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    • 1. 发明授权
    • Method of forming silicon oxide containing films
    • 形成含氧化硅膜的方法
    • US08227032B2
    • 2012-07-24
    • US11908707
    • 2006-03-17
    • Christian DussarratJulien GatineauKazutaka YanagitaEri TsukadaIkuo Suzuki
    • Christian DussarratJulien GatineauKazutaka YanagitaEri TsukadaIkuo Suzuki
    • C23C16/40C23C16/455
    • H01L21/02164C23C16/402H01L21/02219H01L21/02222H01L21/0228H01L21/31612
    • A method of forming a silicon oxide film, comprising the steps of: —providing a treatment substrate within a reaction chamber; —purging the gas within the reaction chamber by feeding an inert gas into the chamber under reduced pressure at a substrate temperature of 50 to 400 C, —adsorbing, at the same temperatures and under reduced pressure, a silicon compound on the treatment substrate by pulsewise introduction of a gaseous silicon compound into the reaction chamber, —purging, at the same temperatures and under reduced pressure, the unadsorbed silicon compound in the reaction chamber with an inert gas, —at the same temperatures and under reduced pressure, introducing a pulse of ozone-containing mixed gas into the reaction chamber and producing silicon oxide by an oxidation reaction with the silicon compound adsorbed on the treatment substrate; and—repeating steps 1) to 4) if necessary to obtain the desired thickness on the substrate.
    • 一种形成氧化硅膜的方法,包括以下步骤: - 在反应室内提供处理衬底; 通过在50至400℃的基板温度下在减压下将惰性气体进料到反应室内,在相同的温度和减压下通过脉冲式在处理基板上吸收硅化合物 将气态硅化合物引入反应室中,在相同的温度和减压下,用惰性气体在相同的温度和减压下,将反应室中的未吸附的硅化合物, 含臭氧的混合气体进入反应室,并与吸附在处理基板上的硅化合物进行氧化反应而生成氧化硅; 并重复步骤1)至4),如果需要在基底上获得所需的厚度。