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1. 外观设计

USD445667S1 Hitch lock 失效
标题翻译：挂钩锁
公开(公告)号：USD445667S1
公开(公告)日：2001-07-31
申请号：US29124273
申请日：2000-06-02
申请人： Gary C. Johnson
设计人： Gary C. Johnson

2. 发明授权

US4974582A Acupressure pad 失效
标题翻译：指压垫
公开(公告)号：US4974582A
公开(公告)日：1990-12-04
申请号：US425105
申请日：1989-10-20
申请人： Gary C. Johnson
发明人： Gary C. Johnson
IPC分类号： A61H7/00 , A61H39/04
CPC分类号： A61H39/04 , A61H2201/1284 , A61H7/001
摘要： A pad on which a user lies to apply pressure to selected points on the body consists of two fabric panels and a number of balls having fabric engaging tabs at diametrically opposed points. The balls are placed on one of the panels at the points of desired pressure application and then covered by the second panel. The two panels may be connected together and carry grid markings to assist in positioning of the balls.
摘要翻译：用户所在的衬垫，其上施加压力到身体上的选定点，由两个织物面板和多个具有在直径相对的点处具有织物接合片的球组成。将球以所需的压力施加点放置在一个面板上，然后被第二面板覆盖。两个面板可以连接在一起并带有网格标记以协助球的定位。

3. 发明授权

US4113299A Rotating magnus tubes 失效
标题翻译：旋转磁钢管
公开(公告)号：US4113299A
公开(公告)日：1978-09-12
申请号：US729195
申请日：1976-10-04
申请人： David W. Johnson , Gary C. Johnson
发明人： David W. Johnson , Gary C. Johnson
IPC分类号： B62D35/00 , B62D53/06
CPC分类号： B62D35/001 , B62D53/06
摘要： The invention comprises magnus tubes mounted adjacent to or imbedded in the orthogonal edges of a vehicle such as a semi-trailer, these tubes preferably being interengaged, for concomitant rotation and having a motive force such as a motor to simultaneously drive the tubes to expedite laminar flow of air around the edges of the wall in question as the vehicle moves, it being preferred that the motive force be reversible to invest the magnus tube with an additional braking force.

4. 发明申请

US20150243588A1 MULTIPLE DIE LEAD FRAME 有权
标题翻译：多功能铅笔框架
公开(公告)号：US20150243588A1
公开(公告)日：2015-08-27
申请号：US14189609
申请日：2014-02-25
申请人： William E. Edwards , Gary C. Johnson
发明人： William E. Edwards , Gary C. Johnson
IPC分类号： H01L23/495
CPC分类号： H01L25/50 , H01L21/4825 , H01L21/4842 , H01L21/565 , H01L23/49503 , H01L23/49541 , H01L23/49575 , H01L2224/05554 , H01L2224/48247
摘要： An electronic apparatus includes a packaging enclosure, first and second die pads disposed within the packaging enclosure, first and second semiconductor die disposed on the first and second die pads, respectively, a plurality of packaging leads, each packaging lead projecting outward from the packaging enclosure, a plurality of packaging posts disposed within the packaging enclosure and extending inward from opposite sides of the packaging enclosure between the first and second die pads, each packaging post being connected with a respective one of the plurality of packaging leads, and a plurality of wire bonds disposed within the packaging enclosure. Each packaging post of the plurality of packaging posts is connected via a first wire bond of the plurality of wire bonds to the first semiconductor die and via a second wire bond of the plurality of wire bonds to the second semiconductor die. The plurality of packaging posts includes first and second sets of packaging posts extending inward from first and second opposite sides of the packaging enclosure, respectively.
摘要翻译：一种电子设备，包括：封装壳体，设置在封装壳体内的第一和第二裸片焊盘，分别设置在第一和第二裸片焊盘上的第一和第二半导体管芯，多个封装引线，每个封装引线从封装外壳向外突出，多个包装柱，其设置在所述包装外壳内并且在所述第一和第二管芯焊盘之间从所述封装外壳的相对侧向内延伸，每个封装柱与所述多个封装引线中的相应一个连接，封装在封装外壳内。多个封装柱的每个封装柱通过多个引线键合的第一引线键合连接到第一半导体管芯，并且经由多个引线键合的第二引线键连接到第二半导体管芯。多个包装柱包括分别从包装外壳的第一和第二相对侧向内延伸的第一组和第二组包装柱。

