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    • 2. 发明申请
    • CMOS COMPATIBLE MEMORY CELLS
    • CMOS兼容记忆体
    • US20160049403A1
    • 2016-02-18
    • US14459403
    • 2014-08-14
    • Gil ASA
    • Gil ASA
    • H01L27/092H01L27/11H01L29/10H01L29/06H01L21/265H01L21/8238
    • H01L27/1104G11C11/412H01L21/26513H01L27/0207H01L29/0653H01L29/1095
    • A memory cell and a process for production thereof, the memory cell having a CMOS substrate having two adjacent wells of opposite conductivity types, having trench isolation between the wells, wherein one of the wells is connected to a ground voltage level and the other one to a constant voltage level; a shallow lightly doped n layer in a first one of the wells; a shallow lightly doped p layer in a second one of the wells; at least a first and second deep heavily doped p regions in the first well; at least a first and second deep heavily doped n regions in the second well; and a conductor to connect the first and second deep p regions, the shallow n region, the first and second deep n regions and the shallow p region to the same input voltage level relative to the ground voltage level.
    • 一种存储单元及其制造方法,所述存储单元具有具有相反导电类型的两个相邻阱的CMOS衬底,在所述阱之间具有沟槽隔离,其中所述阱中的一个连接到接地电压电平, 恒定电压电平; 在第一个孔中的浅轻掺杂n层; 在第二个孔中的浅的轻掺杂p层; 第一阱中的至少第一和第二深重掺杂p区; 至少第二阱中的第一和第二深度重掺杂的n区; 以及用于将第一和第二深p区,浅n区,第一和第二深n区和浅p区连接到相对于接地电压电平相同输入电压电平的导体。
    • 4. 发明授权
    • Four-transistor and five-transistor BJT-CMOS asymmetric SRAM cells
    • 四晶体管和五晶体管BJT-CMOS非对称SRAM单元
    • US08837204B2
    • 2014-09-16
    • US13201461
    • 2010-02-15
    • Gil Asa
    • Gil Asa
    • G11C11/00
    • H01L21/8249G11C11/411G11C11/412H01L27/0623H01L27/0688H01L27/1025H01L27/11H03K3/288
    • A memory cell comprises asymmetric retention elements formed of bipolar junction transistors integrated with a CMOS transistor. The BJT transistors of the retention element may be vertically stacked. In one embodiment, the N region of two adjacent NPN BJT transistors may be connected to ground and may form a common emitter of the NPN BJT transistors while the P region of two adjacent PNP BJT transistors may be connected to high voltage and may form a common emitter of the PNP BJT transistors. For further compactness in one embodiment a base of one transistor doubles as a collector of another transistor. The retention element may have only a single bit line and a single write line, with no negative bit line. In some embodiments, a single inverter and only three transistors may form the retention element. Memory space may be cut approximately in half.
    • 存储单元包括由与CMOS晶体管集成的双极结型晶体管形成的不对称保留元件。 保持元件的BJT晶体管可以是垂直堆叠的。 在一个实施例中,两个相邻NPN BJT晶体管的N区可以连接到地,并且可以形成NPN BJT晶体管的公共发射极,而两个相邻的PNP BJT晶体管的P区可以连接到高电压并且可以形成公共 PNP BJT晶体管的发射极。 为了在一个实施例中进一步的紧凑性,一个晶体管的基极可兼作另一个晶体管的集电极。 保持元件可以仅具有单个位线和单个写入线,没有负位线。 在一些实施例中,单个逆变器和仅三个晶体管可以形成保持元件。 内存空间大约可以削减一半。
    • 6. 发明申请
    • Transistor Structure and Method of Manufacturing Thereof
    • 晶体管结构及其制造方法
    • US20070262377A1
    • 2007-11-15
    • US11667379
    • 2005-11-10
    • Gil Asa
    • Gil Asa
    • H01L29/78H01L21/336
    • H01L29/0847H01L29/66484H01L29/7831H01L29/7838H01L29/78648
    • Method of manufacturing and a transistor structure thereof comprising: a pair of spaced apart regions forming a source region and a drain region and defining at least part of a channel region there between, the source region and the drain region comprising a semiconductor heavily doped with n-type impurity element and said channel region comprising a semiconductor lightly doped with n-type impurity element; and a pair of gates each being insulated from the channel region by a respective gate insulating layer and being disposed substantially symmetrically along the channel region on opposite sides of thereof; whereby in use independent voltages may be applied to said gates so as to modify conductivity of the channel.
    • 制造方法及其晶体管结构包括:一对间隔开的区域,形成源极区域和漏极区域,并且在其间限定沟道区域的至少一部分,所述源极区域和漏极区域包括重掺杂有n 型杂质元素,所述沟道区包含轻掺杂n型杂质元素的半导体; 以及一对栅极,其各自通过相应的栅极绝缘层与沟道区域绝缘,并且沿着其相对侧上的沟道区域大致对称地设置; 由此在使用中可以将独立的电压施加到所述栅极,以便改变通道的电导率。
    • 7. 发明申请
    • FOUR-TRANSISTOR AND FIVE-TRANSISTOR BJT-CMOS ASYMMETRIC SRAM CELLS
    • 四晶体和五晶体BJT-CMOS不对称SRAM电池
    • US20110299327A1
    • 2011-12-08
    • US13201461
    • 2010-02-15
    • Gil Asa
    • Gil Asa
    • G11C11/34
    • H01L21/8249G11C11/411G11C11/412H01L27/0623H01L27/0688H01L27/1025H01L27/11H03K3/288
    • A memory cell comprises asymmetric retention elements formed of bipolar junction transistors integrated with a CMOS transistor. The BJT transistors of the retention element may be vertically stacked. In one embodiment, the N region of two adjacent NPN BJT transistors may be connected to ground and may form a common emitter of the NPN BJT transistors while the P region of two adjacent PNP BJT transistors may be connected to high voltage and may form a common emitter of the PNP BJT transistors. For further compactness in one embodiment a base of one transistor doubles as a collector of another transistor. The retention element may have only a single bit line and a single write line, with no negative bit line. In some embodiments, a single inverter and only three transistors may form the retention element. Memory space may be cut approximately in half.
    • 存储单元包括由与CMOS晶体管集成的双极结型晶体管形成的不对称保留元件。 保持元件的BJT晶体管可以是垂直堆叠的。 在一个实施例中,两个相邻NPN BJT晶体管的N区可以连接到地,并且可以形成NPN BJT晶体管的公共发射极,而两个相邻的PNP BJT晶体管的P区可以连接到高电压并且可以形成公共 PNP BJT晶体管的发射极。 为了在一个实施例中进一步的紧凑性,一个晶体管的基极可兼作另一个晶体管的集电极。 保持元件可以仅具有单个位线和单个写入线,没有负位线。 在一些实施例中,单个逆变器和仅三个晶体管可以形成保持元件。 内存空间大约可以削减一半。