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    • 1. 发明授权
    • Heat dissipating device
    • 散热装置
    • US07000687B2
    • 2006-02-21
    • US10893214
    • 2004-07-16
    • Guo-Liang YingAi-Min HuangShu-Ho Lin
    • Guo-Liang YingAi-Min HuangShu-Ho Lin
    • F28D15/00
    • F28D15/0233F28D15/0275F28D2021/0029H01L23/427H01L2924/0002H01L2924/00
    • A heat dissipating device (1) for removing heat from electronic devices is disclosed. The heat dissipating device includes a heat sink (30) and at least one heat pipe (20). The heat sink includes a Y-shaped heat conductive body and a plurality of fins (35) extending from the body. The body includes a solid block (32) and two extension arms (34) extending aslant from a top of the block in opposite directions. An U-shaped groove (35) is defined in the block and extends to an upper portion (33) of the block. The heat pipe comprises an evaporating portion (22) and a condensing portion (24) extending upwardly from the evaporating portion. The heat pipe is received in the groove so that the heat pipe absorbs heat via the evaporating portion and transfers the heat to the upper portion of the block via the condensing portion thereof.
    • 公开了一种用于从电子设备中去除热量的散热装置(1)。 散热装置包括散热器(30)和至少一个热管(20)。 散热器包括Y形导热体和从主体延伸的多个散热片(35)。 主体包括固体块(32)和两个延伸臂(34),该两个延伸臂从块的顶部沿相反的方向倾斜延伸。 U形槽(35)被限定在块中并延伸到块的上部(33)。 热管包括蒸发部分(22)和从蒸发部分向上延伸的冷凝部分(24)。 热管被容纳在槽中,使得热管经由蒸发部吸收热量,并且经由其冷凝部将热量传递到块的上部。
    • 2. 发明申请
    • Heat dissipating device
    • 散热装置
    • US20050247437A1
    • 2005-11-10
    • US10893214
    • 2004-07-16
    • Guo-Liang YingAi-Min HuangShu-Ho Lin
    • Guo-Liang YingAi-Min HuangShu-Ho Lin
    • F28D15/00F28D15/02G06F1/20H01L23/34H01L23/427H05K7/20
    • F28D15/0233F28D15/0275F28D2021/0029H01L23/427H01L2924/0002H01L2924/00
    • A heat dissipating device (1) for removing heat from electronic devices is disclosed. The heat dissipating device includes a heat sink (30) and at least one heat pipe (20). The heat sink includes a Y-shaped heat conductive body and a plurality of fins (35) extending from the body. The body includes a solid block (32) and two extension arms (34) extending aslant from a top of the block in opposite directions. An U-shaped groove (35) is defined in the block and extends to an upper portion (33) of the block. The heat pipe comprises an evaporating portion (22) and a condensing portion (24) extending upwardly from the evaporating portion. The heat pipe is received in the groove so that the heat pipe absorbs heat via the evaporating portion and transfers the heat to the upper portion of the block via the condensing portion thereof.
    • 公开了一种用于从电子设备中去除热量的散热装置(1)。 散热装置包括散热器(30)和至少一个热管(20)。 散热器包括Y形导热体和从主体延伸的多个散热片(35)。 主体包括固体块(32)和两个延伸臂(34),该两个延伸臂从块的顶部沿相反的方向倾斜延伸。 U形槽(35)被限定在块中并延伸到块的上部(33)。 热管包括蒸发部分(22)和从蒸发部分向上延伸的冷凝部分(24)。 热管被容纳在槽中,使得热管经由蒸发部吸收热量,并且经由其冷凝部将热量传递到块的上部。