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1. 发明授权

US06853870B2 Semiconductor processing process control system and its control method 失效
标题翻译：半导体加工过程控制系统及其控制方法
公开(公告)号：US06853870B2
公开(公告)日：2005-02-08
申请号：US10815657
申请日：2004-04-02
申请人： Shoichi Harakawa , Makoto Ikeda , Etsuo Fukuda
发明人： Shoichi Harakawa , Makoto Ikeda , Etsuo Fukuda
IPC分类号： G05B15/02 , G05B19/418 , G06F17/00 , H01L21/00 , H01L21/02 , H01L21/205 , H01L21/302 , H01L21/3065 , G06F19/00
CPC分类号： G05B19/41865 , G05B2219/32074 , G05B2219/32196 , G05B2219/32297 , G05B2219/45031 , Y02P90/20 , Y02P90/22
摘要： A semiconductor processing process control system comprising a skip judgment request receiving section for receiving a request for judgment as to whether a process can be skipped or not. A skip judgment yes/no section searches for a judgment plug-in corresponding to the process to be skipped and a judgment execute section activates the judgment plug-in to make a judgment as to whether the process can be skipped or not on the basis of skip judgment logic in the plug-in. A skip execute section effects skipping of the process if the judgment determines that the process can be skipped.
摘要翻译：一种半导体处理过程控制系统，包括跳过判断请求接收部分，用于接收关于是否可以跳过处理的判断请求。跳过判断是/否部分搜索与要跳过的过程相对应的判断插件，并且判断执行部分激活判断插件以基于是否可以跳过该过程来判断该过程是否可以被跳过跳过插件中的判断逻辑。如果判断确定可以跳过该过程，则跳过执行部分将跳过该过程。

2. 发明授权

US06546300B1 Production/manufacturing planning system 失效
标题翻译：生产/制造规划体系
公开(公告)号：US06546300B1
公开(公告)日：2003-04-08
申请号：US09455380
申请日：1999-12-06
申请人： Etsuo Fukuda , Shinichi Hohkibara
发明人： Etsuo Fukuda , Shinichi Hohkibara
IPC分类号： G06F1900
CPC分类号： G06Q10/06 , Y02P90/20
摘要： A production/manufacturing planning system is provided with a production planning planner 10 and a manufacturing planning scheduler 12. The production planning planner 10 makes the production planning for the whole factory, and the manufacturing planing sheduler 12 makes the manufacturing planning schedule for each of manufacturing lines on the basis of the production planning for the whole factory. Thus, it is possible to more precisely make the production planning and manufacturing planning than that in conventional systems.
摘要翻译：生产/制造规划系统具有生产计划规划者10和制造计划调度器12.生产计划规划者10对整个工厂进行生产计划，并且制造计划调度器12制定每个制造的制造计划表在整个工厂的生产计划的基础上。因此，与传统系统相比，可以更精确地制造生产计划和制造规划。

3. 发明授权

US06438436B1 Production scheduling management system, and method of managing production scheduling 失效
标题翻译：生产调度管理系统，生产调度管理方法
公开(公告)号：US06438436B1
公开(公告)日：2002-08-20
申请号：US09250388
申请日：1999-02-16
申请人： Shinichi Hohkibara , Etsuo Fukuda , Hiroshi Nanami
发明人： Shinichi Hohkibara , Etsuo Fukuda , Hiroshi Nanami
IPC分类号： G06F1900
CPC分类号： G06Q10/06 , Y02P90/20 , Y02P90/86
摘要： A production scheduling management system includes: a long-range production scheduling unit that receives long-range production scheduling information including at least information on a delivery date of each lot, produces a lot processing schedule based on the delivery date of each lot, and outputs a long-range production schedule; a short-range production scheduling unit that receives the long-range production schedule and short-range production scheduling information, produces a short-range schedule of lot processing so as to fulfill the long-range production schedule, and outputs a short-range production schedule; and a work scheduling unit that receives the short-range production schedule and work scheduling information, produces a work schedule so as to fulfill the short-range production schedule, while taking account of conditions of each machine and conditions of each lot, and generates work schedule.
摘要翻译：生产调度管理系统包括：远程生产调度单元，其接收至少包括关于各批次的交货日的信息的长程生产调度信息，根据各批次的交货日期生成批次处理进度，并输出远程生产计划; 接收远程生产计划和短距离生产调度信息的短距离生产调度单元产生批量处理的短期进度表，以满足远程生产进度，并输出短距离生产时间表; 以及接收短程生产计划和工作调度信息的工作调度单元，同时考虑到每个机器的条件和每个批次的条件，产生工作进度以满足短距离生产计划，并且生成工作时间表。

