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1. 发明授权

US08439322B2 Apparatus and method for mounting of cabinets 有权
标题翻译：用于安装机柜的装置和方法
公开(公告)号：US08439322B2
公开(公告)日：2013-05-14
申请号：US13118133
申请日：2011-05-27
申请人： Michael E. Skudin , Dennis D. Davis , David W. Willis
发明人： Michael E. Skudin , Dennis D. Davis , David W. Willis
IPC分类号： A47B96/00 , A47B97/00 , A47B81/00 , A47B91/00 , A47G29/00 , A47G23/02 , A47K1/00 , A47H1/10
CPC分类号： E04C3/32 , H01Q1/1242 , H01Q1/42 , Y10T29/49826
摘要： A mounting post for supporting a plurality of electronic cabinets, each having different bolt patterns, comprising a hollow post configured to receive a hollow mount at the upper end, a stabilizer plate attached to the lower end of the post, and a hollow mount selected from a plurality of hollow mounts, each having a lower end configured to mate to the post, and having a substantially planar upper surface with openings formed therein corresponding to a unique bolt pattern for an electronics cabinet.
摘要翻译：一种用于支撑多个电子柜的安装柱，每个电子柜具有不同的螺栓图案，包括一个中空柱，其构造成在上端容纳中空的安装座，安装在柱的下端的稳定板，多个中空安装件，每个具有被配置成与柱相配合的下端，并且具有基本平坦的上表面，其中形成有开口用于电子柜的独特螺栓图案。

2. 发明授权

US06258253B1 Vapor corrosion cell and method of using same 失效
标题翻译：蒸气腐蚀池及其使用方法
公开(公告)号：US06258253B1
公开(公告)日：2001-07-10
申请号：US09292237
申请日：1999-04-15
申请人： Dennis D. Davis
发明人： Dennis D. Davis
IPC分类号： G01N2726
CPC分类号： G01N17/02
摘要： The present invention provides a vapor corrosion cell for a real-time and quantitative measurement of corrosion of conductive materials in atmospheres containing chemically reactive gases and water vapor. Two prototypes are provided. Also provided are various applications of this apparatus in industry.
摘要翻译：本发明提供一种用于在包含化学反应性气体和水蒸气的气氛中实时和定量测量导电材料的腐蚀的蒸汽腐蚀池。提供了两个原型。还提供了该设备在工业中的各种应用。

3. 发明授权

US5179025A Atmospheric pressure flow reactor: gas phase chemical kinetics under tropospheric conditions without wall effects 失效
标题翻译：大气压力反应器：对流层条件下气相化学动力学无壁效应
公开(公告)号：US5179025A
公开(公告)日：1993-01-12
申请号：US737756
申请日：1991-07-30
申请人： Steven L. Koontz , Dennis D. Davis
发明人： Steven L. Koontz , Dennis D. Davis
IPC分类号： G01N33/00
CPC分类号： G01N33/0004 , Y10T436/100833 , Y10T436/117497 , Y10T436/178459
摘要： A flow reactor for simulating the interaction in the troposphere is set forth. A first reactant mixed with a carrier gas is delivered from a pump and flows through a duct having louvers therein. The louvers straighten out the flow, reduce turbulence and provide laminar flow discharge from the duct. A second reactant delivered from a source through a pump is input into the flowing stream, the second reactant being diffused through a plurality of small diffusion tubes to avoid disturbing the laminar flow. The commingled first and second reactants in the carrier gas are then directed along an elongate duct where the walls are spaced away from the flow of reactants to avoid wall interference, disturbance or turbulence arising from the walls. A probe connected with a measuring device can be inserted through various sampling ports in the second duct to complete measurements of the first and second reactants and the product of their reaction at selected XYZ locations relative to the flowing system.
摘要翻译：阐述了用于模拟对流层相互作用的流动反应器。与载气混合的第一反应物从泵输送并流过其中具有百叶窗的管道。百叶窗整流，减少湍流，并从管道中提供层流排放。从源通过泵输送的第二反应物输入到流动流中，第二反应物通过多个小扩散管扩散，以避免干扰层流。载气中的混合的第一和第二反应物然后沿着细长管道引导，其中壁与反应物流间隔开，以避免由壁产生的壁干扰，干扰或湍流。与测量装置连接的探头可以插入通过第二管道中的各种采样端口，以完成第一和第二反应物的测量以及它们在选定的XYZ位置相对于流动系统的反应产物。

