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1. 发明授权

US07938977B2 Method of modulating resonant frequency of torsional MEMS device 失效
标题翻译：调制扭转MEMS器件谐振频率的方法
公开(公告)号：US07938977B2
公开(公告)日：2011-05-10
申请号：US12703747
申请日：2010-02-10
申请人： Long-Sun Huang , Hsien-Lung Ho
发明人： Long-Sun Huang , Hsien-Lung Ho
IPC分类号： C23F1/00 , H02K7/00 , H02N1/00
CPC分类号： G02B26/0833
摘要： A torsional MEMS device is disclosed. The torsional MEMS device includes a support structure, a platform, and at least two hinges, which connects the platform to the support structure. The platform has an active area and a non-active area. A plurality of sacrificial elements is disposed in the non-active area. If the resonant frequency of the torsional MEMS device is less than a predetermined standard resonant frequency of the torsional MEMS device, at least one sacrificial element is removed to reduce the total mass of the torsional MEMS device, and so as to increase the resonant frequency of the torsional MEMS device.
摘要翻译：公开了一种扭转MEMS装置。扭转MEMS装置包括支撑结构，平台和至少两个铰链，其将平台连接到支撑结构。该平台具有活动区域和非活动区域。多个牺牲元件设置在非有效区域中。如果扭转MEMS器件的谐振频率小于扭转MEMS器件的预定标准谐振频率，则去除至少一个牺牲元件以减小扭转MEMS器件的总质量，并且为了增加谐振频率扭转MEMS器件。

2. 发明申请

US20110068356A1 Method of manufacturing light emitting diode packaging lens and light emmiting diode package 失效
标题翻译：制造发光二极管封装透镜和发光二极管封装的方法
公开(公告)号：US20110068356A1
公开(公告)日：2011-03-24
申请号：US12585642
申请日：2009-09-21
申请人： Chung-I Chiang , Tsan Lu , Hung-Yi Lin , Hsien-Lung Ho
发明人： Chung-I Chiang , Tsan Lu , Hung-Yi Lin , Hsien-Lung Ho
IPC分类号： H01L33/00 , H01L21/56
CPC分类号： C23C28/00 , C23C28/04 , C23C28/322 , C23C28/345 , H01L33/507 , H01L33/508 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/8592 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
摘要： A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source.
摘要翻译：在本发明中公开了使用该方法制造发光二极管封装透镜和封装的方法。通过使用电泳沉积，将一层或多层磷光体涂覆到具有弯曲部分的杯的一个表面上。该杯子用于包装镜头。荧光体层的厚度可以被控制，荧光体颗粒的分布是均匀的。因此，具有透镜的发光二极管封装可以是均匀的光源。

3. 发明授权

US07674392B2 Method of fabricating a hinge 失效
标题翻译：制造铰链的方法
公开(公告)号：US07674392B2
公开(公告)日：2010-03-09
申请号：US11557110
申请日：2006-11-07
申请人： Hsien-Lung Ho
发明人： Hsien-Lung Ho
IPC分类号： C03C15/00
CPC分类号： B81C1/00142
摘要： The present invention provides a method of fabricating a hinge. First, a wafer is provided, and a hinge region and at least two through regions are defined on the wafer. The wafer in the hinge region is partially removed from a bottom surface of the wafer. Subsequently, the wafer in the through regions is completely removed from a top surface of the wafer, and the hinge is formed. Thereafter, a wafer level test is performed on the hinge of the wafer. Next, an etching process is performed to adjust the shape of the hinge. According to the method of the present invention, the thickness of the hinge is no longer limited by the thickness of the wafer, and the hinge can accept the wafer level test.
摘要翻译：本发明提供一种制造铰链的方法。首先，提供晶片，并且在晶片上限定铰链区域和至少两个贯通区域。铰链区域中的晶片从晶片的底表面部分地移除。随后，贯通区域中的晶片从晶片的顶表面完全去除，形成铰链。此后，对晶片的铰链进行晶片级测试。接下来，进行蚀刻处理以调节铰链的形状。根据本发明的方法，铰链的厚度不再受到晶片的厚度的限制，铰链可以接受晶圆级测试。

4. 发明申请

US20100002285A1 TORSIONAL MEMS DEVICE 审中-公开
标题翻译：扭转MEMS器件
公开(公告)号：US20100002285A1
公开(公告)日：2010-01-07
申请号：US12202312
申请日：2008-08-31
申请人： Long-Sun Huang , Hsien-Lung Ho
发明人： Long-Sun Huang , Hsien-Lung Ho
IPC分类号： G02B26/00
CPC分类号： G02B26/0833
摘要： A torsional MEMS device is disclosed. The torsional MEMS device includes a support structure, a platform, and at least two hinges, which connects the platform to the support structure. The platform has an active area and a non-active area. A plurality of sacrificial elements is disposed in the non-active area. If the resonant frequency of the torsional MEMS device is less than a predetermined standard resonant frequency of the torsional MEMS device, at least one sacrificial element is removed to reduce the total mass of the torsional MEMS device, and so as to increase the resonant frequency of the torsional MEMS device.
摘要翻译：公开了一种扭转MEMS装置。扭转MEMS装置包括支撑结构，平台和至少两个铰链，其将平台连接到支撑结构。该平台具有活动区域和非活动区域。多个牺牲元件设置在非有效区域中。如果扭转MEMS器件的谐振频率小于扭转MEMS器件的预定标准谐振频率，则去除至少一个牺牲元件以减小扭转MEMS器件的总质量，并且为了增加谐振频率扭转MEMS器件。

