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1. 发明授权

US6056557A Board to board interconnect 失效
标题翻译：板对板互连
公开(公告)号：US6056557A
公开(公告)日：2000-05-02
申请号：US56972
申请日：1998-04-08
申请人： David R. Crotzer , Stephen D. DelPrete
发明人： David R. Crotzer , Stephen D. DelPrete
IPC分类号： H01R12/52 , H01R13/03 , H05K3/32 , H05K3/36 , H01R9/09
CPC分类号： H05K3/368 , H01R12/523 , H05K2201/10378 , H05K3/325
摘要： A board-to-board interconnect socket (40) provides electrical interconnection between printed circuit boards (50, 52). Resilient metalized particle interconnects (28) are disposed in holes in a rigid substrate (14) of desired thickness. Each resilient interconnect (28) includes first and second cap members (18, 20) that extend from opposing ends of the hole and beyond the respective surfaces of the substrate. The first and second cap members (18, 20) may be connected with a stem member (22) or conductive paste (34) that is disposed inside the hole. The hole may be lined with conductive material (26) such as conductive plating to facilitate conduction of electricity.
摘要翻译：板对板互连插座（40）提供印刷电路板（50,52）之间的电互连。弹性金属化颗粒互连（28）设置在所需厚度的刚性衬底（14）中的孔中。每个弹性互连（28）包括第一和第二盖构件（18,20），其从孔的相对端延伸并且超过衬底的相应表面。第一和第二盖构件（18,20）可以与设置在孔内部的杆构件（22）或导电糊（34）连接。该孔可以衬有诸如导电电镀的导电材料（26），以促进电的传导。

2. 发明授权

US5871842A Grafted thermoplastic elastomer barrier layer 失效
标题翻译：接枝热塑性弹性体阻隔层
公开(公告)号：US5871842A
公开(公告)日：1999-02-16
申请号：US763630
申请日：1996-12-04
申请人： David R. Crotzer , Neill N. Silva
发明人： David R. Crotzer , Neill N. Silva
IPC分类号： B32B7/02 , B05D7/02 , B32B25/04 , B32B27/08 , G06F3/02 , H01B1/00 , H01B5/14 , H01H1/029 , H01H3/12 , H01H13/702 , H01L23/498 , H01R11/01 , H01R12/52 , H01R12/71 , H01R13/03 , H01R13/24 , H01R13/6599 , H05K1/09 , H05K3/10 , H05K3/32 , H05K3/38 , H05K9/00 , B23B27/34 , B23B27/40
CPC分类号： H01H1/029 , B32B27/08 , H01H13/702 , H01L23/49827 , H01R12/52 , H01R13/035 , H01R13/2414 , H05K1/095 , H05K3/102 , H05K3/325 , H05K3/38 , H05K3/386 , H05K9/0039 , H01H2209/014 , H01H2239/034 , H01L2924/0002 , H01R12/714 , H01R13/6599 , H05K2201/0133 , H05K2201/0245 , H05K2201/0329 , H05K2203/1168 , Y10T428/263 , Y10T428/31562 , Y10T428/31598 , Y10T428/31667
摘要： A thermoplastic elastomer barrier layer is disclosed. The thermoplastic elastomer barrier layer may be grafted to a substrate for preventing contaminants from permeating through the substrate or for preventing contaminants, which may permeate through the substrate, from permeating beyond the substrate. The thermoplastic elastomer barrier layer is grafted to the substrate by a thermal grafting process.
摘要翻译：公开了一种热塑性弹性体阻挡层。可以将热塑性弹性体阻挡层接枝到基底上，以防止污染物渗透通过基底或防止可能渗透通过基底的污染物渗透到基底之外。热塑性弹性体阻挡层通过热接枝方法接枝到基底上。