4. 发明授权

US5408858A Bending machine utilizing controlled expandable pressure device to apply uniform pressure to work material 失效
标题翻译：弯曲机利用受控的可膨胀压力装置对工作材料施加均匀的压力
公开(公告)号：US5408858A
公开(公告)日：1995-04-25
申请号：US185395
申请日：1994-01-24
申请人： Etsuo Fukuda
发明人： Etsuo Fukuda
IPC分类号： B21D5/02 , B21D5/01
CPC分类号： B21D5/0272 , B21D5/0209
摘要： A bending machine having an upper punch containing portion, or beam, and a lower die containing portion, or beam, is modified by incorporating a controlled expandable pressure device whereby the pressure applied to a work material is uniformly distributed throughout the surface of the material. In a first embodiment, the device is mounted in the upper and lower machine portions; in a second embodiment, the device is mounted only in the upper machine portion; in a third embodiment, the device is mounted only in the lower machine portion; and in a fourth embodiment, segmented devices are mounted in the upper machine portion and a single, elongated device is mounted in the lower machine portion.
摘要翻译：具有上部冲头容纳部分或梁的弯曲机，以及下模具容纳部分或梁，通过结合受控的可膨胀压力装置来改变，由此施加到工件材料的压力均匀地分布在材料的整个表面上。在第一实施例中，装置安装在上部和下部机器部分中; 在第二实施例中，装置仅安装在上部机器部分中; 在第三实施例中，装置仅安装在下部机器部分中; 并且在第四实施例中，分段装置安装在上部机器部分中，并且单个细长装置安装在下部机器部分中。

5. 发明授权

US5365766A Die assembly having means for automatically controlling in the angular orientation of the lower die plate members 失效
标题翻译：模具组件具有用于以下模板构件的角度定向自动控制的装置
公开(公告)号：US5365766A
公开(公告)日：1994-11-22
申请号：US62759
申请日：1993-05-18
申请人： Yukio Takahashi , Etsuo Fukuda
发明人： Yukio Takahashi , Etsuo Fukuda
IPC分类号： B21D5/02 , B21D5/01
CPC分类号： B21D5/0209 , B21D5/0263
摘要： A die assembly for use with a tool for bending flat metal stock, and including a pair of elongated plate members in the lower die member each having a surface to support a piece of flat metal stock, the plate members being pivotably connected and maintained approximately 180 degrees apart when a bending force is not applied to the metal stock. A surface of an expandable pressure container is positioned in contact with a plate support member, the pressure within the container being controlled in a manner such that the vertical position of the plate support member is fixed such that the plate members assume a selected angular orientation to enable the tool to form the desired bend in the metal stock.
摘要翻译：一种与用于弯曲扁平金属原料的工具一起使用的模具组件，并且在下模具构件中包括一对细长板构件，每个细长板构件具有用于支撑一片扁平金属坯料的表面，该板构件可枢转地连接并保持在约180° 当不向金属原料施加弯曲力时分开。可膨胀压力容器的表面被定位成与板支撑构件接触，容器内的压力被控制成使得板支撑构件的垂直位置被固定，使得板构件呈现出选定的角度定向使工具能够在金属原料中形成所需的弯曲部分。

6. 发明授权

US06745094B1 Semiconductor processing process control system and its control method 有权
公开(公告)号：US06745094B1
公开(公告)日：2004-06-01
申请号：US09606173
申请日：2000-06-29
申请人： Shoichi Harakawa , Makoto Ikeda , Etsuo Fukuda
发明人： Shoichi Harakawa , Makoto Ikeda , Etsuo Fukuda
IPC分类号： G06F1900
CPC分类号： G05B19/41865 , G05B2219/32074 , G05B2219/32196 , G05B2219/32297 , G05B2219/45031 , Y02P90/20 , Y02P90/22
摘要： A semiconductor processing process control system includes a process controller main body (100) for controlling processes for semiconductor processing independently from semiconductor processing devices and contents of intended processing, and a control variable computation programs (210) for obtaining control conditions for semiconductor processing adaptive to semiconductor processing devices and contents of intended processing. The control variable computation programs (210) are used by plugging necessary one of them into the process controller main body (100). When there is any change in semiconductor processing device and content of processing, the system can cope with such changes by merely modifying the control variable computation programs (210). Therefore, the system flexibly, quickly copes with changes in process for processing, computing method of control variables and processing device.