5. 发明授权

US5969461A Surface acoustic wave device package and method 失效
标题翻译：声表面波器件封装及方法
公开(公告)号：US5969461A
公开(公告)日：1999-10-19
申请号：US057144
申请日：1998-04-08
申请人： Michael J. Anderson , Gregory Kennison , Jeffrey E. Christensen , Gary C. Johnson , Jon G. Aday
发明人： Michael J. Anderson , Gregory Kennison , Jeffrey E. Christensen , Gary C. Johnson , Jon G. Aday
IPC分类号： H01L23/28 , H01L21/56 , H01L21/60 , H03H3/08 , H03H9/05 , H03H9/25 , H01L41/08
CPC分类号： H03H9/059 , H01L24/32 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83051 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , Y10T29/49146
摘要： A method for packaging an acoustic wave device (10) without contaminating an active area (12) disposed on a face (14) thereof, including steps of: providing a substrate with a top (30) having conductive pads (18), bonding stud bumps (20) to a periphery (22) of the face (14) of the acoustic wave device, disposing a dam (26) onto the top (30) of the substrate and inside of the location of the conductive pads (18), aligning and connecting the stud bumps (20) to the conductive pads (18) on the top of the substrate to form electrically conductive interconnections between the acoustic wave device (10) and the substrate (16), flowing an underfill material (28) at the periphery (22) of the acoustic wave device and around the interconnections such that the underfill material (28) stops at a boundary (32) defined by the dam (26), and curing the underfill material (28) to mechanically reinforce and protectively encapsulate the interconnections.
摘要翻译：一种用于封装声波装置（10）而不污染设置在其表面（14）上的有源区域（12）的方法，包括以下步骤：为基板提供具有导电焊盘（18）的顶部（30），接合螺柱将突起（20）连接到声波装置的面（14）的周边（22），将堤（26）设置在基板的顶部（30）上并且在导电垫（18）的位置的内部，将凸块（20）对准并连接到衬底的顶部上的导电焊盘（18），以在声波器件（10）和衬底（16）之间形成导电互连，使底部填充材料（28）在声波装置的周边（22）和互连周围，使得底部填充材料（28）在由坝（26）限定的边界（32）处停止，并且固化底部填充材料（28）以机械加强和保护封装互连。

6. 发明授权

US5025603A Modular space dividing panels having wire management channels 失效
标题翻译：具有电线管理通道的模块化空间分隔板
公开(公告)号：US5025603A
公开(公告)日：1991-06-25
申请号：US504588
申请日：1990-04-04
申请人： Gary C. Johnson
发明人： Gary C. Johnson
IPC分类号： E04B2/74 , E04C2/52
CPC分类号： H02G3/288 , E04B2/7425 , E04C2/521 , E04B2002/7488
摘要： A modular space dividing panel comprising a pair of panlike frames. Each frame has a side wall with inwardly directed flanges at the edges thereof which form a bottom wall, a pair of end edge walls, and a top wall. The frames are positioned and assembled together in facing relationship such that at least portions of the bottom walls, the end edge walls, and the top walls overlap in contacting relationship. The top walls include portions that define therebetween a substantially continuous channel that extends along an upper edge of the panel. The channel is of a size to receive communication and/or electrical wiring therein. A top cap extends along the upper edge of the panel and overlying the channel and is releasably secured to the top walls of the frames.
摘要翻译：一种模块化空间分隔板，包括一对盘状框架。每个框架具有在其边缘处具有向内指向的凸缘的侧壁，其形成底壁，一对端边缘壁和顶壁。框架以面对的关系定位和组装在一起，使得底壁，端边缘壁和顶壁的至少一部分以接触关系重叠。顶壁包括在其间限定沿着面板的上边缘延伸的基本上连续的通道的部分。该通道具有在其中接收通信和/或电线的尺寸。顶盖沿着面板的上边缘延伸并且覆盖通道并且可释放地固定到框架的顶壁。