4. 发明授权

US5070039A Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal 失效
标题翻译：使用预先服务的DAMBAR制造集成电路以减少模具闪光并促进闪存去除的方法
公开(公告)号：US5070039A
公开(公告)日：1991-12-03
申请号：US337609
申请日：1989-04-13
申请人： Richard E. Johnson , Dennis D. Davis , David R. Kee , John W. Orcutt , Angus W. Hightower
发明人： Richard E. Johnson , Dennis D. Davis , David R. Kee , John W. Orcutt , Angus W. Hightower
IPC分类号： H01L21/56 , H01L21/48 , H01L23/495 , H01L23/50
CPC分类号： H01L23/49541 , H01L21/4842 , H01L2224/48247 , H01L2224/49171 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01014 , H01L2924/14 , Y10T29/49121
摘要： A lead from 10 carries an integrated circuit on a die support pad 14. The lead frame has a dam bar including a transverse portion that extends between adjacent leads (20) for limiting mold flash. The dam bar transverse portion 26 is entirely severed from the adjacent leads for final removal by a metal punch 33 along with the supporting web 16.
摘要翻译：来自10的引线在芯片支撑垫14上承载集成电路。引线框架具有在相邻引线（23,24）之间延伸的阻挡条26，用于限制模具闪光。阻挡杆26从导线部分或全部切断，以便通过金属冲头33以及引线网16最终去除。

5. 发明授权

US06465274B2 Lead frame tooling design for bleed barrier groove 有权
公开(公告)号：US06465274B2
公开(公告)日：2002-10-15
申请号：US09862009
申请日：2001-05-21
申请人： Buford H. Carter, Jr. , Dennis D. Davis
发明人： Buford H. Carter, Jr. , Dennis D. Davis
IPC分类号： H01L2144
CPC分类号： H01L21/4842 , H01L23/49503 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for forming a stamped groove in a lead frame including a tool for coining the groove in the lead frame. The tool has a shoulder to control swelling of the lead frame surface near the groove.

6. 发明授权

US06365976B1 Integrated circuit device with depressions for receiving solder balls and method of fabrication 有权
标题翻译：具有用于接收焊球的凹陷的集成电路装置及其制造方法
公开(公告)号：US06365976B1
公开(公告)日：2002-04-02
申请号：US09511320
申请日：2000-02-23
申请人： Buford H. Carter, Jr. , Dennis D. Davis , David R. Kee , Richard E. Johnson
发明人： Buford H. Carter, Jr. , Dennis D. Davis , David R. Kee , Richard E. Johnson
IPC分类号： H01L2348
CPC分类号： H01L21/4853 , H01L21/565 , H01L23/31 , H01L23/3107 , H01L23/49816 , H01L2224/48091 , H01L2224/85001 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor device, especially a Ball Grid Array or Chip Scale Package, comprising an integrated circuit chip having at least one input/output terminal; a body of encapsulation material molded around said chip, forming a generally flat surface including at least one dimple having a suitable size and shape to receive a solder ball or solder paste; and said dimple having an electrically conductive solderable surface connected to said terminal.
摘要翻译：一种半导体器件，特别是球栅阵列或芯片级封装，包括具有至少一个输入/输出端的集成电路芯片; 围绕所述芯片模制的封装材料体，形成包括具有合适尺寸和形状的至少一个凹坑的大致平坦的表面以接收焊球或焊膏; 并且所述凹坑具有连接到所述端子的导电可焊接表面。

7. 发明授权

US5683813A Absorbent pads for containment, neutralization, and clean-up of environmental spills containing chemically-reactive agents 失效
标题翻译：用于容纳，中和和清理含有化学反应剂的环境泄漏的吸收垫
公开(公告)号：US5683813A
公开(公告)日：1997-11-04
申请号：US654461
申请日：1996-05-28
申请人： Dennis D. Davis
发明人： Dennis D. Davis
IPC分类号： B32B5/24 , B32B3/06 , B01D15/00
CPC分类号： B32B5/24 , Y10S210/924 , Y10T428/1362 , Y10T428/25 , Y10T428/254 , Y10T428/27 , Y10T428/2915 , Y10T428/2927 , Y10T428/2935 , Y10T428/2973 , Y10T428/2975 , Y10T428/2978 , Y10T428/2982 , Y10T428/31859
摘要： A pad for cleaning up liquid spills is described which contains a porous surface covering, and an absorbent interior containing chemically reactive reagents for neutralizing noxious chemicals within the spilled liquid. The porous surface and the absorbent component would normally consist of chemically resistant materials allowing tentative spill to pass. The absorbent interior which contains the neutralizing reagents can but is not required to be chemically resilient and conducts the liquid chemical spill towards the absorbent interior containing the chemically reactive reagents where the dangerous and undesirable chemicals within the chemical spill are then neutralized as well as removed from the premises.
摘要翻译：描述了用于清理液体溢出物的垫，其包含多孔表面覆盖物，以及含有用于中和溢出液体中的有毒化学物质的化学反应试剂的吸收剂内部。多孔表面和吸收组分通常由允许暂时溢出的耐化学腐蚀材料组成。含有中和剂的吸收剂内部可以但不需要具有化学弹性，并且将液体化学品泄漏导向含有化学反应试剂的吸收剂内部，其中化学品溢出物内的危险和不期望的化学物质然后被中和的处所。