3. 发明授权

US5527591A Electrical contact having a particulate surface 失效
标题翻译：具有颗粒表面的电接触
公开(公告)号：US5527591A
公开(公告)日：1996-06-18
申请号：US349042
申请日：1994-12-02
申请人： David R. Crotzer , Gregory E. Dean
发明人： David R. Crotzer , Gregory E. Dean
IPC分类号： H01H1/06 , H01H1/60 , H05K3/10 , H05K3/32 , H05K3/40 , B32B9/00
CPC分类号： H01H1/06 , H05K3/102 , H05K3/4007 , H01H1/60 , H05K2201/0133 , H05K2201/023 , H05K2201/0367 , H05K2201/09045 , H05K2201/09118 , H05K2203/095 , H05K2203/1168 , H05K2203/1344 , H05K3/326 , Y10S439/931 , Y10T428/24917
摘要： The present invention comprises an electrical contact having solid homogenous conductive particles on the contact surface. The particles are of greater hardness than that of the contact material to deform the contact material and cause breakage or fracture of the oxide or other contaminating layer, or to penetrate the contaminating layer. The particles are applied to the contact surface by a technique which results in the particles being intimately bonded to the contact surface, usually as a layer of particles. A preferable technique for such particle application is hypervelocity oxygen fuel spraying (HVOF) or plasma spraying, by which the particles are embedded on the contact surfaces to provide a substantially permanent interparticle bond between the applied particles and the contact material.
摘要翻译：本发明包括在接触表面上具有固体均匀导电颗粒的电接触。这些颗粒的硬度比接触材料的硬度大，使接触材料变形并导致氧化物或其它污染层的断裂或断裂，或者穿透污染层。颗粒通过导致颗粒紧密结合到接触表面的技术施加到接触表面，通常作为一层颗粒。用于这种颗粒应用的优选技术是超高速氧燃料喷射（HVOF）或等离子体喷涂，通过该喷涂，颗粒嵌入在接触表面上，以在施加的颗粒和接触材料之间提供基本上永久的颗粒间粘结。

4. 发明授权

US5766021A BGA interconnectors 失效
标题翻译： BGA互连器
公开(公告)号：US5766021A
公开(公告)日：1998-06-16
申请号：US725341
申请日：1996-10-01
申请人： Charles S. Pickles , David R. Crotzer
发明人： Charles S. Pickles , David R. Crotzer
IPC分类号： H01R12/51 , H05K7/10 , H01R9/09
CPC分类号： H01R12/714 , H05K7/1084
摘要： A reusable socket adapted for use in making an electrical connection between an integrated circuit of a ball grid array (BGA) type package and a circuit board or test fixture. In one embodiment, the socket includes a return member for reshaping the socket. In a further embodiment, a socket assembly includes a plurality of spaced sockets. In an alternative embodiment, a socket assembly further includes a base member. In another embodiment, a socket is formed from a temperature dependent smart memory material. In a further embodiment, a socket assembly includes a plurality of sockets formed from a shape memory material. In an alternative embodiment, a zero insertion force (ZIF) or a low insertion force (LIF) socket assembly for a BGA package includes a plurality of sockets and a lever adapted for frictionally engaging respective BGA contact balls.
摘要翻译：一种可重复使用的插座，适用于在球栅阵列（BGA）型封装的集成电路与电路板或测试夹具之间进行电连接。在一个实施例中，插座包括用于重塑插座的返回构件。在另一实施例中，插座组件包括多个间隔开的插座。在替代实施例中，插座组件还包括基座构件。在另一个实施例中，插座由温度依赖的智能存储器材料形成。在另一实施例中，插座组件包括由形状记忆材料形成的多个插座。在替代实施例中，用于BGA封装的零插入力（ZIF）或低插入力（LIF）插座组件包括多个插座和适于摩擦接合相应的BGA接触球的杆。

5. 发明授权

US5273777A Method for manufacturing hygristors 失效
标题翻译：制造茄子的方法
公开(公告)号：US5273777A
公开(公告)日：1993-12-28
申请号：US681987
申请日：1991-04-08
申请人： David R. Crotzer , Roberto Falcone
发明人： David R. Crotzer , Roberto Falcone
IPC分类号： G01N27/12 , B05D5/12
CPC分类号： G01N27/121 , Y10T29/49099
摘要： A method for manufacturing hygristors includes preparing a hygroscopic gel containing a substantially greater proportion of carbon than the prior art, and milling the gel for a period of at least 24 hours to produce a smooth mixture. Substrates are dipped into the milled gel at controlled rates to coat the substrates. The coated substrates are cured under controlled temperature and humidity. Adhesion of the coating is improved by the smoother mixture resulting from the longer milling time, and by the differences in components of the mixture compared to the prior art. Long term stability and dynamic range are both increased.
摘要翻译：制造茄子的方法包括制备含有比现有技术大得多的碳的吸湿凝胶，并将凝胶研磨至少24小时以产生光滑的混合物。将底物以受控的速率浸入研磨的凝胶中以涂覆基材。涂覆的基材在受控的温度和湿度下固化。通过由较长的研磨时间得到的更平滑的混合物以及与现有技术相比的混合物的组分差异，改善了涂层的附着力。长期稳定性和动态范围都增加。

