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1. 发明授权

US07291547B2 Filter device and method for fabricating filter devices 失效
标题翻译：过滤装置及其制造方法
公开(公告)号：US07291547B2
公开(公告)日：2007-11-06
申请号：US10623068
申请日：2003-07-18
申请人： Hans-Jörg Timme , Robert Aigner , Lüder Elbrecht , Juha Sakari Ellä , Katri Helena Pohjonen , Pasi Tikka
发明人： Hans-Jörg Timme , Robert Aigner , Lüder Elbrecht , Juha Sakari Ellä , Katri Helena Pohjonen , Pasi Tikka
IPC分类号： H01L21/44
CPC分类号： H03H3/02 , H01L2224/11334 , H01L2924/00014 , H03H3/08 , H01L2224/0401
摘要： A filter device and a method for fabricating filter devices can package filters, especially acoustic wave filters, by bonding a carrier (substrate) wafer carrying manufactured filters to another wafer referred to as a capping wafer. A capping wafer/substrate eliminates the need for a conventional package to protect the sensitive filters, which reduces both product size and product costs significantly. Even though additional packaging is possible (i.e. in plastic molded packages, or in glob-top packages), it is not required for the reliability of the filters.
摘要翻译：过滤器装置和用于制造过滤器装置的方法可以通过将携带制造的过滤器的载体（衬底）晶片结合到称为封盖晶片的另一个晶片来封装滤波器，特别是声波滤波器。封盖晶片/基板不需要传统封装来保护敏感滤光片，这显着降低了产品尺寸和产品成本。即使附加的包装是可能的（即，在塑料模制包装中，或在全球顶部包装中），滤网的可靠性不是必需的。

2. 发明授权

US07199684B2 Filter circuit with a filter stage and balun on a single substrate 有权
标题翻译：滤波电路带有滤波器和平衡 - 不平衡转换器在单个基板上
公开(公告)号：US07199684B2
公开(公告)日：2007-04-03
申请号：US11045500
申请日：2005-01-28
申请人： Robert Aigner , Juha Sakari Ellae , Stephan Marksteiner , Hans-Jörg Timme
发明人： Robert Aigner , Juha Sakari Ellae , Stephan Marksteiner , Hans-Jörg Timme
IPC分类号： H03H9/54
CPC分类号： H03H9/0095 , H01F17/0006 , H01F2021/125 , H03H7/42
摘要： A filter circuit comprises a balanced port, an unbalanced port and a substrate. A series circuit of a filter stage and a balun is disposed between the balanced port and the unbalanced port. The balun and the filter stage are formed on the substrate.
摘要翻译：滤波电路包括平衡端口，不平衡端口和基板。滤波器级和平衡 - 不平衡变换器的串联电路设置在平衡端口和不平衡端口之间。平衡不平衡转换器和滤波器级形成在基板上。

3. 发明授权

US06373115B1 Micromechanical structure, sensor and method for manufacturing the same 有权
标题翻译：微机械结构，传感器及其制造方法
公开(公告)号：US06373115B1
公开(公告)日：2002-04-16
申请号：US09384905
申请日：1999-08-27
申请人： Stefan Kolb , Dieter Maier-Schneider , Klaus-Günter Oppermann , Hans-Jörg Timme
发明人： Stefan Kolb , Dieter Maier-Schneider , Klaus-Günter Oppermann , Hans-Jörg Timme
IPC分类号： H01L2982
CPC分类号： B81C1/00182 , B81B2201/0257 , G01L9/0042 , G01P15/0802
摘要： A micromechanical structure, such as a sensor, includes a substrate, a diaphragm, a cavity, a sacrificial layer and a terminating structure. The terminating structure is cut away in the region of the diaphragm in such a way that a media opening is located above the diaphragm. The diameter of the cavity is smaller over the entire circumference of the cavity than the diameter of the opening. A method for manufacturing the micromechanical structure is also provided.
摘要翻译：诸如传感器的微机械结构包括衬底，隔膜，空腔，牺牲层和端接结构。端接结构在隔膜的区域被切除，使得介质开口位于隔膜上方。空腔的直径在空腔的整个圆周上比开口的直径小。还提供了一种用于制造微机械结构的方法。

