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    • 2. 发明申请
    • POLISHING PAD AND METHOD OF MANUFACTURING THE SAME
    • 抛光垫及其制造方法
    • WO2009002124A1
    • 2008-12-31
    • PCT/KR2008/003747
    • 2008-06-27
    • KOLON INDUSTRIES, INCKIM, Won-JoonHWANG, Yeong-Nam
    • KIM, Won-JoonHWANG, Yeong-Nam
    • B24D11/00
    • B24B37/24
    • Disclosed are a polishing pad used in a CMP process of a planar material such as a silicon wafer, plate glass for a display, etc. and a method for manufacturing the same. The polishing pad comprises a non-woven fabric consisting of ultrafine fibers and elastomeric polymer impregnated into the fabric, on which the ultrafine fibers are raised and arranged to simultaneously satisfy the following conditions (I) to (III) such that the ultrafine fibers are oriented in a longitudinal direction to a central axis: The polishing pad of the present invention includes ultrafine fibers, which are arranged at a relatively wide orientation angle and have pores formed therebetween without requiring alternative processes for forming the pores, thus, exhibits excellent polishing performance and low occurrence of scratches during a polishing process.
    • 公开了用于诸如硅晶片,用于显示器的平板玻璃等的平面材料的CMP工艺中的抛光垫及其制造方法。 抛光垫包括由超细纤维和浸渍到织物中的弹性聚合物组成的无纺织物,超细纤维在其上升起并布置成同时满足以下条件(I)至(III),使得超细纤维取向 在中心轴的纵向上:本发明的抛光垫包括超细纤维,其以相对宽的取向角度布置并且在其间形成孔,而不需要形成孔的替代方法,因此显示出优异的抛光性能和 抛光过程中出现划痕少。