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1. 发明申请

US20080279717A1 PALLADIUM ALLOY 审中-公开
标题翻译：铜合金
公开(公告)号：US20080279717A1
公开(公告)日：2008-11-13
申请号：US11930923
申请日：2007-10-31
申请人： Arthur S. Klein , Edward F. Smith, III
发明人： Arthur S. Klein , Edward F. Smith, III
IPC分类号： C22C5/04
CPC分类号： C22C5/04 , A61L31/022 , A61L31/18 , H01H1/023
摘要： A family of alloys for use in medical, electrical contact and jewelry applications includes as primary components palladium, and boron and at least one of ruthenium, rhenium, platinum, gold, zirconium, tungsten, cobalt, nickel, tantalum and iridium. An alternative embodiment includes palladium and rhenium and/or ruthenium with an additional element iridium, platinum, tungsten, boron, gold, zirconium, cobalt, nickel and tantalum. The present alloy family has a high strength, high radio opacity, and biocompatibility characteristics, while also being workable into various configurations. Where required, some of the alloys also offer post form, heat treatment (age hardening) capabilities for even higher hardness and strength levels.
摘要翻译：用于医疗，电接触和珠宝应用的合金族包括作为主要组分的钯和硼以及钌，铼，铂，金，锆，钨，钴，镍，钽和铱中的至少一种。替代实施方案包括具有另外的元素铱，铂，钨，硼，金，锆，钴，镍和钽的钯和铼和/或钌。本发明的合金族具有高强度，高的无线透明度和生物相容性特性，同时也可用于各种配置。如果需要，一些合金还提供后形式，热处理（时效硬化）能力，以获得更高的硬度和强度水平。

2. 发明授权

US5484569A Silver palladium alloy 失效
标题翻译：银钯合金
公开(公告)号：US5484569A
公开(公告)日：1996-01-16
申请号：US289509
申请日：1994-08-12
申请人： Arthur S. Klein , Edward F. Smith, III
发明人： Arthur S. Klein , Edward F. Smith, III
IPC分类号： C22C5/06 , C22C30/02 , H01H1/023 , C22C5/08 , C22C30/00
CPC分类号： C22C30/02 , C22C5/06
摘要： A silver/palladium alloy for electronic applications comprises, on a percent by weight basis, 35-60 silver, 20-44 palladium, 5-20 copper, 1-7 nickel, 0.1-5 zinc, to 0.18 boron, up to 0.05 rhenium and up to 1 percent by weight of modifying elements selected from the group consisting of ruthenium, zirconium and platinum. This alloy exhibits high oxidation and tarnish resistance and is formed into wrought electronic components such as contacts and brushes to provide low noise.
摘要翻译：用于电子应用的银/钯合金包含以重量计35-60银，20-44钯，5-20铜，1-7镍，0.1-5锌，至0.18硼，至多0.05铼和至多1重量％的选自钌，锆和铂的改性元素。该合金表现出高的抗氧化和抗晦暗性，并形成诸如接触和刷子的锻造电子部件以提供低噪声。

3. 发明授权

US4812896A Metal electronic package sealed with thermoplastic having a grafted metal deactivator and antioxidant 失效
标题翻译：用热塑性塑料密封的金属电子封装，具有接枝金属钝化剂和抗氧化剂
公开(公告)号：US4812896A
公开(公告)日：1989-03-14
申请号：US930162
申请日：1986-11-13
申请人： Eugene F. Rothgery , William W. C. Hart , Edward F. Smith, III , Steven D. Phillips , Bonnie B. Sandel , David F. Gavin
发明人： Eugene F. Rothgery , William W. C. Hart , Edward F. Smith, III , Steven D. Phillips , Bonnie B. Sandel , David F. Gavin
IPC分类号： H01L23/10 , H01L23/48 , H01L29/44 , H01L29/52 , H01L29/60
CPC分类号： H01L23/10 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/181
摘要： A package and process of assembling a package adapted for housing an electronic component. The package includes metallic base, lid and leadframe components sealed together with a thermoplastic material. The thermoplastic has an additive consisting essentially of a metal deactivator and a primary antioxidant grafted thereto without cross linking so as to maintain the thermoplastic properties.
摘要翻译：一种组装适于容纳电子部件的包装的包装和过程。该包装包括与热塑性材料密封在一起的金属底座，盖子和引线框架部件。热塑性塑料具有基本上由金属钝化剂和接枝到其上的初级抗氧化剂组成的添加剂，而不交联，从而保持热塑性。

4. 发明授权

US4582556A Adhesion primers for encapsulating epoxies 失效
标题翻译：用于封装环氧树脂的粘合底漆
公开(公告)号：US4582556A
公开(公告)日：1986-04-15
申请号：US615605
申请日：1984-05-31
申请人： Sheldon H. Butt , Edward F. Smith, III , F. Dennis Gyurina
发明人： Sheldon H. Butt , Edward F. Smith, III , F. Dennis Gyurina
IPC分类号： H01L23/29 , H05K3/38 , C09J5/00
CPC分类号： H01L23/293 , H05K3/385 , H01L2924/0002 , Y10T29/49121 , Y10T428/31511
摘要： A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.
摘要翻译：提供具有高粘合强度的铜塑料层压板。铜选自铜和铜合金，并且在其表面上具有均匀的玻璃状，基本上无孔的磷酸铜涂层。包含脱模剂的塑料封装材料粘合到铜上。