4. 发明授权

US06389902B2 Micromechanical sensor and method for its production 有权
标题翻译：微机械传感器及其生产方法
公开(公告)号：US06389902B2
公开(公告)日：2002-05-21
申请号：US09781798
申请日：2001-02-12
申请人： Robert Aigner , Hans-Jörg Timme , Thomas Bever
发明人： Robert Aigner , Hans-Jörg Timme , Thomas Bever
IPC分类号： G01L900
CPC分类号： B81C1/00801 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81B2207/015 , B81C2201/0136 , H04R19/005 , H04R19/04 , H04R31/00
摘要： The invention relates to a micromechanical sensor and to a corresponding production method that includes the following steps: a) preparing a doped semiconductor wafer; b) applying an epitaxial layer that is doped in such a way that a jump in the charge carrier density in the interface between the semiconductor wafer and the epitaxial layer occurs; c) optionally etching ventilation holes traversing the epitaxial layer and optionally filling the ventilation holes with a sacrificial material; d) depositing at least one sacrificial layer, at least one spacing layer, a membrane and optionally a semiconductor circuit on the top side of the epitaxial layer using a technology known per se, wherein the semiconductor circuit may be applied after the membrane is formed or while depositing the layers required to form the membrane; e) etching a hole on the back part of the sensor, wherein the etching method is selected in such a way that etching advances in the direction of the top side and ceases in the interference between the wafer and the epitaxial layer by changing charge carrier concentration. The invention also relates to the utilization of the micromechanical sensor in pressure sensors or microphones.
摘要翻译：本发明涉及一种微机械传感器及相应的生产方法，包括以下步骤：a）制备掺杂半导体晶片; b）施加掺杂的外延层，使得发生半导体晶片和外延层之间的界面中的电荷载流子密度的跳跃; c）可选地蚀刻穿过外延层的通气孔并且可选地用牺牲材料填充通风孔; d）使用本身已知的技术在外延层的顶侧上沉积至少一个牺牲层，至少一个间隔层，膜和任选的半导体电路，其中半导体电路可以在膜被形成之后施加同时沉积形成膜所需的层; e）蚀刻传感器后部的孔，其中蚀刻方法被选择为使得蚀刻沿着顶侧的方向前进并且通过改变电荷载流子浓度而在晶片和外延层之间的干涉中停止。本发明还涉及在压力传感器或麦克风中利用微机械传感器。

5. 发明授权

US06401544B2 Micromechanical component protected from environmental influences 有权
标题翻译：微机械元件免受环境影响
公开(公告)号：US06401544B2
公开(公告)日：2002-06-11
申请号：US09794664
申请日：2001-02-27
申请人： Robert Aigner , Christofer Hierold , Hergen Kapels , Stefan Kolb , Dieter Maier-Schneider , Klaus-Günter Oppermann , Hans-Jörg Timme , Thomas Scheiter , Wolfgang Werner
发明人： Robert Aigner , Christofer Hierold , Hergen Kapels , Stefan Kolb , Dieter Maier-Schneider , Klaus-Günter Oppermann , Hans-Jörg Timme , Thomas Scheiter , Wolfgang Werner
IPC分类号： G01L900
CPC分类号： G01L9/0042 , B81B2201/0235 , B81B2201/0257 , B81B2201/0264 , B81C1/00896 , B81C2201/053 , H01L2924/0002 , H01L2924/00
摘要： A method is disclosed for producing a micromechanical component. The micromechanical component has sensor holes, wherein at least one component protective layer and/or a spacer coating is applied on the component before separating the wafer into chips. The component protective layer sealingly covers at least the walls of the holes extending parallel to the surface of the wafer and perpendicular to the surface of the wafer and the spacer coating sealingly covers at least the walls of the holes extending parallel to the surface of the wafer.
摘要翻译：公开了一种用于制造微机械部件的方法。微机械部件具有传感器孔，其中在将晶片分成芯片之前，在部件上施加至少一个部件保护层和/或间隔涂层。部件保护层至少密封地覆盖平行于晶片表面延伸的垂直于晶片表面的孔的壁，间隔件涂层至少密封地覆盖平行于晶片表面延伸的孔的壁。

6. 发明授权

US06725725B1 Micromechanical differential pressure sensor device 失效
标题翻译：微机械差压传感器装置
公开(公告)号：US06725725B1
公开(公告)日：2004-04-27
申请号：US09571489
申请日：2000-05-15
申请人： Wolfgang Werner , Hans-Jörg Timme
发明人： Wolfgang Werner , Hans-Jörg Timme
IPC分类号： G01L1500
CPC分类号： G01L9/0073
摘要： A micromechanical differential pressure sensor device for measuring a pressure difference between two mutually separated spaces or media, in which two absolute pressure measuring devices are monolithically integrated on a single support substrate, in particular on a semiconductor chip. The absolute pressure measuring devices are preferably fabricated by surface micromachining.
摘要翻译：一种微机械差压传感器装置，用于测量两个相互分离的空间或介质之间的压力差，其中两个绝对压力测量装置单片集成在单个支撑基板上，特别是在半导体芯片上。绝对压力测量装置优选地通过表面微加工制造。

7. 发明授权

US06357298B1 Micromechanical sensor and method for operating the sensor 有权
标题翻译：微机械传感器和操作传感器的方法
公开(公告)号：US06357298B1
公开(公告)日：2002-03-19
申请号：US09538791
申请日：2000-03-30
申请人： Dieter Draxelmayr , Hans-Jörg Timme
发明人： Dieter Draxelmayr , Hans-Jörg Timme
IPC分类号： G01L912
CPC分类号： G01L9/12 , G01D5/24 , G01L9/0073 , G01L27/007
摘要： A sensor, in particular a micromechanical pressure sensor, has two identical capacitive partial structures coupled to an evaluation circuit. In the case of in-phase driving, an additive signal is present as a pressure-dependent useful signal. In the case of in-antiphase driving, a difference signal is present as a diagnostic signal.
摘要翻译：传感器，特别是微机械压力传感器，具有耦合到评估电路的两个相同的电容部分结构。在同相驱动的情况下，存在加法信号作为压力有用信号。在反相驱动的情况下，差分信号作为诊断信号存在。

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