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1. 发明申请

US20140034246A1 METHODS AND SYSTEM FOR PRODUCING ON-DEMAND REDUCTION IN COUPLING STRENGTH OF PRESSURE-SENSITIVE ADHESIVES 审中-公开
标题翻译：压力敏感粘合剂联合强度下生产减量的方法和系统
公开(公告)号：US20140034246A1
公开(公告)日：2014-02-06
申请号：US13979486
申请日：2012-01-12
申请人： George B. Kenney , Christian Pfeffer
发明人： George B. Kenney , Christian Pfeffer
IPC分类号： B32B43/00 , C09J7/02
CPC分类号： B32B43/006 , B32B2535/00 , B32B2556/00 , C09J5/00 , C09J7/38 , C09J2201/606 , C09J2205/302 , Y10T156/1121 , Y10T156/1922 , Y10T428/24777 , Y10T428/28
摘要： The systems and methods of the present disclosure relate to safely coupling and decoupling various solid objects with the use of pressure-sensitive adhesive. In particular, the disclosure relates to methods and systems for delivering vibrational energy to a pressure-sensitive coupled structure, sufficient to decrease coupling strength of the pressure-sensitive adhesive as well as to de couple or reposition the coupled objects.
摘要翻译：本公开的系统和方法涉及使用压敏粘合剂安全地耦合和去耦各种固体物体。特别地，本公开涉及用于将振动能量传递到压敏耦合结构的方法和系统，足以降低压敏粘合剂的耦合强度以及耦合或重新定位耦合的对象。

2. 发明授权

US07723154B1 Methods of forming zinc oxide based II-VI compound semiconductor layers with shallow acceptor conductivities 失效
标题翻译：形成具有浅受主电导率的氧化锌基II-VI化合物半导体层的方法
公开(公告)号：US07723154B1
公开(公告)日：2010-05-25
申请号：US11551058
申请日：2006-10-19
申请人： Bunmi T. Adekore , Jonathan M. Pierce , Robert F. Davis , George B. Kenney
发明人： Bunmi T. Adekore , Jonathan M. Pierce , Robert F. Davis , George B. Kenney
IPC分类号： H01L21/00
CPC分类号： H01L21/02565 , H01L21/0237 , H01L21/02554 , H01L21/02573 , H01L21/02579 , H01L21/02581 , H01L21/0262 , H01L21/425
摘要： A p-type ZnO-based II-VI compound semiconductor layer has silver, potassium and/or gold dopants therein at a net p-type dopant concentration of greater than about 1×1017 cm−3. A method of forming the layer includes using an atomic layer deposition (ALD) technique. This technique includes exposing a substrate to a combination of gases: a first reaction gas containing zinc at a concentration that is repeatedly transitioned between at least two concentration levels during a processing time interval, a second reaction gas containing oxygen and a p-type dopant gas containing at least one p-type dopant species selected from a group consisting of silver, potassium and gold. A concentration of oxygen in the second reaction gas may also be repeatedly transitioned between at least two concentration levels. The concentration of zinc in the first reaction gas and the concentration of oxygen in the second reaction gas may be transitioned in an alternating sequence, so that relatively high zinc concentrations in the first reaction gas overlap with relatively low oxygen concentrations in the second reaction gas and vice versa.
摘要翻译： p型ZnO基II-VI化合物半导体层在其中具有大于约1×1017cm-3的净p型掺杂剂浓度的银，钾和/或金掺杂剂。形成层的方法包括使用原子层沉积（ALD）技术。这种技术包括将基底暴露于气体组合中：在处理时间间隔内以至少两个浓度水平重复过渡浓度的锌的第一反应气体，含有氧的第二反应气体和p型掺杂气体含有选自银，钾和金的至少一种p型掺杂剂物质。第二反应气体中的氧浓度也可以在至少两个浓度水平之间重复地转变。第一反应气体中的锌的浓度和第二反应气体中的氧浓度可以以交替的顺序转变，使得第一反应气体中相对较高的锌浓度与第二反应气体中相对较低的氧浓度重叠，反之亦然。