6. 发明授权

US06180221B2 Conductive elastomer for grafting to thermoplastic and thermoset substrates 失效
标题翻译：用于接枝到热塑性和热固性基材的导电弹性体
公开(公告)号：US06180221B2
公开(公告)日：2001-01-30
申请号：US08931130
申请日：1997-09-16
申请人： David R. Crotzer , Mark G. Hanrahan , Neill N. Silva
发明人： David R. Crotzer , Mark G. Hanrahan , Neill N. Silva
IPC分类号： B32B522
CPC分类号： B32B27/08 , H01H1/029 , H01H13/702 , H01R13/2414 , H05K1/0393 , H05K1/095 , H05K3/38 , H05K3/386 , H05K2201/0133 , H05K2201/0245 , H05K2203/1168 , Y10T428/249958 , Y10T428/249981 , Y10T428/249986 , Y10T428/24999 , Y10T428/249994
摘要： An electrically conductive elastomer for grafting to thermoplastic and thermoset substrates is disclosed. If the substrate is a thermoset substrate, the electrically conductive elastomer comprises a mixture of an elastic material, a quantity of electrically conductive flakes, a thermoplastic elastomer material, and a thermoset material. If the substrate is a thermoplastic substrate, the electrically conductive elastomer comprises a mixture of an elastic material, a quantity of electrically conductive flakes, a thermoplastic elastomer material, and a thermoplastic material. The electrically conductive elastomer may further comprise a quantity of electrically conductive particles interspersed within the mixture. Alternatively, a quantity of electrically conductive particles may be imbedded in an outer surface of the electrically conductive elastomer. The electrically conductive elastomer is typically grafted to the substrate by a thermal process.
摘要翻译：公开了用于接枝到热塑性和热固性基底的导电弹性体。如果衬底是热固性衬底，则导电弹性体包括弹性材料，一定量的导电薄片，热塑性弹性体材料和热固性材料的混合物。如果基材是热塑性基材，则导电弹性体包括弹性材料，一定数量的导电薄片，热塑性弹性体材料和热塑性材料的混合物。导电弹性体还可以包含散布在混合物内的一定数量的导电颗粒。或者，一定数量的导电颗粒可以嵌入导电弹性体的外表面中。导电弹性体通常通过热过程接枝到基底上。

7. 发明授权

US5910700A Dust sensor apparatus 失效
标题翻译：除尘传感器
公开(公告)号：US5910700A
公开(公告)日：1999-06-08
申请号：US45458
申请日：1998-03-20
申请人： David R. Crotzer
发明人： David R. Crotzer
IPC分类号： G01N27/00 , G01N29/036 , H01L41/08
CPC分类号： G01N29/036 , G01N2291/02408 , G01N2291/0257
摘要： A dust sensing apparatus uses a transducer element oscillating at a resonant frequency to detect changes in dust concentration. The transducer is fabricated from a polymer material which oscillates when a voltage is applied. The presence of dust affects the oscillation frequency. Dampening of the frequency by the dust presence changes the electrical resistance provided by the transducer. Electronic circuitry computes the level of dust by measuring and controlling the level of the AC signal required to maintain the oscillation frequency by monitoring the resistance.
摘要翻译：尘埃检测装置使用以共振频率振荡的换能器元件来检测灰尘浓度的变化。传感器由施加电压时振荡的聚合物材料制成。灰尘的存在影响振荡频率。通过灰尘存在使频率的衰减改变了传感器提供的电阻。电子电路通过测量和控制通过监测电阻来维持振荡频率所需的交流信号的电平来计算灰尘水平。

8. 发明授权

US06271482B1 Conductive elastomer interconnect 失效
标题翻译：导电弹性体互连
公开(公告)号：US06271482B1
公开(公告)日：2001-08-07
申请号：US09222137
申请日：1998-12-29
申请人： David R. Crotzer , Jonathan W. Goodwin , Arthur G. Michaud , David A. DeDonato
发明人： David R. Crotzer , Jonathan W. Goodwin , Arthur G. Michaud , David A. DeDonato
IPC分类号： H01R1204
CPC分类号： H01H1/029 , H01L23/49827 , H01L2924/0002 , H01R12/52 , H01R12/714 , H01R13/035 , H01R13/2414 , H01R13/6599 , H05K1/095 , H05K3/102 , H05K3/325 , H05K3/38 , H05K3/386 , H05K2201/0133 , H05K2201/0245 , H05K2201/0329 , H05K2203/1168 , H01L2924/00
摘要： An electrical interconnect comprising a non-conductive substrate having respective opposite surfaces and a plurality of apertures formed therein extending between the respective opposite surfaces, and a corresponding plurality of elastic conductive interconnect elements located within the plurality of apertures, in which each elastic conductive interconnect element extends between the respective opposite surfaces of the substrate. Each elastic conductive interconnect element is formed of a non-conductive elastic material having a quantity of conductive flakes and a quantity of conductive powder granules interspersed therein. The interconnect elements can be integrally molded in the substrate or separately formed and inserted in the substrate.
摘要翻译：一种电互连，其包括具有相应相对表面的非导电基底和在其相应的相对表面之间形成的多个孔，以及位于所述多个孔内的相应的多个弹性导电互连元件，其中每个弹性导电互连元件在基板的相应的相对表面之间延伸。每个弹性导电互连元件由具有导电薄片数量和散布在其中的一定数量的导电粉末颗粒的非导电弹性材料形成。互连元件可以一体地模制在基板中或分开形成并插入到基板中。

