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    • 1. 发明申请
    • Heat dissipating device
    • 散热装置
    • US20050247437A1
    • 2005-11-10
    • US10893214
    • 2004-07-16
    • Guo-Liang YingAi-Min HuangShu-Ho Lin
    • Guo-Liang YingAi-Min HuangShu-Ho Lin
    • F28D15/00F28D15/02G06F1/20H01L23/34H01L23/427H05K7/20
    • F28D15/0233F28D15/0275F28D2021/0029H01L23/427H01L2924/0002H01L2924/00
    • A heat dissipating device (1) for removing heat from electronic devices is disclosed. The heat dissipating device includes a heat sink (30) and at least one heat pipe (20). The heat sink includes a Y-shaped heat conductive body and a plurality of fins (35) extending from the body. The body includes a solid block (32) and two extension arms (34) extending aslant from a top of the block in opposite directions. An U-shaped groove (35) is defined in the block and extends to an upper portion (33) of the block. The heat pipe comprises an evaporating portion (22) and a condensing portion (24) extending upwardly from the evaporating portion. The heat pipe is received in the groove so that the heat pipe absorbs heat via the evaporating portion and transfers the heat to the upper portion of the block via the condensing portion thereof.
    • 公开了一种用于从电子设备中去除热量的散热装置(1)。 散热装置包括散热器(30)和至少一个热管(20)。 散热器包括Y形导热体和从主体延伸的多个散热片(35)。 主体包括固体块(32)和两个延伸臂(34),该两个延伸臂从块的顶部沿相反的方向倾斜延伸。 U形槽(35)被限定在块中并延伸到块的上部(33)。 热管包括蒸发部分(22)和从蒸发部分向上延伸的冷凝部分(24)。 热管被容纳在槽中,使得热管经由蒸发部吸收热量,并且经由其冷凝部将热量传递到块的上部。
    • 4. 发明授权
    • Heat sink clip assembly
    • 散热片组件
    • US06307748B1
    • 2001-10-23
    • US09690108
    • 2000-10-16
    • Yeu-Lih LinAi-Min Huang
    • Yeu-Lih LinAi-Min Huang
    • H05K720
    • H01L23/4093H01L2924/0002Y10T24/42H01L2924/00
    • A clip assembly (30) includes a nail member (40), a sleeve member (60), and a spring (50) around the sleeve member. The nail member includes a cap (42), a post (44), a neck (46) and a cone-shaped barb (48). A pair of wedges (442) is formed on an outer surface of the post. The sleeve member is cylindrical. The sleeve member defines a central bore (62) for receiving the nail member, and a pair of rectangular slots (66) for receiving the wedges. A circumferential shoulder (68) is formed on the sleeve member, for abutting against a bottom surface of a heat sink. A lower portion (72) of the sleeve member defines cutouts (722), thereby also forming deformable fingers (723). The sleeve member is interposed between the heat sink and a PCB. The nail member is inserted down through the lower portion, and elastically expands the fingers of the sleeve member.
    • 夹子组件(30)包括指甲构件(40),套筒构件(60)和围绕套筒构件的弹簧(50)。 指甲构件包括盖(42),柱(44),颈部(46)和锥形倒钩(48)。 一对楔形物(442)形成在柱的外表面上。 套筒构件是圆柱形的。 套筒构件限定用于接收钉构件的中心孔(62)和用于容纳楔形物的一对矩形槽(66)。 周向肩部(68)形成在套筒构件上,用于抵靠散热器的底面。 套筒构件的下部(72)限定了切口(722),从而也形成可变形的指状物(723)。 套筒构件介于散热器和PCB之间。 指甲构件通过下部向下插入,并且弹性地膨胀套筒构件的指状物。
    • 6. 发明授权
    • Heat dissipating device
    • 散热装置
    • US07000687B2
    • 2006-02-21
    • US10893214
    • 2004-07-16
    • Guo-Liang YingAi-Min HuangShu-Ho Lin
    • Guo-Liang YingAi-Min HuangShu-Ho Lin
    • F28D15/00
    • F28D15/0233F28D15/0275F28D2021/0029H01L23/427H01L2924/0002H01L2924/00
    • A heat dissipating device (1) for removing heat from electronic devices is disclosed. The heat dissipating device includes a heat sink (30) and at least one heat pipe (20). The heat sink includes a Y-shaped heat conductive body and a plurality of fins (35) extending from the body. The body includes a solid block (32) and two extension arms (34) extending aslant from a top of the block in opposite directions. An U-shaped groove (35) is defined in the block and extends to an upper portion (33) of the block. The heat pipe comprises an evaporating portion (22) and a condensing portion (24) extending upwardly from the evaporating portion. The heat pipe is received in the groove so that the heat pipe absorbs heat via the evaporating portion and transfers the heat to the upper portion of the block via the condensing portion thereof.
    • 公开了一种用于从电子设备中去除热量的散热装置(1)。 散热装置包括散热器(30)和至少一个热管(20)。 散热器包括Y形导热体和从主体延伸的多个散热片(35)。 主体包括固体块(32)和两个延伸臂(34),该两个延伸臂从块的顶部沿相反的方向倾斜延伸。 U形槽(35)被限定在块中并延伸到块的上部(33)。 热管包括蒸发部分(22)和从蒸发部分向上延伸的冷凝部分(24)。 热管被容纳在槽中,使得热管经由蒸发部吸收热量,并且经由其冷凝部将热量传递到块的上部。
    • 7. 发明授权
    • Heat sink clip
    • 散热片夹
    • US06477048B2
    • 2002-11-05
    • US09738648
    • 2000-12-15
    • Ai-Min HuangHsieh Kun Lee
    • Ai-Min HuangHsieh Kun Lee
    • H05K720
    • H01L23/4093H01L2224/16
    • A heat sink clip (50) is formed from a single piece of resilient metal by stamping. The heat sink clip includes an operation portion (59), a pressing body (51), a first and second arms (54, 57) extending from the opposite ends of the pressing body. The first and second arms each defines an aperture (55, 58) for engaging with a catch (22) on a socket (20) on which an electronic device (30) is mounted. The pressing body presses a heat sink (40) onto the electronic device. The operation portion extends from an end of the pressing body for readily engaging/disengaging the clip.
    • 散热夹(50)由一块弹性金属通过冲压形成。 散热片夹包括操作部分(59),按压体(51),从按压体的相对端延伸的第一和第二臂(54,57)。 第一臂和第二臂各限定用于与安装有电子设备(30)的插座(20)上的卡扣(22)接合的孔(55,58)。 按压体将散热器(40)按压到电子设备上。 操作部分从按压体的端部延伸,以便容易地接合/脱开夹子。