3. 发明授权

US06624945B2 Thin film filters using omnidirectional reflectors 有权
公开(公告)号：US06624945B2
公开(公告)日：2003-09-23
申请号：US09781825
申请日：2001-02-12
申请人： Shanhui Fan , John D. Joannopoulos , George B. Kenney , Michal Lipson , Kevin M. Chen , Lionel C Kimerling
发明人： Shanhui Fan , John D. Joannopoulos , George B. Kenney , Michal Lipson , Kevin M. Chen , Lionel C Kimerling
IPC分类号： G02B2700
CPC分类号： G02B5/288 , G02B5/0833 , G02B26/001
摘要： An electromagnetic wavelength filter that allows the transmission of electromagnetic energy within a narrow range of wavelengths while reflecting incident electromagnetic energy at other wavelengths. The filter includes at least one cavity region; and at least two reflectors surrounding the at least one cavity region, at least one of the reflectors being an omni-directional reflector. The omni-directional reflector includes a structure with a surface and an index of refraction variation perpendicular to the surface, and the omni-directional reflector is specifically configured to exhibit high omni-directional reflection for a predetermined range of frequencies of incident electromagnetic energy for any angle of incidence and any polarization.

4. 发明授权

US4636339A Method for in-process multi-element analysis of molten metal and other liquid materials 失效
标题翻译：熔融金属和其他液体材料的进程中多元素分析方法
公开(公告)号：US4636339A
公开(公告)日：1987-01-13
申请号：US768493
申请日：1985-08-22
申请人： George B. Kenney
发明人： George B. Kenney
IPC分类号： G01N1/00 , G01N1/14 , G01N33/20 , B22F9/08
CPC分类号： G01N33/203 , G01N1/1409 , G01N1/22 , G01N2001/1463
摘要： A method for generating an aerosol powder from a melt includes an atomization die having an orifice through which the melt passes to create the powder. In a preferred embodiment, the orifice has a dimension less than 5 millimeters, and may include a heater to prevent freeze-off. The die may be included in a high-temperature probe suitable for immersion on the melt, so that accumulated accretions of powder on the walls of the probe may be melted off by heating the probe.
摘要翻译：从熔体产生气溶胶粉末的方法包括具有孔的雾化模具，熔体通过该孔口产生粉末。在优选实施例中，孔口具有小于5毫米的尺寸，并且可以包括加热器以防止冻结。模具可以包括在适于浸入熔体中的高温探针中，从而通过加热探针可以在探针壁上累积的粉末积聚。

5. 发明申请

US20100117070A1 TEXTURED SEMICONDUCTOR LIGHT-EMITTING DEVICES 审中-公开
标题翻译：纹理半导体发光器件
公开(公告)号：US20100117070A1
公开(公告)日：2010-05-13
申请号：US12562941
申请日：2009-09-18
申请人： Bunmi T. ADEKORE , Jonathan PIERCE , George B. KENNEY , Gianni TARASCHI
发明人： Bunmi T. ADEKORE , Jonathan PIERCE , George B. KENNEY , Gianni TARASCHI
IPC分类号： H01L33/00 , H01L21/34
CPC分类号： H01L21/02554 , H01L21/0237 , H01L21/02403 , H01L21/0243 , H01L21/02472 , H01L21/02483 , H01L21/02494 , H01L21/02565 , H01L21/02573 , H01L21/02587 , H01L21/02609 , H01L21/0262 , H01L33/22 , H01L33/24 , H01L33/28 , H01L33/385 , H01L33/405 , H01L33/483 , H01L33/60 , H01L33/62 , H01L2224/16
摘要： A light-emitting device, such as a light-emitting diode (LED), includes a substrate including a ZnO-based material, and a structure disposed on a first side of the substrate. The structure includes a plurality of semiconductor layers and an active layer disposed between the plurality of semiconductor layers. The device further includes at least one textured light emission surface arranged to extract at least some light generated within the device.
摘要翻译：诸如发光二极管（LED）的发光器件包括包括ZnO基材料的基板和设置在基板的第一侧上的结构。该结构包括多个半导体层和设置在多个半导体层之间的有源层。该装置还包括至少一个纹理光发射表面，布置成提取在该装置内产生的至少一些光。

