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    • 6. 发明申请
    • DENSIFICATION PROCESS FOR TITANIUM NITRIDE LAYER FOR SUBMICRON APPLICATIONS
    • 用于亚微米应用的氮化钛层的致密化工艺
    • WO2010077728A2
    • 2010-07-08
    • PCT/US2009/067312
    • 2009-12-09
    • APPLIED MATERIALS, INC.RITCHIE, Alan AlexanderHASSAN, Mohd Fadzli Anwar
    • RITCHIE, Alan AlexanderHASSAN, Mohd Fadzli Anwar
    • H01L21/205H01L21/28
    • H01L21/76843C23C16/34C23C16/56H01L21/28556H01L21/76846H01L21/76856H01L21/76862
    • Embodiments of the present invention provide methods of forming and densifying a titanium nitride barrier layer. The densification process is performed at a relatively low RF plasma power and high nitrogen to hydrogen ratio so as to provide a substantially titanium rich titanium nitride barrier layer. In one embodiment, a method for forming a titanium nitride barrier layer on a substrate includes depositing a titanium nitride layer on the substrate by a metal-organic chemical vapor deposition process, and performing a plasma treatment process on the deposited titanium nitride layer, wherein the plasma treatment process operates to densify the deposited titanium nitride layer, resulting in a densified titanium nitride layer, wherein the plasma treatment process further comprises supplying a plasma gas mixture containing a nitrogen gas to hydrogen gas ratio between about 20:1 and about 3:1, and applying less than about 500 Watts RF power to the plasma gas mixture.
    • 本发明的实施例提供了形成和致密化氮化钛阻挡层的方法。 致密化过程在相对较低的RF等离子体功率和高氮/氢比下进行,从而提供基本上富含钛的氮化钛阻挡层。 在一个实施例中,用于在衬底上形成氮化钛阻挡层的方法包括通过金属有机化学气相沉积工艺在衬底上沉积氮化钛层,并且在沉积的氮化钛层上执行等离子体处理工艺, 等离子体处理工艺操作致密化沉积的氮化钛层,导致致密化的氮化钛层,其中等离子体处理工艺进一步包括提供包含约20:1至约3:1之间的氮气与氢气比率的等离子体气体混合物 ,并且向等离子体气体混合物施加小于约500瓦的RF功率。