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1. 发明授权

US06432218B1 Multi-step flow cleaning method and multi-step flow cleaning apparatus 失效
标题翻译：多步流动清洗方法和多步流动清洗装置
公开(公告)号：US06432218B1
公开(公告)日：2002-08-13
申请号：US09402877
申请日：1999-12-07
申请人： Masatoshi Hirokawa , Haruki Sonoda , Yusuke Abe , Tetsuji Oishi , Masashi Omori , Hiroshi Tanaka
发明人： Masatoshi Hirokawa , Haruki Sonoda , Yusuke Abe , Tetsuji Oishi , Masashi Omori , Hiroshi Tanaka
IPC分类号： B08B310
CPC分类号： B08B3/10 , Y10S134/902
摘要： A multi-step flow cleaning method and a multi-step flow cleaning apparatus are provided which effectively clean workpieces with a stream of a cleaning solution and to suppress an increase of foreign matters adhering to the surfaces of the workpieces. A cleaning tank 10 for holding workpieces is provided, a supply line 14 for supplying a cleaning solution such as pure water from the bottom surface of the cleaning tank is provided, and a valve 12 for adjusting the flow of the cleaning solution is disposed in the middle of the supply line 14. The valve 12 is equipped with a switching section 12a for controlling the outflow of the cleaning solution by opening or closing the supply line 14, and a bypass 12b for supplying the cleaning solution, bypassing the switching section 12a. The valve 12 is provided such that it is able to adjust in two steps the supply flow of the cleaning solution supplied to the cleaning tank 10 by using the supply flow fed through the bypass 12b and the supply flow fed through the switching section 12a.
摘要翻译：提供了一种多级流动清洗方法和多级流动清洁装置，其用清洁液流清洁工件，并且抑制附着在工件表面上的异物的增加。设置有用于保持工件的清洁槽10，用于从清洗槽的底面供给纯净水等清洗液的供给管路14，将清洗液的流量调整用阀12配置在阀12配备有用于通过打开或关闭供应管线14来控制清洗溶液的流出的切换部分12a和绕过切换部分12a的清洁溶液供给的旁路12b。阀12设置成使得能够通过使用通过旁路12b供给的供给流和通过切换部12a供给的供给流，分两步调整供给到清洗槽10的清洗溶液的供给流。

2. 发明授权

US06616774B2 Wafer cleaning device and tray for use in wafer cleaning device 失效
标题翻译：晶片清洁装置和用于晶圆清洗装置的托盘
公开(公告)号：US06616774B2
公开(公告)日：2003-09-09
申请号：US09961682
申请日：2001-09-24
申请人： Haruki Sonoda , Kazuto Nishizaki , Tetsuji Oishi , Masatoshi Hirokawa , Ei-Ichi Ando , Yusuke Abe , Masashi Omori
发明人： Haruki Sonoda , Kazuto Nishizaki , Tetsuji Oishi , Masatoshi Hirokawa , Ei-Ichi Ando , Yusuke Abe , Masashi Omori
IPC分类号： B08B702
CPC分类号： H01L21/67057 , H01L21/67781 , Y10S134/902 , Y10S438/906
摘要： There are provided a band-shaped tray 12 having grasping grooves 12a for grasping opposite side ends of wafers 1, and a cleaning tank 20 to which the wafers 1 inserted in the tray 12 are conveyed by a conveyor robot 2 to be cleaned. The cleaning tank 20 is provided with guides 22 for mounting the tray 12 in the tank, a bottom portion 26 formed substantially in V-shape conforming to the bottom-face shape of the wafer 1, and flow ports 24 via which cleaning fluid is supplied into the tank. An outer side face of the cleaning tank 20 is provided with an overflow tank 30 for containing the cleaning fluid overflowing from the cleaning tank 20, and the overflow tank 30 is provided with a circulation line 32 for circulating the cleaning fluid again into the cleaning tank 20.
摘要翻译：提供了带状托盘12，其具有用于抓握晶片1的相对侧端的把持槽12a和清洁槽20，插入托盘12中的晶片1由输送机器人2输送到清洗槽20。清洗槽20设置有用于将托盘12安装在罐中的引导件22，基本上形成为符合晶片1的底面形状的V形的底部26，以及通过其供应清洁流体的流动端口24 进入坦克清洗槽20的外侧面设置有用于容纳从清洗槽20溢出的清洗液的溢流槽30，溢流槽30设有循环管线32，用于将清洗液再次循环到清洗槽 20。

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