8. 发明授权

US5479050A Leadframe with pedestal 失效
标题翻译：带底座的引线框架
公开(公告)号：US5479050A
公开(公告)日：1995-12-26
申请号：US321373
申请日：1994-10-11
申请人： James W. Pritchard , Dennis D. Davis
发明人： James W. Pritchard , Dennis D. Davis
IPC分类号： H01L21/60 , H01L23/495 , H01L23/50 , H01L23/48
CPC分类号： H01L23/49503 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49171 , H01L24/48 , H01L24/49 , H01L2924/00014
摘要： A raised pedestal is formed on a leadframe die mount pad and is used in forming an electrical connection between the die bond pad and the semiconductor die, the electrical connection being isolated from the shear forces developed during temperature cycling or during thermal shock of the resultant semiconductor device. Such shear forces usually result in destruction of the bond between the semiconductor die and the die bond pad.
摘要翻译：凸起的基座形成在引线框模具安装焊盘上，并且用于在管芯接合焊盘和半导体管芯之间形成电连接，电连接与在温度循环期间或在所得半导体的热冲击期间产生的剪切力隔离设备。这种剪切力通常导致半导体管芯和管芯接合焊盘之间的结合的破坏。

9. 发明授权

US06401765B1 Lead frame tooling design for exposed pad features 有权
标题翻译：引线框架工具设计，用于裸焊盘功能
公开(公告)号：US06401765B1
公开(公告)日：2002-06-11
申请号：US09643368
申请日：2000-08-22
申请人： Buford H. Carter, Jr. , Dennis D. Davis
发明人： Buford H. Carter, Jr. , Dennis D. Davis
IPC分类号： B21F4500
CPC分类号： H01L23/49503 , H01L21/4842 , H01L2924/0002 , H01L2924/00
摘要： A modular tool for forming features in an exposed pad having a pad surface between a bleed groove and an edge of the pad surface in a lead frame including a first tool for forming a bottom of the exposed pad under the pad surface, a second tool coupled to the first tool for forming a side of the exposed pad, and a third tool coupled to the first tool for forming another side of the exposed pad.
摘要翻译：一种用于在裸露焊盘中形成特征的模块化工具，其具有位于引线框架中的泄放槽和焊盘表面的边缘之间的焊盘表面，该引线框架包括用于在焊盘表面下形成暴露焊盘的底部的第一工具，到用于形成暴露焊盘的一侧的第一工具，以及联接到第一工具的第三工具，用于形成暴露焊盘的另一侧。

10. 发明授权

US06365980B1 Thermally enhanced semiconductor ball grid array device and method of fabrication 有权
标题翻译：热增强半导体球栅阵列器件及其制造方法
公开(公告)号：US06365980B1
公开(公告)日：2002-04-02
申请号：US09513121
申请日：2000-02-25
申请人： Buford H. Carter, Jr. , Dennis D. Davis , David R. Kee , Richard E. Johnson
发明人： Buford H. Carter, Jr. , Dennis D. Davis , David R. Kee , Richard E. Johnson
IPC分类号： H01L2348
CPC分类号： H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/13 , H01L23/3107 , H01L23/3128 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6655 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2224/85399 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , H01L2924/19015 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor device comprising a thermally conductive foil including a chip mount portion having first and second surfaces; an integrated circuit chip attached to said first surface; a body of encapsulation material molded around said chip and said first surface such that it leaves said second surface exposed; and said second surface comprising means for forming thermal contact, thereby creating a path for dissipating thermal energy from said chip. Said means for thermal contact comprise a configuration of said second surface suitable for direct thermal attachment to a heat sink. Alternatively, said means for thermal contact comprise a configuration of said second surface suitable for thermal attachment including solder balls between the chip and the heat sink.
摘要翻译：一种半导体器件，包括导热箔，其包括具有第一和第二表面的芯片安装部分; 附接到所述第一表面的集成电路芯片; 围绕所述芯片和所述第一表面模制的封装材料体，使得其离开所述第二表面; 并且所述第二表面包括用于形成热接触的装置，由此产生用于从所述芯片消散热能的路径。所述用于热接触的装置包括适于直接热附接到散热器的所述第二表面的构造。或者，所述用于热接触的装置包括适于热附接的所述第二表面的构造，包括在芯片和散热器之间的焊球。

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