绕半导体芯片的侧壁，以及从所述侧壁向外延伸的凸缘，平行于所述底壁，所述凸缘通过电绝缘材料在其上支撑引线导体。电连接装置设置在金属帽凸缘和引线导体之间，用于在它们之间建立电连接。电连接装置可以包括形成在金属帽的凸缘上的导电突起，延伸穿过绝缘材料中的凹口并电连接到引线导体。电连接装置可以是填充在由金属盖的凸缘中的开口，绝缘材料中的通孔和引线导体的连接焊盘限定的空腔内的导电接合材料。

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