9. 发明授权

US6117539A Conductive elastomer for grafting to an elastic substrate 失效
标题翻译：用于接枝到弹性基底的导电弹性体
公开(公告)号：US6117539A
公开(公告)日：2000-09-12
申请号：US931438
申请日：1997-09-16
申请人： David R. Crotzer , Arthur G. Michaud , Neil N. Silva
发明人： David R. Crotzer , Arthur G. Michaud , Neil N. Silva
IPC分类号： B32B7/02 , B32B25/04 , B32B27/08 , H01B1/00 , H01B5/14 , H01H1/029 , H01H13/702 , H01L23/498 , H01R11/01 , H01R13/03 , H01R13/24 , H01R13/658 , H05K1/09 , H05K3/10 , H05K3/32 , H05K3/38 , H05K9/00 , B32B5/22
CPC分类号： B32B27/08 , H01H1/029 , H01H13/702 , H01L23/49827 , H01R12/52 , H01R13/035 , H01R13/2414 , H05K1/095 , H05K3/102 , H05K3/325 , H05K3/38 , H05K3/386 , H05K9/0039 , H01H2209/014 , H01H2239/034 , H01L2924/0002 , H01R12/714 , H01R13/6599 , H05K2201/0133 , H05K2201/0245 , H05K2201/0329 , H05K2203/1168
摘要： An electrically conductive elastomer for grafting to an elastic substrate is disclosed. The conductive elastomer comprises a non-conductive elastic material having a quantity of conductive flakes interspersed therein. The conductive elastomer may further comprise a quantity of conductive particles interspersed in the non-conductive elastic material. Alternatively, a quantity of conductive particles may be imbedded in an outer surface of the conductive elastomer. The conductive elastomer is typically grafted to an elastic substrate by a thermal process.
摘要翻译：公开了用于接合到弹性基底的导电弹性体。导电弹性体包括具有散布在其中的一定数量的导电薄片的非导电弹性材料。导电弹性体还可以包括散布在非导电弹性材料中的一定数量的导电颗粒。或者，可以在导电弹性体的外表面中嵌入一定数量的导电颗粒。导电弹性体通常通过热过程接枝到弹性基底上。

10. 发明授权

US5990433A Molded electrical switch 失效
标题翻译：模制电气开关
公开(公告)号：US5990433A
公开(公告)日：1999-11-23
申请号：US992756
申请日：1997-12-17
申请人： Wayne S. Alden, III , David R. Crotzer , Arnie Feinberg
发明人： Wayne S. Alden, III , David R. Crotzer , Arnie Feinberg
IPC分类号： H01H1/029 , H01H11/00 , H01H13/52 , H01H13/70
CPC分类号： H01H11/0056 , H01H11/00 , H01H13/52 , H01H1/029 , H01H2221/026 , H01H2221/044
摘要： Several different types of electrical switches are disclosed. In one particular embodiment, an electrical switch is disclosed comprising: a molded case having a pair of conductive terminal contacts; and a molded actuator for mating with the case. The actuator is movable between a conducting position and a non-conducting position within the case, and the actuator has at least one spring member and a conductive contact surface. The spring member forces the actuator into the non-conducting position, and the conductive contact surface provides an electrical connection between the pair of conductive terminal contacts when the actuator is in the conducting position. The actuator is retained within the case by a retaining member and/or a snap member. The case and the actuator are molded about the conductive terminal contacts and the spring members, respectively. Furthermore, the conductive contact surface is formed of a conductive elastomer that is grafted to the actuator. In other embodiments, the spring members are molded as a part of the actuator or the case, or the spring members are connected to the conductive contact surface or the conductive terminal contacts with the actuator and the case being molded thereabout, respectively.
摘要翻译：公开了几种不同类型的电开关。在一个具体实施例中，公开了一种电开关，包括：具有一对导电端子触点的模制壳体; 以及用于与壳体配合的模制致动器。致动器可在壳体内的导通位置和不导电位置之间移动，并且致动器具有至少一个弹簧构件和导电接触表面。弹簧构件迫使致动器进入非导通位置，并且当致动器处于导通位置时，导电接触表面在一对导电端子触点之间提供电连接。致动器通过保持构件和/或卡扣构件保持在壳体内。壳体和致动器分别围绕导电端子触点和弹簧构件模制。此外，导电接触表面由接合到致动器的导电弹性体形成。在其他实施例中，弹簧构件被模制为致动器或壳体的一部分，或者弹簧构件连接到导电接触表面，或者导电端子分别与致动器接触并且壳体在其周围模制。

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