7. 发明授权

US09397082B2 Multiple die lead frame packaging 有权
标题翻译：多芯引线框架包装
公开(公告)号：US09397082B2
公开(公告)日：2016-07-19
申请号：US14990468
申请日：2016-01-07
申请人： William E. Edwards , Gary C. Johnson
发明人： William E. Edwards , Gary C. Johnson
IPC分类号： H01L21/44 , H01L25/00 , H01L21/48 , H01L21/56
CPC分类号： H01L25/50 , H01L21/4825 , H01L21/4842 , H01L21/565 , H01L23/49503 , H01L23/49541 , H01L23/49575 , H01L2224/05554 , H01L2224/48247
摘要： First and second semiconductor die are mounted to first and second die pads of a lead frame disposed in a lead frame sheet. With a plurality of wire bonds, each post of a plurality of posts of the lead frame is connected to the first and second semiconductor die. Each post extends inward from opposite sides of the lead frame between the first and second die pads and is connected with a respective one of a plurality of leads of the lead frame. The first and second semiconductor die, the plurality of posts of the lead frame, and the plurality of wire bonds are encapsulated in a package. The lead frame sheet is sheared to define each lead of the plurality of leads. The plurality of posts includes first and second sets of posts extending inward from first and second opposite sides of the lead frame.
摘要翻译：第一和第二半导体管芯被安装到设置在引线框架片材中的引线框架的第一和第二管芯焊盘。利用多个引线接合，引线框架的多个柱的每个柱连接到第一和第二半导体管芯。每个柱从第一和第二管芯焊盘之间的引线框架的相对侧向内延伸并且与引线框架的多个引线中的相应一个引线连接。第一和第二半导体管芯，引线框架的多个柱和多个引线接合被封装在封装中。剪切引线框架片以限定多个引线中的每个引线。多个柱包括从引线框架的第一和第二相对侧向内延伸的第一和第二组柱。

8. 发明授权

US09236331B2 Multiple die lead frame 有权
标题翻译：多芯引线框架
公开(公告)号：US09236331B2
公开(公告)日：2016-01-12
申请号：US14189609
申请日：2014-02-25
申请人： William E. Edwards , Gary C. Johnson
发明人： William E. Edwards , Gary C. Johnson
IPC分类号： H01L23/04 , H01L23/495
CPC分类号： H01L25/50 , H01L21/4825 , H01L21/4842 , H01L21/565 , H01L23/49503 , H01L23/49541 , H01L23/49575 , H01L2224/05554 , H01L2224/48247
摘要： An electronic apparatus includes a packaging enclosure, first and second die pads disposed within the packaging enclosure, first and second semiconductor die disposed on the first and second die pads, respectively, a plurality of packaging leads, each packaging lead projecting outward from the packaging enclosure, a plurality of packaging posts disposed within the packaging enclosure and extending inward from opposite sides of the packaging enclosure between the first and second die pads, each packaging post being connected with a respective one of the plurality of packaging leads, and a plurality of wire bonds disposed within the packaging enclosure. Each packaging post of the plurality of packaging posts is connected via a first wire bond of the plurality of wire bonds to the first semiconductor die and via a second wire bond of the plurality of wire bonds to the second semiconductor die. The plurality of packaging posts includes first and second sets of packaging posts extending inward from first and second opposite sides of the packaging enclosure, respectively.
摘要翻译：一种电子设备，包括：封装壳体，设置在封装壳体内的第一和第二裸片焊盘，分别设置在第一和第二裸片焊盘上的第一和第二半导体管芯，多个封装引线，每个封装引线从封装外壳向外突出，多个包装柱，其设置在所述包装外壳内并且在所述第一和第二管芯焊盘之间从所述封装外壳的相对侧向内延伸，每个封装柱与所述多个封装引线中的相应一个连接，封装在封装外壳内。多个封装柱的每个封装柱通过多个引线键合的第一引线键合连接到第一半导体管芯，并且经由多个引线键合的第二引线键连接到第二半导体管芯。多个包装柱包括分别从包装外壳的第一和第二相对侧向内延伸的第一组和第二组包装柱。