6. 发明授权

US5834840A Net-shape ceramic processing for electronic devices and packages 失效
标题翻译：电子器件和封装的网状陶瓷加工
公开(公告)号：US5834840A
公开(公告)日：1998-11-10
申请号：US448725
申请日：1995-05-25
申请人： William L. Robbins , John S. Haggerty , Dennis D. Rathman , William D. Goodhue , George B. Kenney , Annamarie Lightfoot , R. Allen Murphy , Wendell E. Rhine , Julia Sigalovsky
发明人： William L. Robbins , John S. Haggerty , Dennis D. Rathman , William D. Goodhue , George B. Kenney , Annamarie Lightfoot , R. Allen Murphy , Wendell E. Rhine , Julia Sigalovsky
IPC分类号： H01L21/48 , H01L23/057 , H01L23/15 , H01L23/66 , H01L23/06 , H01L23/10
CPC分类号： H01L23/66 , H01L21/4807 , H01L21/4857 , H01L23/057 , H01L23/15 , H01L2224/32188 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/48472 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01012 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/04941 , H01L2924/09701 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13091 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/16195 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025
摘要： An electronic device package is provided, consisting of reaction bonded silicon nitride structural and dielectric components and conductor, resistor, and capacitor elements positioned with the package structural components. The package consists of a ceramic package base characterized by a dielectric constant less than 6, of reaction bonded silicon nitride, or a heat spreader material. An electrical conductor is positioned on, embedded in, or attached to the package base for making electrical contact to an electronic device supported on the base and in preferred embodiments, a resistor is attached to the package base. The invention also provides package sidewalls connected to the package base, preferably of reaction bonded silicon nitride, and at least one electrical conductor extending to an outside surface of the package sidewalls for making electrical contact to an electronic device supported by the package base. The reaction formed electronic device packages of the invention provide the ability to support high device signal frequencies, high device operational temperatures, and high environmental temperatures, due to the characteristics of the package materials. The reaction formed electronic device packages of the invention may be produced with a nitriding process during which the overall package structure exhibits minimal shrinkage. As a result, the reaction formed electronic device packages of the invention may be shaped to finished dimensions before the nitriding process with complicated and tight-tolerance geometries of package structural, conducting, resistive, and capacitive components.
摘要翻译：提供了一种电子器件封装，包括反应结合的氮化硅结构和电介质元件以及与封装结构元件定位的导体，电阻器和电容元件。封装由陶瓷封装基底组成，其特征在于介电常数小于6的反应结合氮化硅或散热器材料。电导体定位在，嵌入或附接到封装基座，用于与支撑在基座上的电子设备进行电接触，并且在优选实施例中，电阻器附接到封装基座。本发明还提供了连接到封装基部，优选反应结合的氮化硅的封装侧壁，以及延伸到封装侧壁的外表面的至少一个电导体，用于与由封装基座支撑的电子器件进行电接触。由于封装材料的特性，本发明的反应形成的电子器件封装提供了支持高器件信号频率，高器件工作温度和高环境温度的能力。本发明的反应形成的电子器件封装可以通过氮化工艺制造，在整个封装结构期间，整个封装结构显示最小的收缩。结果，本发明的反应形成的电子器件封装可以在氮化工艺之前成形为具有封装结构，导电，电阻和电容元件的复杂和紧密公差几何形状的成品尺寸。