5. 发明授权

US4526806A One-step plasma treatment of copper foils to increase their laminate adhesion 失效
公开(公告)号：US4526806A
公开(公告)日：1985-07-02
申请号：US554465
申请日：1983-11-22
申请人： Reza Haque , Edward F. Smith, III , Igor V. Kadija
发明人： Reza Haque , Edward F. Smith, III , Igor V. Kadija
IPC分类号： B05D7/24 , H05K3/38 , B05D3/06
CPC分类号： B05D1/62 , H05K3/386 , B05D2202/45 , H05K2201/0179 , H05K2201/0355 , H05K2201/0358 , H05K2203/095 , H05K3/382
摘要： A one-step plasma treatment for improving the laminate adhesion of metallic and non-metallic substrates is described. The treatment comprises forming a plasma of a polar containing organic species and at least one of nitrogen and hydrogen and exposing a substrate material to the plasma for a period of time sufficient to deposit a polymeric film on at least one surface. In a preferred embodiment, a plasma of an azole, nitrogen and/or hydrogen is utilized. The process has particular utility in forming adherent polymeric films on one or more surfaces of copper and copper alloy foils to be used in printed circuit applications.

6. 发明授权

US4524089A Three-step plasma treatment of copper foils to enhance their laminate adhesion 失效
公开(公告)号：US4524089A
公开(公告)日：1985-06-18
申请号：US554466
申请日：1983-11-22
申请人： Reza Haque , Edward F. Smith, III
发明人： Reza Haque , Edward F. Smith, III
IPC分类号： B05D3/14 , B05D7/24 , H05K3/38 , B05D3/06
CPC分类号： B05D1/62 , B05D3/142 , B05D3/148 , H05K3/382 , B05D2202/45 , H05K2201/0355 , H05K2203/095
摘要： A three-step plasma treatment for improving the laminate adhesion of metallic and non-metallic substrates is described. The treatment comprises sequentially exposing the substrate to a first plasma of oxygen gas, a second plasma of a hydrocarbon monomer gas and a third plasma of oxygen gas. The process has particular utility in forming polymeric films on one or more surfaces of copper or copper alloy foils to be used in printed circuit applications.

7. 发明授权

US08187015B2 Electrical connection apparatus 有权
标题翻译：电气连接装置
公开(公告)号：US08187015B2
公开(公告)日：2012-05-29
申请号：US13034044
申请日：2011-02-24
申请人： Garth W. Boyd , Aaron Engel , Dana Dubuc , Edward F. Smith, III , Michael E. Poppy , Michael E. Grant
发明人： Garth W. Boyd , Aaron Engel , Dana Dubuc , Edward F. Smith, III , Michael E. Poppy , Michael E. Grant
IPC分类号： H01R13/15
CPC分类号： A61N1/375 , A61N1/05 , A61N2001/083 , H01R13/514 , H01R13/5219 , H01R13/5224 , H01R13/641 , H01R13/717 , H01R24/58 , H01R2107/00 , Y10S439/909 , Y10T29/49117
摘要： An electrical connection apparatus includes an electrical connection contact and an adjustment component within an interior of the electrical connection apparatus. The electrical connection contact is operatively coupled to the adjustment component so that the electrical connection contact adjusts between an insertion position and a contact position in response to rotating the adjustment component. A slider movably arranged within the interior of the electrical connection apparatus causes the electrical connection contact to move in response to rotation of the adjustment component. The electrical connection apparatus includes one or more blocks, and the adjustment component, electrical contact and slider are arranged within an interior of the one or more blocks.
摘要翻译：电连接装置包括在电连接装置内部的电连接触点和调节部件。电连接触点可操作地耦合到调节部件，使得电连接触点响应于旋转调节部件而在插入位置和接触位置之间进行调整。可移动地布置在电连接装置内部的滑块导致电连接接触件响应于调节部件的旋转而移动。电连接装置包括一个或多个块，并且调节部件，电接触件和滑块布置在一个或多个块的内部。