5. 发明授权

US08455910B2 Method of manufacturing light emitting diode packaging lens and light emitting diode package 失效
标题翻译：制造发光二极管封装透镜和发光二极管封装的方法
公开(公告)号：US08455910B2
公开(公告)日：2013-06-04
申请号：US12585642
申请日：2009-09-21
申请人： Chung-I Chiang , Tsan Lu , Hung-Yi Lin , Hsien-Lung Ho
发明人： Chung-I Chiang , Tsan Lu , Hung-Yi Lin , Hsien-Lung Ho
IPC分类号： H01L33/00
CPC分类号： C23C28/00 , C23C28/04 , C23C28/322 , C23C28/345 , H01L33/507 , H01L33/508 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/8592 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
摘要： A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source.
摘要翻译：在本发明中公开了使用该方法制造发光二极管封装透镜和封装的方法。通过使用电泳沉积，将一层或多层磷光体涂覆到具有弯曲部分的杯的一个表面上。该杯子用于包装镜头。荧光体层的厚度可以被控制，荧光体颗粒的分布是均匀的。因此，具有透镜的发光二极管封装可以是均匀的光源。

6. 发明申请

US20130105668A1 REFLECTIVE DISPLAY DEVICE WITH LIGHT COMPENSATION MODULE 审中-公开
标题翻译：具有光补偿模块的反射显示装置
公开(公告)号：US20130105668A1
公开(公告)日：2013-05-02
申请号：US13330534
申请日：2011-12-19
申请人： HSIEN-LUNG HO , CHIU-HSIUNG LIN
发明人： HSIEN-LUNG HO , CHIU-HSIUNG LIN
IPC分类号： G01J1/44
CPC分类号： G09G3/3466 , G09G3/025 , G09G3/3413 , G09G2320/0666 , G09G2360/144 , H05B33/0869
摘要： A display device includes a display layer, a control unit, a color sensor and a light guide plate (LGP) arranged on the display layer. A light emitting module includes three light emitters configured for emitting red, green and blue light, into the LGP through the lateral surface. The control unit determines whether the detected intensities of the red, green and blue light components in the ambient light are in a predetermined proportion, and to turn on the corresponding light emitters to compensate the red, green or blue light so as to maintain the intensities of the red, green and blue light components in the ambient light to be in the predetermined proportion.
摘要翻译：显示装置包括布置在显示层上的显示层，控制单元，颜色传感器和导光板（LGP）。发光模块包括被配置为通过侧表面将红色，绿色和蓝色光发射到LGP中的三个发光体。控制单元确定环境光中的红色，绿色和蓝色光分量的检测强度是否处于预定比例，并且打开相应的发光体以补偿红色，绿色或蓝色光，以便保持强度的环境光中的红色，绿色和蓝色光分量处于预定比例。

7. 发明申请

US20110164223A1 MICROMINIATURIZED PROJECTION MODULE FOR PROJECTING IMAGE ONTO OBJECT 失效
标题翻译：用于投影图像到对象的微型投影模块
公开(公告)号：US20110164223A1
公开(公告)日：2011-07-07
申请号：US12652801
申请日：2010-01-06
申请人： Chung-I Chiang , Hung-Yi Lin , Hsien-Lung Ho
发明人： Chung-I Chiang , Hung-Yi Lin , Hsien-Lung Ho
IPC分类号： G03B21/28
CPC分类号： G03B37/04 , G03B21/005 , H04N9/3129 , H04N9/3147
摘要： A microminiaturized projection module for projecting an image onto an object is disclosed in the present invention. The module includes a number of light units each for providing red, green, and blue beams; an image processing unit for receiving the image, dividing the image into n×m image signals, and transforming each of the image signals into a modulating signal and a direction signal, where n and in are integrals not less than 2, respectively; a number of modulation units for modulating the beams from one light unit according to the modulating signal received from the image processing unit and sending out the modulated beams simultaneously; and an array of n×m mirrors for projecting the modulated beams to form the image onto the object according to the direction signal received from the image processing unit. The invention has advantages that can reduce modulation speed, undergo slight shock and be free from raster pinch effect.
摘要翻译：在本发明中公开了一种用于将图像投影到物体上的微型投影模块。该模块包括多个用于提供红色，绿色和蓝色光束的光单元; 图像处理单元，用于接收图像，将图像划分成n×m个图像信号，并将每个图像信号变换成分别为n和in的调制信号和方向信号，其中n和in分别为不小于2的积分; 多个调制单元，用于根据从图像处理单元接收的调制信号调制来自一个光单元的波束，并同时发出调制波束; 以及n×m个反射镜的阵列，用于根据从图像处理单元接收的方向信号投影调制的光束以将图像形成到对象上。本发明具有可以降低调制速度，经受轻微冲击并且不受光栅夹紧效应的优点。