7. 发明授权

US5801073A Net-shape ceramic processing for electronic devices and packages 失效
标题翻译：电子器件和封装的网状陶瓷加工
公开(公告)号：US5801073A
公开(公告)日：1998-09-01
申请号：US450692
申请日：1995-05-25
申请人： William L. Robbins , John S. Haggerty , Dennis D. Rathman , William D. Goodhue , George B. Kenney , Annamarie Lightfoot , R. Allen Murphy , Wendell E. Rhine , Julia Sigalovsky
发明人： William L. Robbins , John S. Haggerty , Dennis D. Rathman , William D. Goodhue , George B. Kenney , Annamarie Lightfoot , R. Allen Murphy , Wendell E. Rhine , Julia Sigalovsky
IPC分类号： H01L21/50 , H01L23/057 , H01L23/13 , H01L21/60
CPC分类号： H01L21/50 , H01L23/057 , H01L23/13 , H01L2224/05624 , H01L2224/32188 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48624 , H01L2224/48724 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/04941 , H01L2924/09701 , H01L2924/12032 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025
摘要： A method of producing electronic device packages is provided, consisting of the steps of shaping a package preform and heating the package preform in a nitrogen-containing atmoshpere to nitride the package preform. The shaped package preform may consist of package base, sidewall, conductor, resistor, or capacitor components. The package base and sidewall components may be formed of silicon powder. The method also accommodates the step of inserting a semiconducting material into the package preform and heating the semiconducting material component along with the package preform. The inserted semiconducting material component may be processed to define active electronic device areas on the component either before or after the step of heating the shaped package preform and inserted semiconducting material component. The package production methods of the invention provide the ability to produce reaction bonded structural and dielectric package components by way of a nitriding process that causes minimal overall shrinkage of the package. As a result, reaction formed electronic device packages of the invention may be shaped to finished dimensions before the nitriding process with complicated and tight-tolerance geometries of package structural, conducting, resistive, and capacitive components. The package production methods of the invention also provide the ability to interleave electronic device and packaging manufacturing sequence steps, resulting in increased manufacturing efficiency, as well as improved performance in the devices and packages produced. Device substrates or partially fabricated devices may be embedded into semi-finished packages, whereby completion of device fabrication coincides with completion of package fabrication. This makes possible the fabrication of active devices and circuits in a fully packaged environment.
摘要翻译：提供了一种制造电子器件封装的方法，其包括以下步骤：将包装预制件成形并在含氮大气中加热包装预制件以氮化包装预制件。成形包装预制件可以由封装基座，侧壁，导体，电阻器或电容器部件组成。封装基部和侧壁部件可以由硅粉末形成。该方法还适应于将半导体材料插入封装预制件中并与封装预制件一起加热半导体材料部件的步骤。可以在加热成形包装预制件和插入的半导体材料部件的步骤之前或之后，处理插入的半导体材料部件以在部件上限定有源电子器件区域。本发明的包装生产方法提供了通过氮化过程产生反应结合的结构和介电包装组分的能力，其导致包装的最小总收缩。结果，本发明的反应形成的电子器件封装可以在氮化处理之前被成形为成品尺寸，其具有封装结构，导电，电阻和电容元件的复杂且严格的公差几何形状。本发明的封装制造方法还提供了交错电子器件和封装制造顺序步骤的能力，从而提高制造效率，以及在所生产的器件和封装中提高性能。器件衬底或部分制造的器件可以嵌入半成品封装中，由此器件制造的完成与封装制造的完成一致。这使得可以在完全封装的环境中制造有源器件和电路。