9. 发明授权

US06763826B1 Solar water heater 失效
标题翻译：太阳能热水器
公开(公告)号：US06763826B1
公开(公告)日：2004-07-20
申请号：US09836574
申请日：2001-04-16
申请人： Robert Gumm , Gary C. Johnson
发明人： Robert Gumm , Gary C. Johnson
IPC分类号： F24J240
CPC分类号： F24S23/31 , F24S10/30 , F24S10/742 , F24S40/53 , F24S2025/011 , Y02E10/43 , Y02E10/44 , Y10S126/909
摘要： A solar water heater is provided. The heater features heat control so that a maximum temperature is automatically controlled. The heater is insulated to maintain a water temperature of water stored therein for long periods of time. The heater includes an insulated lens which transmits most solar radiation incident on its top surface through the lens. An air trap is located below the lens. A heat control valve opens the air trap to surrounding air when a maximum temperature for air within the air trap is exceeded. A heat absorption plate is located below the air trap. The plate is in contact with a heat transfer liquid within a liquid space below the plate. A heat exchanger is positioned within the space and routes water in heat transfer contact with the liquid within the space, while keeping the water isolated from the liquid within the space.
摘要翻译：提供太阳能热水器。加热器具有热控制，从而自动控制最高温度。加热器是绝缘的，以保持长时间储存在其中的水的水温。加热器包括绝缘透镜，其透射通过透镜入射在其顶表面上的大部分太阳辐射。透镜下方有一个空气阱。当超过空气阱中的空气的最高温度时，热控制阀将空气阱打开到周围的空气。吸热板位于空气阱下方。该板与板下方的液体空间内的传热液接触。热交换器被定位在该空间内，并将水与空间内的液体传热接触，同时保持水与空间内的液体隔离。

10. 发明申请

US20160118373A1 MULTIPLE DIE LEAD FRAME PACKAGING 有权
标题翻译：多重导管框架包装
公开(公告)号：US20160118373A1
公开(公告)日：2016-04-28
申请号：US14990468
申请日：2016-01-07
申请人： William E. Edwards , Gary C. Johnson
发明人： William E. Edwards , Gary C. Johnson
IPC分类号： H01L25/00 , H01L21/56 , H01L21/48
CPC分类号： H01L25/50 , H01L21/4825 , H01L21/4842 , H01L21/565 , H01L23/49503 , H01L23/49541 , H01L23/49575 , H01L2224/05554 , H01L2224/48247
摘要： First and second semiconductor die are mounted to first and second die pads of a lead frame disposed in a lead frame sheet. With a plurality of wire bonds, each post of a plurality of posts of the lead frame is connected to the first and second semiconductor die. Each post extends inward from opposite sides of the lead frame between the first and second die pads and is connected with a respective one of a plurality of leads of the lead frame. The first and second semiconductor die, the plurality of posts of the lead frame, and the plurality of wire bonds are encapsulated in a package. The lead frame sheet is sheared to define each lead of the plurality of leads. The plurality of posts includes first and second sets of posts extending inward from first and second opposite sides of the lead frame.
摘要翻译：第一和第二半导体管芯被安装到设置在引线框架片材中的引线框架的第一和第二管芯焊盘。利用多个引线接合，引线框架的多个柱的每个柱连接到第一和第二半导体管芯。每个柱从第一和第二管芯焊盘之间的引线框架的相对侧向内延伸并且与引线框架的多个引线中的相应一个引线连接。第一和第二半导体管芯，引线框架的多个柱和多个引线接合被封装在封装中。剪切引线框架片以限定多个引线中的每个引线。多个柱包括从引线框架的第一和第二相对侧向内延伸的第一和第二组柱。

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