7. 发明授权

US06463350B2 Production system for manufacturing semiconductor devices by lot 失效
标题翻译：制造半导体器件的生产系统
公开(公告)号：US06463350B2
公开(公告)日：2002-10-08
申请号：US09084308
申请日：1998-05-26
申请人： Etsuo Fukuda , Hiroshi Nanami , Hidehiro Okutani
发明人： Etsuo Fukuda , Hiroshi Nanami , Hidehiro Okutani
IPC分类号： G06F1900
CPC分类号： G05B23/0267 , G05B15/02
摘要： A production system has a plurality of production apparatuses, a conveyer which conveys to each production apparatus at each lot, a lot management computer which controls the degree of progress of the production process in each lot, apparatus management computers which control each of production apparatuses, and an intensive management computer which detects the degree of progress of the production process in each lot and operating state of each production apparatus. User interface sections are connected to the apparatus management computer and the intensive management computer, respectively. The user interface sections comprise display apparatuses, respectively. In the screen of the display apparatuses, operating state of each production apparatus and the degree of progress of the production process of the lot in each production apparatus are displayed. In the screen of the display apparatus of the user interface section, operating state of the corresponding production apparatus and the degree of progress of the production process of the lot in the corresponding production apparatus is displayed.
摘要翻译：一种生产系统具有多个生产装置，一个传送给每个批次的每个生产装置的输送机，一个控制各批次生产过程进度的批量管理计算机，控制每个生产装置的装置管理计算机，以及密集管理计算机，其检测每个批次中的生产过程的进度和每个生产设备的操作状态。用户界面部分分别连接到设备管理计算机和密集管理计算机。用户接口部分分别包括显示装置。在显示装置的画面中，显示各制造装置的各生产装置的运转状态和批次的生产过程的进度。在用户接口部的显示装置的画面中，显示相应的制作装置的操作状态和对应的制作装置中批次的制作过程的进度。

8. 发明授权

US6112130A Semiconductor product manufacturing execution system and semiconductor product manufacturing method 失效
标题翻译：半导体产品制造执行系统和半导体产品制造方法
公开(公告)号：US6112130A
公开(公告)日：2000-08-29
申请号：US942442
申请日：1997-10-01
申请人： Etsuo Fukuda , Hidehiro Okutani
发明人： Etsuo Fukuda , Hidehiro Okutani
IPC分类号： H01L21/02 , G05B15/02 , G05B19/418 , G06F19/00
CPC分类号： G05B19/41865 , G05B2219/31428 , G05B2219/32046 , G05B2219/32097 , G05B2219/45031 , Y02P90/10 , Y02P90/12 , Y02P90/14 , Y02P90/20
摘要： A process flow, in which wafer processing conditions are described for forming a semiconductor through a plurality of processes, is formed for each lot in one type. A wafer processing is formed for each lot in one type of semiconductor in accordance with the process flow. When a different processing condition should be described according to a wafer in the lot in a certain process of the process flow, the process flow forming includes forming a plurality of different flows in that process by defining division/combination locations from a parent flow. When a faulty processing occurs in the wafer processing in a certain process, the process flow associated with that process is reformed, and a reprocessing is performed in accordance with the reformed process flow.
摘要翻译：针对每种批次形成一种处理流程，其中描述了通过多个处理形成半导体的晶片处理条件。根据工艺流程，在一种类型的半导体中为每个批次形成晶片处理。当根据工艺流程的特定过程中根据批次中的晶片来描述不同的处理条件时，工艺流程形成包括在该过程中形成多个不同的流程，通过从父流程定义分割/组合位置。当在某一过程中在晶片处理中出现故障处理时，与该过程相关联的处理流程被改造，并且根据重整过程流程进行再处理。

9. 发明授权

US5694325A Semiconductor production system 失效
标题翻译：半导体生产系统
公开(公告)号：US5694325A
公开(公告)日：1997-12-02
申请号：US562173
申请日：1995-11-22
申请人： Etsuo Fukuda , Masayoshi Tazawa , Kazuyuki Miura , Tomiko Takano , Yuichi Satoguchi , Yuichiro Ozaki
发明人： Etsuo Fukuda , Masayoshi Tazawa , Kazuyuki Miura , Tomiko Takano , Yuichi Satoguchi , Yuichiro Ozaki
IPC分类号： G05B13/04 , G05B17/02 , G05B19/418 , G06F19/00
CPC分类号： G05B19/41885 , G05B13/042 , G05B17/02 , G05B2219/32017 , G05B2219/32342 , G05B2219/32385 , Y02P90/20 , Y02P90/26
摘要： A system for automatically producing semiconductor products has a section for preparing a process flow containing a series of processes and process conditions for producing different semiconductor products in different quantities in a production line; a section for simulating the producing of semiconductor products according to the process flow; a section for feeding a result of the simulation back to the process flow preparation section, which optimizes the process flow according to the simulation result; and a section for producing semiconductor products according to the optimized process flow.
摘要翻译：用于自动生产半导体产品的系统具有用于制备包含用于在生产线中生产不同数量的不同半导体产品的一系列工艺和工艺条件的工艺流程的部分; 根据工艺流程模拟半导体产品生产的部分; 用于将模拟结果馈送到处理流程准备部分的部分，其根据模拟结果优化处理流程; 以及根据优化的工艺流程制造半导体产品的部分。

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