8. 发明申请

US20120039744A1 GOLD-BASED ALLOY, FREE OF SILVER AND TIN, FOR DENTAL COPINGS OR ABUTMENTS 有权
标题翻译：金为基础的合金，不含银和锡，用于牙科复制品或背面
公开(公告)号：US20120039744A1
公开(公告)日：2012-02-16
申请号：US13050657
申请日：2011-03-17
申请人： Peter Hale , Edward F. Smith, III , Arthur S. Klein
发明人： Peter Hale , Edward F. Smith, III , Arthur S. Klein
IPC分类号： C22C5/02
CPC分类号： C22C5/02
摘要： Alloys and dental copings or abutments formed of alloys include 50-60 wt % gold, 5-14 wt % platinum, 0.1-3.0 wt % iridium and the remainder palladium. Other alloys and dental copings or abutments formed of alloys include 58 wt % gold, 10 wt% platinum, 1.0 wt % iridium, and 31 wt % palladium. The alloys are capable of withstanding temperature profiles during casting and multiple high temperature exposures of porcelain firing without excessive softening. The alloys also exhibit advantageous shear strain properties giving the alloys improved manufacturability characteristics.
摘要翻译：由合金形成的合金和牙科接合物或邻接物包括50-60重量％的金，5-14重量％的铂，0.1-3.0重量％的铱，其余的是钯。由合金形成的其它合金和牙科接合物或邻接物包括58重量％的金，10重量％的铂，1.0重量％的铱和31重量％的钯。该合金能够承受铸造过程中的温度曲线以及多次高温曝光的陶瓷烧制而不会过度软化。合金还表现出有利的剪切应变特性，从而使合金提高了可制造性能。

9. 发明申请

US20110151698A1 Electrical Connection Apparatus 有权
标题翻译：电气连接装置
公开(公告)号：US20110151698A1
公开(公告)日：2011-06-23
申请号：US13034044
申请日：2011-02-24
申请人： Garth W. Boyd , Aaron Engel , Dana Dubuc , Edward F. Smith, III , Michael E. Poppy , Michael E. Grant
发明人： Garth W. Boyd , Aaron Engel , Dana Dubuc , Edward F. Smith, III , Michael E. Poppy , Michael E. Grant
IPC分类号： H01R13/60 , H01R43/00
CPC分类号： A61N1/375 , A61N1/05 , A61N2001/083 , H01R13/514 , H01R13/5219 , H01R13/5224 , H01R13/641 , H01R13/717 , H01R24/58 , H01R2107/00 , Y10S439/909 , Y10T29/49117
摘要： An electrical connection apparatus includes an electrical connection contact and an adjustment component within an interior of the electrical connection apparatus. The electrical connection contact is operatively coupled to the adjustment component so that the electrical connection contact adjusts between an insertion position and a contact position in response to rotating the adjustment component. A slider may be movably arranged within the interior of the electrical connection apparatus to cause the electrical connection contact to move in response to rotation of the adjustment component. The electrical connection apparatus may include stackable blocks coupled to each other so that the adjustment component, electrical contact and slider, when provided, are arranged within an interior of the coupled stackable blocks.
摘要翻译：电连接装置包括在电连接装置内部的电连接触点和调节部件。电连接触点可操作地耦合到调节部件，使得电连接触点响应于旋转调节部件而在插入位置和接触位置之间进行调整。滑动件可以可移动地布置在电连接装置的内部中，以使得电连接接触件响应于调节部件的旋转而移动。电连接装置可以包括彼此联接的可堆叠块，使得调节部件，电触点和滑块在被提供时被布置在耦合的可堆叠块的内部。

10. 发明授权

US07942686B2 Electrical barrier and moisture seal for an implanted medical device 有权
标题翻译：植入医疗器械的电气屏障和湿气密封
公开(公告)号：US07942686B2
公开(公告)日：2011-05-17
申请号：US12727955
申请日：2010-03-19
申请人： Garth W. Boyd , Aaron Engel , Dana Dubuc , Edward F. Smith, III , Michael E. Poppy , Michael E. Grant
发明人： Garth W. Boyd , Aaron Engel , Dana Dubuc , Edward F. Smith, III , Michael E. Poppy , Michael E. Grant
IPC分类号： H01R13/52
CPC分类号： H01R13/5224 , A61N1/05 , A61N1/375 , H01R13/514 , H01R13/5219 , H01R24/58 , H01R2107/00 , Y10S439/909
摘要： Multiple seals, internal to a connector block, provide for connecting an implantable medical device and an implanted cable or lead. The forces to engage sealing or releasing the seals are derived from a mechanism so they can be relaxed to permit ease of insertion or withdrawal of a lead, or can be increased to tightly seal against fluid migration, and to provide an electrical insulation between adjacent conductors of the lead and connector block. During implant of the medical device, the lead is inserted and a shaft is rotated with a tool to engage the seals. Later, the seals can be released by rotating the control shaft in the opposite direction to allow extraction of the lead from the connector block. The seals therefore are able to provide improved sealing without increasing the insertion or the extraction forces for the lead.
摘要翻译：连接器块内部的多个密封件用于连接可植入的医疗设备和植入电缆或引线。接合密封或释放密封件的力源于机构，因此它们可以被放松以允许引线的插入或抽出的容易性，或者可以增加以紧密地密封以防止流体迁移，并且在相邻的导体之间提供电绝缘的引线和连接器块。在植入医疗装置期间，插入引线，并且用工具旋转轴以接合密封件。之后，通过沿相反方向旋转控制轴可以释放密封，从而可以从连接器块中取出导线。因此，密封件能够提供改进的密封，而不增加引线的插入或拔出力。

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