8. 发明授权

US5024695A Fine hollow particles of metals and metal alloys and their production 失效
标题翻译：精细的金属和金属合金的中空颗粒及其生产
公开(公告)号：US5024695A
公开(公告)日：1991-06-18
申请号：US263048
申请日：1988-10-26
申请人： Charles P. Ashdown , James G. Bewley , George B. Kenney
发明人： Charles P. Ashdown , James G. Bewley , George B. Kenney
IPC分类号： B22F9/08
CPC分类号： B22F9/082
摘要： Soluble gas is introduced in a melt material which is then atomized and rapidly cooled. The cooling drives the gas from solution, further disintegrating the atomized material to an ultra-fine powder. In one embodiment the atomization and rapid cooling are effected using a gas atomization die. Introduction of the soluble gas may be effected by addition of reactive constituents to the melt, for reactively forming such gas. Finer powders with desirable metallurgical properties are formed using a metallic melt.
摘要翻译：将可溶性气体引入熔融材料中，然后将其雾化并快速冷却。冷却驱动溶液中的气体，进一步将雾化的材料分解成超细粉末。在一个实施方案中，使用气体雾化模具实现雾化和快速冷却。可溶性气体的引入可以通过向熔体中加入反应性组分来进行反应，形成这种气体。使用金属熔体形成具有期望的冶金特性的更细的粉末。

9. 发明授权

US4578022A Apparatus for in-process multi-element analysis of molten metal and other liquid materials 失效
标题翻译：用于熔融金属和其他液体材料的在线多元素分析的设备
公开(公告)号：US4578022A
公开(公告)日：1986-03-25
申请号：US522913
申请日：1983-08-12
申请人： George B. Kenney
发明人： George B. Kenney
IPC分类号： G01N1/00 , G01N1/14 , G01N33/20 , B22F9/00
CPC分类号： G01N33/203 , G01N1/1409 , G01N1/22 , G01N2001/1463
摘要： An apparatus for generating an aerosol powder from a melt includes an atomization die having an orifice through which the melt passes to create the powder. In a preferred embodiment, the orifice has a dimension less than 5 millimeters, and may include a heater to prevent freeze-off. The die may be included in a high-temperature probe suitable for immersion in the melt, so that accumulated accretions of powder on the walls of the probe may be melted off by heating the probe.
摘要翻译：用于从熔体产生气溶胶粉末的装置包括具有孔的雾化模具，熔体通过所述孔口产生粉末。在优选实施例中，孔口具有小于5毫米的尺寸，并且可以包括加热器以防止冻结。模具可以包括在适于浸入熔体中的高温探针中，从而通过加热探针可以在探针的壁上累积的粉末积聚。

10. 发明申请

US20120203200A1 DEVICE AND METHOD FOR DELIVERING MEDICINE INTO THE TYMPANIC CAVITY 审中-公开
标题翻译：用于将药物递送到典型空气中的装置和方法
公开(公告)号：US20120203200A1
公开(公告)日：2012-08-09
申请号：US13501073
申请日：2010-10-13
申请人： George B. Kenney , Christian Pfeffer , Lev Rosenblum
发明人： George B. Kenney , Christian Pfeffer , Lev Rosenblum
IPC分类号： A61M5/00 , A61M5/32
CPC分类号： A61M1/0066 , A61M3/0258 , A61M2210/0668
摘要： A device for substance delivery to and/or extraction from the tympanic cavity, comprising: a housing, having a distal surface, a proximal surface that is opposite to the distal surface, and a circumscribed surface that connects the distal surface and the proximal surface; at least one piercing element having at least one proximal piercing end and at least one distal piercing end, disposed within the housing in such manner that the at least one distal piercing end is/are generally facing the distal surface of the housing; and a means for flexing the tympanic membrane toward the distal end of the at least one piercing element.
摘要翻译：一种用于物质输送到和/或从鼓室抽出的装置，包括：具有远端表面的外壳，与远端表面相对的近端表面和连接远端表面和近端表面的外接表面; 至少一个刺穿元件具有至少一个近端刺穿端和至少一个远端刺穿端，所述至少一个远端刺穿端以这样的方式设置在所述壳体内，使得所述至少一个远端穿刺端部大致面向所述壳体的远端表面; 以及用于使鼓膜朝向至少一个刺穿元件的远端弯曲的装置。

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