8. 发明申请

US20100134870A1 METHOD OF MODULATING RESONANT FREQUENCY OF TORSIONAL MEMS DEVICE 失效
标题翻译：调制扭转MEMS器件的谐振频率的方法
公开(公告)号：US20100134870A1
公开(公告)日：2010-06-03
申请号：US12703747
申请日：2010-02-10
申请人： Long-Sun Huang , Hsien-Lung Ho
发明人： Long-Sun Huang , Hsien-Lung Ho
IPC分类号： G02B26/00
CPC分类号： G02B26/0833
摘要： A torsional MEMS device is disclosed. The torsional MEMS device includes a support structure, a platform, and at least two hinges, which connects the platform to the support structure. The platform has an active area and a non-active area. A plurality of sacrificial elements is disposed in the non-active area. If the resonant frequency of the torsional MEMS device is less than a predetermined standard resonant frequency of the torsional MEMS device, at least one sacrificial element is removed to reduce the total mass of the torsional MEMS device, and so as to increase the resonant frequency of the torsional MEMS device.
摘要翻译：公开了一种扭转MEMS装置。扭转MEMS装置包括支撑结构，平台和至少两个铰链，其将平台连接到支撑结构。该平台具有活动区域和非活动区域。多个牺牲元件设置在非有效区域中。如果扭转MEMS器件的谐振频率小于扭转MEMS器件的预定标准谐振频率，则去除至少一个牺牲元件以减小扭转MEMS器件的总质量，并且为了增加谐振频率扭转MEMS器件。

9. 发明授权

US07258806B1 Method of fabricating a diaphragm of a capacitive microphone device 有权
标题翻译：制造电容式麦克风装置的隔膜的方法
公开(公告)号：US07258806B1
公开(公告)日：2007-08-21
申请号：US11426017
申请日：2006-06-23
申请人： Hsien-Lung Ho
发明人： Hsien-Lung Ho
IPC分类号： C23F1/00 , H01L21/00
CPC分类号： H04R19/04
摘要： A method of fabricating a diaphragm of a capacitive microphone device. First, a substrate is provided, and a dielectric layer on a first surface of the substrate is formed. Than, a plurality of silicon spacers are formed on a surface of the dielectric layer, and a diaphragm layer is formed on a surface of the silicon spacers and the surface of the dielectric layer. Subsequently, a planarization layer is formed on the diaphragm layer, and a second surface of the substrate is etched to form a plurality of openings corresponding to the diaphragm layer disposed on the surface of the dielectric layer. Thereafter, the dielectric layer exposed through the openings is removed, and planarization layer is removed.
摘要翻译：一种制造电容式麦克风装置的隔膜的方法。首先，提供基板，并且形成在基板的第一表面上的电介质层。在电介质层的表面上形成多个硅隔离物，并且在硅间隔物的表面和电介质层的表面上形成隔膜层。随后，在隔膜层上形成平坦化层，并且蚀刻基板的第二表面以形成与设置在电介质层表面上的隔膜层相对应的多个开口。此后，除去通过开口露出的电介质层，去除平坦化层。

10. 发明申请

US20050215029A1 Method for fixing wafer used in manufacturing procedure 审中-公开
标题翻译：用于制造过程中使用的晶片的方法
公开(公告)号：US20050215029A1
公开(公告)日：2005-09-29
申请号：US10972797
申请日：2004-10-25
申请人： Hsin-Ya Peng , Hsien-Lung Ho , Shih-Feng Shao
发明人： Hsin-Ya Peng , Hsien-Lung Ho , Shih-Feng Shao
IPC分类号： H01L21/44 , H01L21/50 , H01L21/68
CPC分类号： H01L21/6836 , H01L2221/68327
摘要： A method for fixing a wafer used in a manufacturing procedure is provided. The method includes steps of a) providing the wafer, a handling carrier, and a thermal release tape, wherein the wafer has a first and a second surfaces; b) adhering the thermal release tape between the first surface and the handling carrier for fixing the wafer on the handling carrier; c) performing the manufacturing procedure on the second surface; and d) separating the thermal release tape, the first surface and the handling carrier from one another above a specific temperature.
摘要翻译：提供了一种用于固定制造过程中使用的晶片的方法。该方法包括以下步骤：a）提供晶片，处理载体和热释放带，其中晶片具有第一和第二表面; b）将热释放带粘附在第一表面和处理载体之间，用于将晶片固定在处理载体上; c）在第二表面上执行制造程序; 以及d）将所述热释放带，所述第一表面和所述处理载体彼此隔开高于特定温度。

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